JPS5712529A - Film carrier type semiconductor mounting device - Google Patents

Film carrier type semiconductor mounting device

Info

Publication number
JPS5712529A
JPS5712529A JP8693180A JP8693180A JPS5712529A JP S5712529 A JPS5712529 A JP S5712529A JP 8693180 A JP8693180 A JP 8693180A JP 8693180 A JP8693180 A JP 8693180A JP S5712529 A JPS5712529 A JP S5712529A
Authority
JP
Japan
Prior art keywords
guide
film
positioning
mounting device
reel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8693180A
Other languages
Japanese (ja)
Other versions
JPS5919465B2 (en
Inventor
Mitsunori Katano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP55086931A priority Critical patent/JPS5919465B2/en
Publication of JPS5712529A publication Critical patent/JPS5712529A/en
Publication of JPS5919465B2 publication Critical patent/JPS5919465B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/79—Apparatus for Tape Automated Bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Abstract

PURPOSE:To reduce in size of a device by reducing number of fine adjustment parts so that a positioning mechanism becomes smaller and simpler, by separating a film guide, which is finely moved together with resin film for positioning with a semiconductor element, from a conveying-and-positioning devise as an independent unit. CONSTITUTION:A resin film 2 is rewound to a reel 33 from a reel 27 which is applied with reverse rotating force, and at the time of conveyance, rollers 29 and 31 are operated to give tension to the film between sprockets 28 and 32, feeding distances at entry side and exit side of a guide 30 are equalized, the guide 30 conveys to the set distaqnce at all times, and the joining position is roughly decided. At this time, width-wise direction of the film 2 is restricted by a guide 62 and vacuum- sucked 65, and it moves following movement of the guide 62. When a lever 68a of a manipulator is operated, the guide 62 moves by being contracted at a constant ratio through a member 66, so that an element 3 and the film 2 are positioned. And then, it is joined by a tool 73. It is possible, by employing this mechanism, to obtain a small and simple mounting device.
JP55086931A 1980-06-25 1980-06-25 Film carrier type semiconductor mounting equipment Expired JPS5919465B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55086931A JPS5919465B2 (en) 1980-06-25 1980-06-25 Film carrier type semiconductor mounting equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55086931A JPS5919465B2 (en) 1980-06-25 1980-06-25 Film carrier type semiconductor mounting equipment

Publications (2)

Publication Number Publication Date
JPS5712529A true JPS5712529A (en) 1982-01-22
JPS5919465B2 JPS5919465B2 (en) 1984-05-07

Family

ID=13900602

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55086931A Expired JPS5919465B2 (en) 1980-06-25 1980-06-25 Film carrier type semiconductor mounting equipment

Country Status (1)

Country Link
JP (1) JPS5919465B2 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59175132A (en) * 1983-03-23 1984-10-03 Nec Corp Manufacture of semiconductor device according to tape carrier system
JPS60225440A (en) * 1984-04-23 1985-11-09 Shinkawa Ltd Positioning device for film carrier
JPS63288033A (en) * 1987-05-20 1988-11-25 Matsushita Electric Ind Co Ltd Film carrier
US5320704A (en) * 1990-11-28 1994-06-14 Tokyo Electron Limited Plasma etching apparatus
US5374327A (en) * 1992-04-28 1994-12-20 Tokyo Electron Limited Plasma processing method

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60142160U (en) * 1984-02-29 1985-09-20 日野自動車株式会社 Vacuum type servo brake device

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59175132A (en) * 1983-03-23 1984-10-03 Nec Corp Manufacture of semiconductor device according to tape carrier system
JPH0212025B2 (en) * 1983-03-23 1990-03-16 Nippon Electric Co
JPS60225440A (en) * 1984-04-23 1985-11-09 Shinkawa Ltd Positioning device for film carrier
JPH021372B2 (en) * 1984-04-23 1990-01-11 Shinkawa Kk
JPS63288033A (en) * 1987-05-20 1988-11-25 Matsushita Electric Ind Co Ltd Film carrier
JPH0793344B2 (en) * 1987-05-20 1995-10-09 松下電器産業株式会社 Film carrier
US5320704A (en) * 1990-11-28 1994-06-14 Tokyo Electron Limited Plasma etching apparatus
US5374327A (en) * 1992-04-28 1994-12-20 Tokyo Electron Limited Plasma processing method

Also Published As

Publication number Publication date
JPS5919465B2 (en) 1984-05-07

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