JPS5691441A - Method and device for sticking sheet to carrier jig - Google Patents

Method and device for sticking sheet to carrier jig

Info

Publication number
JPS5691441A
JPS5691441A JP16839379A JP16839379A JPS5691441A JP S5691441 A JPS5691441 A JP S5691441A JP 16839379 A JP16839379 A JP 16839379A JP 16839379 A JP16839379 A JP 16839379A JP S5691441 A JPS5691441 A JP S5691441A
Authority
JP
Japan
Prior art keywords
sheet
jig
sticking
wafer
holder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16839379A
Other languages
Japanese (ja)
Inventor
Masuzo Ikumi
Teruo Arashima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Renesas Eastern Japan Semiconductor Inc
Original Assignee
Hitachi Tokyo Electronics Co Ltd
Hitachi Ltd
Hitachi Ome Electronic Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Tokyo Electronics Co Ltd, Hitachi Ltd, Hitachi Ome Electronic Co Ltd filed Critical Hitachi Tokyo Electronics Co Ltd
Priority to JP16839379A priority Critical patent/JPS5691441A/en
Publication of JPS5691441A publication Critical patent/JPS5691441A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)

Abstract

PURPOSE:To eliminate the variation of wafer positions when sticking a wafer sticking sheet to a wafer supporting jig used for pellet bonding by sticking the sheet to the jig and cutting it while extending uniformly the sheet spread apart from the jig. CONSTITUTION:A carrier jig 7 is fixed to a base 12 with a holder 13. A rolled sheet 9 is spread above the jig with its pasted surface downwards. Then a sheet clamping member 19 is moved down to fix the sheet 9 pressing it against the surface of the holder 13. Next, a piston 21 is moved down and deforms the sheet 9 while extending downwards, presses it against the carrier jig 7 and sticks them. And by turning a cutter 25, the sheet is cut at a position between the piston 21 and the holder 13. By so doing, the sticking sheet can be sticked to the jig in a state extended uniformly and the variation of the position of a wafer sticked to the sheet can be prevented, so that pellet bonding can be carried out easily and accurately.
JP16839379A 1979-12-26 1979-12-26 Method and device for sticking sheet to carrier jig Pending JPS5691441A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16839379A JPS5691441A (en) 1979-12-26 1979-12-26 Method and device for sticking sheet to carrier jig

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16839379A JPS5691441A (en) 1979-12-26 1979-12-26 Method and device for sticking sheet to carrier jig

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP22679885A Division JPS61123149A (en) 1985-10-14 1985-10-14 Carrier jig sheet attaching apparatus

Publications (1)

Publication Number Publication Date
JPS5691441A true JPS5691441A (en) 1981-07-24

Family

ID=15867274

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16839379A Pending JPS5691441A (en) 1979-12-26 1979-12-26 Method and device for sticking sheet to carrier jig

Country Status (1)

Country Link
JP (1) JPS5691441A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5729357A (en) * 1980-06-13 1982-02-17 Nattermann A & Cie Method of filling product containing phosphatide into hard capsule
JPS6127652A (en) * 1984-07-18 1986-02-07 Shinkawa Ltd Wafer positioning device
JPS61123149A (en) * 1985-10-14 1986-06-11 Hitachi Ltd Carrier jig sheet attaching apparatus
JPS62219650A (en) * 1986-03-20 1987-09-26 Fujitsu Ltd Tape disposing device
CN113023357A (en) * 2021-04-14 2021-06-25 湖南三安半导体有限责任公司 Pasting device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4914781A (en) * 1972-06-06 1974-02-08

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4914781A (en) * 1972-06-06 1974-02-08

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5729357A (en) * 1980-06-13 1982-02-17 Nattermann A & Cie Method of filling product containing phosphatide into hard capsule
JPS6127652A (en) * 1984-07-18 1986-02-07 Shinkawa Ltd Wafer positioning device
JPS61123149A (en) * 1985-10-14 1986-06-11 Hitachi Ltd Carrier jig sheet attaching apparatus
JPS62219650A (en) * 1986-03-20 1987-09-26 Fujitsu Ltd Tape disposing device
JPH0553061B2 (en) * 1986-03-20 1993-08-09 Fujitsu Ltd
CN113023357A (en) * 2021-04-14 2021-06-25 湖南三安半导体有限责任公司 Pasting device
CN113023357B (en) * 2021-04-14 2022-06-07 湖南三安半导体有限责任公司 Pasting device

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