JPS55163856A - Apparatus for positioning semiconductor device enclosure - Google Patents

Apparatus for positioning semiconductor device enclosure

Info

Publication number
JPS55163856A
JPS55163856A JP7014679A JP7014679A JPS55163856A JP S55163856 A JPS55163856 A JP S55163856A JP 7014679 A JP7014679 A JP 7014679A JP 7014679 A JP7014679 A JP 7014679A JP S55163856 A JPS55163856 A JP S55163856A
Authority
JP
Japan
Prior art keywords
island
device enclosure
semiconductor device
confirming
corrected
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7014679A
Other languages
Japanese (ja)
Inventor
Kenji Miyajima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP7014679A priority Critical patent/JPS55163856A/en
Publication of JPS55163856A publication Critical patent/JPS55163856A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE:To accurately bond an LSI by correcting the detected position of an island of a semicondcutor device enclosure at preset position and bonding it while confirming the predetermined position with the corrected island position as reference. CONSTITUTION:The lead frame of a semiconductor device enclosure is detected by a television camera, and converted into binary. The center of the island position of the lead frame is calculated with the binary signal as the basis, an error with the central value stored in advance is calculated, the island position of the television camera is corrected with this value, and it is set as a reference. It is bonded while confirming the respective inner lead wires.
JP7014679A 1979-06-06 1979-06-06 Apparatus for positioning semiconductor device enclosure Pending JPS55163856A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7014679A JPS55163856A (en) 1979-06-06 1979-06-06 Apparatus for positioning semiconductor device enclosure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7014679A JPS55163856A (en) 1979-06-06 1979-06-06 Apparatus for positioning semiconductor device enclosure

Publications (1)

Publication Number Publication Date
JPS55163856A true JPS55163856A (en) 1980-12-20

Family

ID=13423135

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7014679A Pending JPS55163856A (en) 1979-06-06 1979-06-06 Apparatus for positioning semiconductor device enclosure

Country Status (1)

Country Link
JP (1) JPS55163856A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57132445U (en) * 1981-02-13 1982-08-18
EP0138600A2 (en) * 1983-10-13 1985-04-24 British Aerospace Public Limited Company Tool handling system for a machine tool
KR20010088635A (en) * 2001-08-14 2001-09-28 - Image process line scaning camera of lead frame inspection system

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50100983A (en) * 1973-10-29 1975-08-11
JPS5226174A (en) * 1975-08-25 1977-02-26 Hitachi Ltd Positioning unit

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50100983A (en) * 1973-10-29 1975-08-11
JPS5226174A (en) * 1975-08-25 1977-02-26 Hitachi Ltd Positioning unit

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57132445U (en) * 1981-02-13 1982-08-18
JPH0222987Y2 (en) * 1981-02-13 1990-06-21
EP0138600A2 (en) * 1983-10-13 1985-04-24 British Aerospace Public Limited Company Tool handling system for a machine tool
EP0138600B1 (en) * 1983-10-13 1991-03-20 British Aerospace Public Limited Company Tool handling system for a machine tool
KR20010088635A (en) * 2001-08-14 2001-09-28 - Image process line scaning camera of lead frame inspection system

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