JPS5691441A - Method and device for sticking sheet to carrier jig - Google Patents
Method and device for sticking sheet to carrier jigInfo
- Publication number
- JPS5691441A JPS5691441A JP16839379A JP16839379A JPS5691441A JP S5691441 A JPS5691441 A JP S5691441A JP 16839379 A JP16839379 A JP 16839379A JP 16839379 A JP16839379 A JP 16839379A JP S5691441 A JPS5691441 A JP S5691441A
- Authority
- JP
- Japan
- Prior art keywords
- sheet
- jig
- sticking
- wafer
- holder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Abstract
PURPOSE:To eliminate the variation of wafer positions when sticking a wafer sticking sheet to a wafer supporting jig used for pellet bonding by sticking the sheet to the jig and cutting it while extending uniformly the sheet spread apart from the jig. CONSTITUTION:A carrier jig 7 is fixed to a base 12 with a holder 13. A rolled sheet 9 is spread above the jig with its pasted surface downwards. Then a sheet clamping member 19 is moved down to fix the sheet 9 pressing it against the surface of the holder 13. Next, a piston 21 is moved down and deforms the sheet 9 while extending downwards, presses it against the carrier jig 7 and sticks them. And by turning a cutter 25, the sheet is cut at a position between the piston 21 and the holder 13. By so doing, the sticking sheet can be sticked to the jig in a state extended uniformly and the variation of the position of a wafer sticked to the sheet can be prevented, so that pellet bonding can be carried out easily and accurately.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16839379A JPS5691441A (en) | 1979-12-26 | 1979-12-26 | Method and device for sticking sheet to carrier jig |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16839379A JPS5691441A (en) | 1979-12-26 | 1979-12-26 | Method and device for sticking sheet to carrier jig |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP22679885A Division JPS61123149A (en) | 1985-10-14 | 1985-10-14 | Carrier jig sheet attaching apparatus |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5691441A true JPS5691441A (en) | 1981-07-24 |
Family
ID=15867274
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16839379A Pending JPS5691441A (en) | 1979-12-26 | 1979-12-26 | Method and device for sticking sheet to carrier jig |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5691441A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5729357A (en) * | 1980-06-13 | 1982-02-17 | Nattermann A & Cie | Method of filling product containing phosphatide into hard capsule |
JPS6127652A (en) * | 1984-07-18 | 1986-02-07 | Shinkawa Ltd | Wafer positioning device |
JPS61123149A (en) * | 1985-10-14 | 1986-06-11 | Hitachi Ltd | Carrier jig sheet attaching apparatus |
JPS62219650A (en) * | 1986-03-20 | 1987-09-26 | Fujitsu Ltd | Tape disposing device |
CN113023357A (en) * | 2021-04-14 | 2021-06-25 | 湖南三安半导体有限责任公司 | Pasting device |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4914781A (en) * | 1972-06-06 | 1974-02-08 |
-
1979
- 1979-12-26 JP JP16839379A patent/JPS5691441A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4914781A (en) * | 1972-06-06 | 1974-02-08 |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5729357A (en) * | 1980-06-13 | 1982-02-17 | Nattermann A & Cie | Method of filling product containing phosphatide into hard capsule |
JPS6127652A (en) * | 1984-07-18 | 1986-02-07 | Shinkawa Ltd | Wafer positioning device |
JPS61123149A (en) * | 1985-10-14 | 1986-06-11 | Hitachi Ltd | Carrier jig sheet attaching apparatus |
JPS62219650A (en) * | 1986-03-20 | 1987-09-26 | Fujitsu Ltd | Tape disposing device |
JPH0553061B2 (en) * | 1986-03-20 | 1993-08-09 | Fujitsu Ltd | |
CN113023357A (en) * | 2021-04-14 | 2021-06-25 | 湖南三安半导体有限责任公司 | Pasting device |
CN113023357B (en) * | 2021-04-14 | 2022-06-07 | 湖南三安半导体有限责任公司 | Pasting device |
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