JPS5599741A - Affixing method of article onto adhesive tape - Google Patents
Affixing method of article onto adhesive tapeInfo
- Publication number
- JPS5599741A JPS5599741A JP708579A JP708579A JPS5599741A JP S5599741 A JPS5599741 A JP S5599741A JP 708579 A JP708579 A JP 708579A JP 708579 A JP708579 A JP 708579A JP S5599741 A JPS5599741 A JP S5599741A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive tape
- article
- affix
- articles
- adherent surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
PURPOSE: To affix articles onto adhesive tape without damaging articles, by vacuum absorbing of article from reverse side of adherent surface of adhesive tape, and affix.
CONSTITUTION: Plural fine penetrating holes 4b are made on adhesive tape by means of treatment with electric discharge, etc. Then, on adherent surface 4a of tape 4, article, for example semiconductor wafer 1 is placed. Adhesive tape 4 on which wafers 1 is placed, is positioned on receptacle 6, containing porous material 5 in it, and then absorb articles by vacuum through hole 7 provided underneath of receptacle 6. Resulted by this performance, semiconductor wafer 1 is firmly adhered to adherent surface 4a and is affixed. It is possible to affix without touching on the main surface of the article.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP708579A JPS5599741A (en) | 1979-01-26 | 1979-01-26 | Affixing method of article onto adhesive tape |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP708579A JPS5599741A (en) | 1979-01-26 | 1979-01-26 | Affixing method of article onto adhesive tape |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5599741A true JPS5599741A (en) | 1980-07-30 |
JPS644339B2 JPS644339B2 (en) | 1989-01-25 |
Family
ID=11656244
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP708579A Granted JPS5599741A (en) | 1979-01-26 | 1979-01-26 | Affixing method of article onto adhesive tape |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5599741A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58115833A (en) * | 1981-12-28 | 1983-07-09 | Sony Corp | Division of wafer |
JPS59152639A (en) * | 1983-02-21 | 1984-08-31 | Nec Home Electronics Ltd | Method for provisional fixing of semiconductor wafer |
JPS61222146A (en) * | 1985-02-12 | 1986-10-02 | Matsushita Electronics Corp | Sheet for supporting semiconductor wafer |
CN110767612A (en) * | 2018-07-27 | 2020-02-07 | 奇景光电股份有限公司 | Bonding structure and bonding method |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4958773A (en) * | 1972-10-04 | 1974-06-07 | ||
JPS5318969A (en) * | 1976-08-06 | 1978-02-21 | Nippon Telegr & Teleph Corp <Ntt> | Wafer fixing method |
JPS5390871A (en) * | 1977-01-21 | 1978-08-10 | Toyo Dengu Seisakushiyo Kk | Device for chucking semiconductor wafer |
-
1979
- 1979-01-26 JP JP708579A patent/JPS5599741A/en active Granted
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4958773A (en) * | 1972-10-04 | 1974-06-07 | ||
JPS5318969A (en) * | 1976-08-06 | 1978-02-21 | Nippon Telegr & Teleph Corp <Ntt> | Wafer fixing method |
JPS5390871A (en) * | 1977-01-21 | 1978-08-10 | Toyo Dengu Seisakushiyo Kk | Device for chucking semiconductor wafer |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58115833A (en) * | 1981-12-28 | 1983-07-09 | Sony Corp | Division of wafer |
JPH0318343B2 (en) * | 1981-12-28 | 1991-03-12 | Sony Corp | |
JPS59152639A (en) * | 1983-02-21 | 1984-08-31 | Nec Home Electronics Ltd | Method for provisional fixing of semiconductor wafer |
JPS61222146A (en) * | 1985-02-12 | 1986-10-02 | Matsushita Electronics Corp | Sheet for supporting semiconductor wafer |
CN110767612A (en) * | 2018-07-27 | 2020-02-07 | 奇景光电股份有限公司 | Bonding structure and bonding method |
CN110767612B (en) * | 2018-07-27 | 2021-06-18 | 奇景光电股份有限公司 | Bonding structure and bonding method |
Also Published As
Publication number | Publication date |
---|---|
JPS644339B2 (en) | 1989-01-25 |
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