GB928848A - Improvements in semiconductor devices - Google Patents
Improvements in semiconductor devicesInfo
- Publication number
- GB928848A GB928848A GB2771460A GB2771460A GB928848A GB 928848 A GB928848 A GB 928848A GB 2771460 A GB2771460 A GB 2771460A GB 2771460 A GB2771460 A GB 2771460A GB 928848 A GB928848 A GB 928848A
- Authority
- GB
- United Kingdom
- Prior art keywords
- branch
- lateral
- conductor
- semi
- envelope
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/041—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction having no base used as a mounting for the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
928,848. Semi-conductor devices. COMPAGNIE FRANCAISE THOMSON-HOUSTON. Aug. 10, 1960 [Aug. 10, 1959], No. 27714/60. Class 37. In a semi-conductor device, the semi-conductor element is supported on the central branch of a resilient T-shaped member, the lateral arms of which are bent and resiliently urged against the walls of the casing. Fig. 4 shows the sheet metal in its T-shaped unbent form, and Figs. 2 and 3 the elevation and plan views respectively of the final shape. A transistor 10 in Fig. 2 is shown soldered to the branch 4 of the metal sheet, the emitter electrode 11 passing through orifice 8. The lateral portions 5 and 6 are bent in the form of an S so that when the transistor and support are placed in a glass envelope 28 (Fig. 6), the portions 5 and 6 resiliently engage the inside surface. The branch 4 is secured to a conductor 24 which extends through the base of the envelope, which also contains a desiccant capsule 29. The T-piece has an irregular shaped portion 18 on lateral branch 5 to facilitate positioning of the holder in the envelope. An alternative shape is described (Figs. 7 and 8, not shown) in which the branch 4 is bent horizontally, and the two lateral members form a C rather than an S. The elements may be formed from a continuous sheet of metal consisting of a plurality of apertured T-shapes in continuous series. The lateral resilient portions assist in cooling the device by providing direct contact to the glass envelope. If a diode device is employed, this may be soldered direct to the branch 4 without having orifice 8.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR802482A FR1241796A (en) | 1959-08-10 | 1959-08-10 | Semiconductor device enhancements |
Publications (1)
Publication Number | Publication Date |
---|---|
GB928848A true GB928848A (en) | 1963-06-19 |
Family
ID=8718172
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB2771460A Expired GB928848A (en) | 1959-08-10 | 1960-08-10 | Improvements in semiconductor devices |
Country Status (2)
Country | Link |
---|---|
FR (1) | FR1241796A (en) |
GB (1) | GB928848A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3694703A (en) * | 1970-09-02 | 1972-09-26 | Staver Co Inc The | Heat dissipator for encased semiconductor device having heat tab extending therefrom |
US4610299A (en) * | 1985-04-01 | 1986-09-09 | S.I.E., Inc. | Spring-biased heat sink |
-
1959
- 1959-08-10 FR FR802482A patent/FR1241796A/en not_active Expired
-
1960
- 1960-08-10 GB GB2771460A patent/GB928848A/en not_active Expired
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3694703A (en) * | 1970-09-02 | 1972-09-26 | Staver Co Inc The | Heat dissipator for encased semiconductor device having heat tab extending therefrom |
US4610299A (en) * | 1985-04-01 | 1986-09-09 | S.I.E., Inc. | Spring-biased heat sink |
Also Published As
Publication number | Publication date |
---|---|
FR1241796A (en) | 1960-09-23 |
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