JPS51140478A - Lead frame - Google Patents

Lead frame

Info

Publication number
JPS51140478A
JPS51140478A JP50064197A JP6419775A JPS51140478A JP S51140478 A JPS51140478 A JP S51140478A JP 50064197 A JP50064197 A JP 50064197A JP 6419775 A JP6419775 A JP 6419775A JP S51140478 A JPS51140478 A JP S51140478A
Authority
JP
Japan
Prior art keywords
lead frame
improve
rigid
yield
leads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50064197A
Other languages
Japanese (ja)
Inventor
Seishiro Owaki
Michio Tanimoto
Shunichiro Fujioka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP50064197A priority Critical patent/JPS51140478A/en
Publication of JPS51140478A publication Critical patent/JPS51140478A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To improve the accuracy of relative position between a semiconductor element and leads by assembling semiconductor device using lead frame being rigid and flat to improve the yield of automatic wire bonding work.
JP50064197A 1975-05-30 1975-05-30 Lead frame Pending JPS51140478A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50064197A JPS51140478A (en) 1975-05-30 1975-05-30 Lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50064197A JPS51140478A (en) 1975-05-30 1975-05-30 Lead frame

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP10166376A Division JPS5252370A (en) 1976-08-27 1976-08-27 Fabrication of glass-sealed semiconductor device

Publications (1)

Publication Number Publication Date
JPS51140478A true JPS51140478A (en) 1976-12-03

Family

ID=13251091

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50064197A Pending JPS51140478A (en) 1975-05-30 1975-05-30 Lead frame

Country Status (1)

Country Link
JP (1) JPS51140478A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5390868A (en) * 1977-01-21 1978-08-10 Hitachi Ltd Semiconductor device of glass ceramic package type
JPS5867055A (en) * 1981-10-19 1983-04-21 Toshiba Corp Lead frame for semiconductor device
JPS5867056A (en) * 1981-10-19 1983-04-21 Toshiba Corp Lead frame for semiconductor device
JPS58115842A (en) * 1981-12-28 1983-07-09 Fujitsu Ltd Semiconductor device
JPS60143654A (en) * 1983-12-29 1985-07-29 Matsushita Electric Ind Co Ltd Electronic parts

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4844466U (en) * 1971-09-30 1973-06-09

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4844466U (en) * 1971-09-30 1973-06-09

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5390868A (en) * 1977-01-21 1978-08-10 Hitachi Ltd Semiconductor device of glass ceramic package type
JPS5867055A (en) * 1981-10-19 1983-04-21 Toshiba Corp Lead frame for semiconductor device
JPS5867056A (en) * 1981-10-19 1983-04-21 Toshiba Corp Lead frame for semiconductor device
JPS58115842A (en) * 1981-12-28 1983-07-09 Fujitsu Ltd Semiconductor device
JPS60143654A (en) * 1983-12-29 1985-07-29 Matsushita Electric Ind Co Ltd Electronic parts

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