JPS5759341A - Automatic bonding method for device - Google Patents

Automatic bonding method for device

Info

Publication number
JPS5759341A
JPS5759341A JP55134839A JP13483980A JPS5759341A JP S5759341 A JPS5759341 A JP S5759341A JP 55134839 A JP55134839 A JP 55134839A JP 13483980 A JP13483980 A JP 13483980A JP S5759341 A JPS5759341 A JP S5759341A
Authority
JP
Japan
Prior art keywords
devices
wiring substrate
tapes
inspected
coded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP55134839A
Other languages
Japanese (ja)
Other versions
JPS6216540B2 (en
Inventor
Yuichi Yoshida
Yuji Matsuda
Masaru Iwasaki
Takashi Nukui
Shigeo Nakatake
Katsuteru Awane
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP55134839A priority Critical patent/JPS5759341A/en
Publication of JPS5759341A publication Critical patent/JPS5759341A/en
Publication of JPS6216540B2 publication Critical patent/JPS6216540B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/79—Apparatus for Tape Automated Bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To unitilize the device effectively by a method wherein the separate characteristic of the device supported to a tape is inspected, the characteristics are coded, the code is read and the device is bonded onto a wiring substrate according to the combination of the characteristics set previously. CONSTITUTION:The devices are mounted to the respective flexible tapes 1, 2, 3 in response to the arrangement of electrode pads at every semiconductor chip A, B, C, the tapes are each wound on reels 4, 5, 6, the characteristics are inspected through a function inspection process 7, the devices are classified according to the characteristics, the characteristics are coded, and the devices advance to a bonding process. The codes are read by means of a code reading device 24, the wiring substrate 22 is forwarded onto a table 21 from a magazine 23, the chips are separated from the tapes by means of a chip holder 26 at a chip bonding position P, the devices go forward to a bonding tool 28, and the leads of the chips are bonded onto the wiring substrate 22 through pressing.
JP55134839A 1980-09-26 1980-09-26 Automatic bonding method for device Granted JPS5759341A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55134839A JPS5759341A (en) 1980-09-26 1980-09-26 Automatic bonding method for device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55134839A JPS5759341A (en) 1980-09-26 1980-09-26 Automatic bonding method for device

Publications (2)

Publication Number Publication Date
JPS5759341A true JPS5759341A (en) 1982-04-09
JPS6216540B2 JPS6216540B2 (en) 1987-04-13

Family

ID=15137662

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55134839A Granted JPS5759341A (en) 1980-09-26 1980-09-26 Automatic bonding method for device

Country Status (1)

Country Link
JP (1) JPS5759341A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63173670A (en) * 1987-01-13 1988-07-18 Alps Electric Co Ltd Light-emitting diode array head and manufacture thereof
US5542600A (en) * 1991-11-07 1996-08-06 Omron Corporation Automatic soldering apparatus, apparatus and method for teaching same, soldering inspection apparatus and method, and apparatus and method for automatically correcting soldering

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63173670A (en) * 1987-01-13 1988-07-18 Alps Electric Co Ltd Light-emitting diode array head and manufacture thereof
US5542600A (en) * 1991-11-07 1996-08-06 Omron Corporation Automatic soldering apparatus, apparatus and method for teaching same, soldering inspection apparatus and method, and apparatus and method for automatically correcting soldering

Also Published As

Publication number Publication date
JPS6216540B2 (en) 1987-04-13

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