JPS5443678A - Semiconductor element bonding method and its bonding unit - Google Patents

Semiconductor element bonding method and its bonding unit

Info

Publication number
JPS5443678A
JPS5443678A JP11074377A JP11074377A JPS5443678A JP S5443678 A JPS5443678 A JP S5443678A JP 11074377 A JP11074377 A JP 11074377A JP 11074377 A JP11074377 A JP 11074377A JP S5443678 A JPS5443678 A JP S5443678A
Authority
JP
Japan
Prior art keywords
stand
tool
adsorbing
bonding
finger
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11074377A
Other languages
Japanese (ja)
Other versions
JPS5751974B2 (en
Inventor
Yutaka Makino
Takeo Takayanagi
Hiroshi Isoya
Takashi Masamoto
Hikari Fujita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP11074377A priority Critical patent/JPS5443678A/en
Publication of JPS5443678A publication Critical patent/JPS5443678A/en
Publication of JPS5751974B2 publication Critical patent/JPS5751974B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE: To rationalize the work by moving semiconductor elements, which are stored in a tray, onto a vacuum adsorbing stand one by one and inserting a carrier tape between the adsorbing stand and a tool while positioning the carrier tape under the thermo compression bonding tool and pressing down the tool to perform the bonding of element pads and the tape finger.
CONSTITUTION: Semiconductor elements 13 which are stored in semiconductor element strage frame 12 provided in tray 11 are carried one by one onto vacuum adsorbing stand 15 of vauum adsorbing stand positioning device 14. Next, this adsorbing stand 15 is positioned just under thermo compression bonding tool 17 provided in thermo compression bonding unit 16, and is moved or rotated in the horizontal XY-axis direction by manual work. Thus, the bump of element 13 and the wiring finger of carrier tape 18 inserted between adsorbing stand 15 and tool 17 are positioned, and adsorbing stand 15 is raised to bring the bump and the finger into contact with each other. After that, tool 17 is caused to descend, and the current is flown to tool 17, thereby completing bonding.
COPYRIGHT: (C)1979,JPO&Japio
JP11074377A 1977-09-13 1977-09-13 Semiconductor element bonding method and its bonding unit Granted JPS5443678A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11074377A JPS5443678A (en) 1977-09-13 1977-09-13 Semiconductor element bonding method and its bonding unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11074377A JPS5443678A (en) 1977-09-13 1977-09-13 Semiconductor element bonding method and its bonding unit

Publications (2)

Publication Number Publication Date
JPS5443678A true JPS5443678A (en) 1979-04-06
JPS5751974B2 JPS5751974B2 (en) 1982-11-05

Family

ID=14543396

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11074377A Granted JPS5443678A (en) 1977-09-13 1977-09-13 Semiconductor element bonding method and its bonding unit

Country Status (1)

Country Link
JP (1) JPS5443678A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58165335A (en) * 1982-03-26 1983-09-30 Nec Corp Method and apparatus for manufacturing semiconductor device using tape carrier system
JPS59175132A (en) * 1983-03-23 1984-10-03 Nec Corp Manufacture of semiconductor device according to tape carrier system

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58165335A (en) * 1982-03-26 1983-09-30 Nec Corp Method and apparatus for manufacturing semiconductor device using tape carrier system
JPH0131694B2 (en) * 1982-03-26 1989-06-27 Nippon Electric Co
JPS59175132A (en) * 1983-03-23 1984-10-03 Nec Corp Manufacture of semiconductor device according to tape carrier system
JPH0212025B2 (en) * 1983-03-23 1990-03-16 Nippon Electric Co

Also Published As

Publication number Publication date
JPS5751974B2 (en) 1982-11-05

Similar Documents

Publication Publication Date Title
JPS53108763A (en) Device for polishing semiconductor wafer
DE2961692D1 (en) Method and device for testing sequential circuits realized by monolithic integrated semiconductor circuits
JPS5519900A (en) Method of manufacturing composite tape with bump for automatically bonding semiconductor device
DE3379621D1 (en) Semiconductor integrated circuit device and a method for manufacturing the same
EP0388011A3 (en) Semiconductor device utilizing a face-down bonding and a method for manufacturing the same
AU499549B2 (en) Method for fabricating a semiconductor device
GB2010580B (en) Method for manufacturing a semiconductor device
JPS5443678A (en) Semiconductor element bonding method and its bonding unit
JPS5210069A (en) Automatic apparatus for cleaning and drying wafer
DE3165345D1 (en) Method for manufacturing a semiconductor integrated circuit device
JPS5434774A (en) Article transfer device
JPS53104168A (en) Semiconductor pellet bonding method
JPS5543900A (en) Apparatus for manufacturing semiconductor device
GB2006522B (en) Wafers having microelectronic circuit chips thereon
JPS5240063A (en) Lead frame
JPS533165A (en) Wire bonding apparatus
JPS5691441A (en) Method and device for sticking sheet to carrier jig
JPS5390871A (en) Device for chucking semiconductor wafer
DE2961197D1 (en) Method and device for manufacturing an intermediate mounting element for semiconductor chips
JPS5483375A (en) Bonding of flip-chip integrated circuit
JPS5759341A (en) Automatic bonding method for device
JPS5389654A (en) Cutting method of semiconductor device
JPS53142291A (en) Beam lead strenght measuring apparatus
JPS53145570A (en) Die bonding method of semiconductor device
JPS5358764A (en) Bonding method of flip chip