JPS5678132A - Wire bonding method and device - Google Patents
Wire bonding method and deviceInfo
- Publication number
- JPS5678132A JPS5678132A JP15433979A JP15433979A JPS5678132A JP S5678132 A JPS5678132 A JP S5678132A JP 15433979 A JP15433979 A JP 15433979A JP 15433979 A JP15433979 A JP 15433979A JP S5678132 A JPS5678132 A JP S5678132A
- Authority
- JP
- Japan
- Prior art keywords
- positions
- pads
- detected
- rest
- memorized
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/1015—Shape
- H01L2924/1016—Shape being a cuboid
- H01L2924/10162—Shape being a cuboid with a square active surface
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
PURPOSE:To accurately perform the line junction for the subject wire bonding by a method wherein the positions of a pad and an inner lead of a semiconductor are detected and memorized, a part of these positions is redetected and compared with the memorized ones, and a correct positioning is performed automatically. CONSTITUTION:A semiconductor device 7 is temporarily fixed on a rest 15, the position of the inner lead 6, whereon a line junction with the positions of the pads 5a and 5b on a pellet 2 will be performed, is detected and the value of a relative position is memorized. The device 7 is shifted to and fixed on a rest 23 of an automatic bonder 22 and the positions of the pads 5a and 5b or leads 6a and 6b, which can be easily ascertained in the lead 6, are detected 20. By comparing the detected value with the memory 19, the positions of all the pads and the inner leads can be relatively found on the basis of the positions of the pads 5a, 5b and leads 6a, 6b. Based on the compared results and by controlling and shifting the rest 23 and a tool 24, the line junction 22 can be accurately performed automatically with a high working efficiency.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15433979A JPS5678132A (en) | 1979-11-30 | 1979-11-30 | Wire bonding method and device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15433979A JPS5678132A (en) | 1979-11-30 | 1979-11-30 | Wire bonding method and device |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP60212490A Division JPS61111551A (en) | 1985-09-27 | 1985-09-27 | Wire bonder |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5678132A true JPS5678132A (en) | 1981-06-26 |
Family
ID=15581982
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15433979A Pending JPS5678132A (en) | 1979-11-30 | 1979-11-30 | Wire bonding method and device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5678132A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6324833U (en) * | 1986-07-31 | 1988-02-18 | ||
US4881029A (en) * | 1985-09-30 | 1989-11-14 | Kabushiki Kaisha Toshiba | Semiconductor integrated circuit devices and methods for testing same |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5375764A (en) * | 1976-12-16 | 1978-07-05 | Nec Corp | Automatic wire bonding unit |
JPS54121672A (en) * | 1978-03-14 | 1979-09-20 | Nichiden Kikai Kk | Wire bonding device |
-
1979
- 1979-11-30 JP JP15433979A patent/JPS5678132A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5375764A (en) * | 1976-12-16 | 1978-07-05 | Nec Corp | Automatic wire bonding unit |
JPS54121672A (en) * | 1978-03-14 | 1979-09-20 | Nichiden Kikai Kk | Wire bonding device |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4881029A (en) * | 1985-09-30 | 1989-11-14 | Kabushiki Kaisha Toshiba | Semiconductor integrated circuit devices and methods for testing same |
JPS6324833U (en) * | 1986-07-31 | 1988-02-18 | ||
JPH0436111Y2 (en) * | 1986-07-31 | 1992-08-26 |
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