JPS57197845A - Lead frame for transistor - Google Patents

Lead frame for transistor

Info

Publication number
JPS57197845A
JPS57197845A JP8344081A JP8344081A JPS57197845A JP S57197845 A JPS57197845 A JP S57197845A JP 8344081 A JP8344081 A JP 8344081A JP 8344081 A JP8344081 A JP 8344081A JP S57197845 A JPS57197845 A JP S57197845A
Authority
JP
Japan
Prior art keywords
leads
sections
emitter
base
nose sections
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8344081A
Other languages
Japanese (ja)
Inventor
Kiyokazu Inoue
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
NipponDenso Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NipponDenso Co Ltd filed Critical NipponDenso Co Ltd
Priority to JP8344081A priority Critical patent/JPS57197845A/en
Publication of JPS57197845A publication Critical patent/JPS57197845A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
    • H01L23/49551—Cross section geometry characterised by bent parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To prevent the positional displacement of a semiconductor pellet due to the boiling of flux at the time of heating for soldering by forming a base lead and an emitter lead in shape that the nose sections are projected onto the upper section of the semiconductor pellet. CONSTITUTION:Collector leads 4 are disposed among the base leads 2 and the emitter leads 3, the nose sections support copper heat sinks 5, the nose sections 6, 7 of the base leads 2 and the emitter leads 3 are projected in long form, bent in L-shaped form and positioned onto electrode pads 10, 11 on transistor pellets, and the base leads and the emitter leads are positioned at locations where the noses are contacted with the electrode pads 10, 11 when the nose sections of the leads are pushed and bent from upper sections. Accordingly, when the pellets are incorporated, the noses of the lead frames can be contacted with the electrode pads only by pushing and bending the nose sections 6, 7 of the leads by applying pressure from the upper sections.
JP8344081A 1981-05-29 1981-05-29 Lead frame for transistor Pending JPS57197845A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8344081A JPS57197845A (en) 1981-05-29 1981-05-29 Lead frame for transistor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8344081A JPS57197845A (en) 1981-05-29 1981-05-29 Lead frame for transistor

Publications (1)

Publication Number Publication Date
JPS57197845A true JPS57197845A (en) 1982-12-04

Family

ID=13802479

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8344081A Pending JPS57197845A (en) 1981-05-29 1981-05-29 Lead frame for transistor

Country Status (1)

Country Link
JP (1) JPS57197845A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2570877A1 (en) * 1984-09-21 1986-03-28 Silicium Semiconducteur Ssc SEMICONDUCTOR COMPONENT MOUNTED IN A PLASTIC HOUSING AND CORRESPONDING MOUNTING METHOD
JPH04107920U (en) * 1991-02-28 1992-09-17 京セラ株式会社 Surface mount crystal unit
JP2007074901A (en) * 2005-09-09 2007-03-29 Yanmar Co Ltd Combine harvester

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2570877A1 (en) * 1984-09-21 1986-03-28 Silicium Semiconducteur Ssc SEMICONDUCTOR COMPONENT MOUNTED IN A PLASTIC HOUSING AND CORRESPONDING MOUNTING METHOD
JPH04107920U (en) * 1991-02-28 1992-09-17 京セラ株式会社 Surface mount crystal unit
JP2007074901A (en) * 2005-09-09 2007-03-29 Yanmar Co Ltd Combine harvester

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