JPS5332672A - Lead frame for semiconductor device - Google Patents

Lead frame for semiconductor device

Info

Publication number
JPS5332672A
JPS5332672A JP10739176A JP10739176A JPS5332672A JP S5332672 A JPS5332672 A JP S5332672A JP 10739176 A JP10739176 A JP 10739176A JP 10739176 A JP10739176 A JP 10739176A JP S5332672 A JPS5332672 A JP S5332672A
Authority
JP
Japan
Prior art keywords
lead frame
semiconductor device
substrate
stress
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10739176A
Other languages
Japanese (ja)
Inventor
Hiroyuki Matsumoto
Tokumichi Tamai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp filed Critical Matsushita Electronics Corp
Priority to JP10739176A priority Critical patent/JPS5332672A/en
Publication of JPS5332672A publication Critical patent/JPS5332672A/en
Pending legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To effectively remove the stress being applied to a substrate at the time or after bonding of the substrate by providing holes at the substrate mounting part of a lead frame.
JP10739176A 1976-09-07 1976-09-07 Lead frame for semiconductor device Pending JPS5332672A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10739176A JPS5332672A (en) 1976-09-07 1976-09-07 Lead frame for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10739176A JPS5332672A (en) 1976-09-07 1976-09-07 Lead frame for semiconductor device

Publications (1)

Publication Number Publication Date
JPS5332672A true JPS5332672A (en) 1978-03-28

Family

ID=14457935

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10739176A Pending JPS5332672A (en) 1976-09-07 1976-09-07 Lead frame for semiconductor device

Country Status (1)

Country Link
JP (1) JPS5332672A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS554983A (en) * 1978-06-27 1980-01-14 Nec Kyushu Ltd Lead frame for semiconductor device
JPS57133655A (en) * 1981-02-10 1982-08-18 Pioneer Electronic Corp Lead frame
JPS62153280A (en) * 1985-12-25 1987-07-08 Dainippon Pharmaceut Co Ltd 1,4-diazacycloalkane derivative
JPS63224245A (en) * 1987-03-13 1988-09-19 Hitachi Ltd Lead frame and semiconductor device
USRE37690E1 (en) 1987-02-25 2002-05-07 Hitachi, Ltd. Lead frame and semiconductor device
EP4156247A3 (en) * 2021-09-07 2023-06-14 Hitachi Power Semiconductor Device, Ltd. Semiconductor device with a semiconductor chip bonded between a first, plate-shaped electrode with a groove and a second electrode

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS554983A (en) * 1978-06-27 1980-01-14 Nec Kyushu Ltd Lead frame for semiconductor device
JPS57133655A (en) * 1981-02-10 1982-08-18 Pioneer Electronic Corp Lead frame
JPS62153280A (en) * 1985-12-25 1987-07-08 Dainippon Pharmaceut Co Ltd 1,4-diazacycloalkane derivative
JPH0645600B2 (en) * 1985-12-25 1994-06-15 大日本製薬株式会社 1,4-diazacycloalkane derivative
USRE37690E1 (en) 1987-02-25 2002-05-07 Hitachi, Ltd. Lead frame and semiconductor device
JPS63224245A (en) * 1987-03-13 1988-09-19 Hitachi Ltd Lead frame and semiconductor device
EP4156247A3 (en) * 2021-09-07 2023-06-14 Hitachi Power Semiconductor Device, Ltd. Semiconductor device with a semiconductor chip bonded between a first, plate-shaped electrode with a groove and a second electrode

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