JPS5390871A - Device for chucking semiconductor wafer - Google Patents

Device for chucking semiconductor wafer

Info

Publication number
JPS5390871A
JPS5390871A JP617977A JP617977A JPS5390871A JP S5390871 A JPS5390871 A JP S5390871A JP 617977 A JP617977 A JP 617977A JP 617977 A JP617977 A JP 617977A JP S5390871 A JPS5390871 A JP S5390871A
Authority
JP
Japan
Prior art keywords
semiconductor wafer
chucking
chucking semiconductor
wafer
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP617977A
Other languages
Japanese (ja)
Inventor
Yoshikatsu Miyake
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TOYO DENGU SEISAKUSHIYO KK
Original Assignee
TOYO DENGU SEISAKUSHIYO KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TOYO DENGU SEISAKUSHIYO KK filed Critical TOYO DENGU SEISAKUSHIYO KK
Priority to JP617977A priority Critical patent/JPS5390871A/en
Publication of JPS5390871A publication Critical patent/JPS5390871A/en
Pending legal-status Critical Current

Links

Landscapes

  • Mechanical Treatment Of Semiconductor (AREA)
JP617977A 1977-01-21 1977-01-21 Device for chucking semiconductor wafer Pending JPS5390871A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP617977A JPS5390871A (en) 1977-01-21 1977-01-21 Device for chucking semiconductor wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP617977A JPS5390871A (en) 1977-01-21 1977-01-21 Device for chucking semiconductor wafer

Publications (1)

Publication Number Publication Date
JPS5390871A true JPS5390871A (en) 1978-08-10

Family

ID=11631313

Family Applications (1)

Application Number Title Priority Date Filing Date
JP617977A Pending JPS5390871A (en) 1977-01-21 1977-01-21 Device for chucking semiconductor wafer

Country Status (1)

Country Link
JP (1) JPS5390871A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5599741A (en) * 1979-01-26 1980-07-30 Hitachi Ltd Affixing method of article onto adhesive tape
JPS594045A (en) * 1982-06-30 1984-01-10 Fujitsu Ltd Vacuum attracting and fixing means
JP2014128849A (en) * 2012-12-28 2014-07-10 Taiheiyo Cement Corp Vacuum suction device and method of manufacturing the same
CN105645103A (en) * 2016-01-20 2016-06-08 山东工业陶瓷研究设计院有限公司 Slab ceramic membrane green body transfer device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50152671A (en) * 1974-05-28 1975-12-08

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50152671A (en) * 1974-05-28 1975-12-08

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5599741A (en) * 1979-01-26 1980-07-30 Hitachi Ltd Affixing method of article onto adhesive tape
JPS594045A (en) * 1982-06-30 1984-01-10 Fujitsu Ltd Vacuum attracting and fixing means
JPS634938B2 (en) * 1982-06-30 1988-02-01 Fujitsu Ltd
JP2014128849A (en) * 2012-12-28 2014-07-10 Taiheiyo Cement Corp Vacuum suction device and method of manufacturing the same
CN105645103A (en) * 2016-01-20 2016-06-08 山东工业陶瓷研究设计院有限公司 Slab ceramic membrane green body transfer device

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