JPS554983A - Lead frame for semiconductor device - Google Patents

Lead frame for semiconductor device

Info

Publication number
JPS554983A
JPS554983A JP7838978A JP7838978A JPS554983A JP S554983 A JPS554983 A JP S554983A JP 7838978 A JP7838978 A JP 7838978A JP 7838978 A JP7838978 A JP 7838978A JP S554983 A JPS554983 A JP S554983A
Authority
JP
Japan
Prior art keywords
island
elements
lead frame
semiconductor elements
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7838978A
Other languages
Japanese (ja)
Inventor
Nobutaka Nagamine
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Kyushu Ltd
Original Assignee
NEC Kyushu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Kyushu Ltd filed Critical NEC Kyushu Ltd
Priority to JP7838978A priority Critical patent/JPS554983A/en
Publication of JPS554983A publication Critical patent/JPS554983A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49503—Lead-frames or other flat leads characterised by the die pad
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/83385—Shape, e.g. interlocking features

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To relax the stress due to the thermal expansion difference between a frame and elements and prevent breakdown in the elements, by providing partial cuts on the island of a lead frame which is provided with an island on which semiconductor elements are mounted and a plurality of external leads. CONSTITUTION:Cross-shaped cut 12 is provided on island 11, for mounting semiconductor elements, of a lead frame having a plurality of leads. by this, when the stress due to the thermal expansion difference produced when semiconductor elements are fixed on island 11 becomes l1/l, where l represents the width of the island and l1 represents the distance from the cut part to the outer edge. Since this stress is applied to the elements, they are prevented from breakdown. Also, cuts 22 and 23 parallel to the island, instead of the corss-shaped cut, may be used.
JP7838978A 1978-06-27 1978-06-27 Lead frame for semiconductor device Pending JPS554983A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7838978A JPS554983A (en) 1978-06-27 1978-06-27 Lead frame for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7838978A JPS554983A (en) 1978-06-27 1978-06-27 Lead frame for semiconductor device

Publications (1)

Publication Number Publication Date
JPS554983A true JPS554983A (en) 1980-01-14

Family

ID=13660654

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7838978A Pending JPS554983A (en) 1978-06-27 1978-06-27 Lead frame for semiconductor device

Country Status (1)

Country Link
JP (1) JPS554983A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56104459A (en) * 1980-01-25 1981-08-20 Hitachi Ltd Semiconductor device
JPS57133655A (en) * 1981-02-10 1982-08-18 Pioneer Electronic Corp Lead frame
JPS6350049A (en) * 1986-08-19 1988-03-02 Mitsubishi Electric Corp Resin sealed type semiconductor device
JPH02125651A (en) * 1988-11-04 1990-05-14 Nec Corp Lead frame
JPH0487655U (en) * 1990-11-19 1992-07-30
EP0724294A3 (en) * 1995-01-25 1998-09-02 Nec Corporation Semiconductor device mounted on tub having central slit pattern and peripheral slit pattern for absorbing thermal stress
EP4156247A3 (en) * 2021-09-07 2023-06-14 Hitachi Power Semiconductor Device, Ltd. Semiconductor device with a semiconductor chip bonded between a first, plate-shaped electrode with a groove and a second electrode

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS497861A (en) * 1972-05-12 1974-01-24
JPS5332672A (en) * 1976-09-07 1978-03-28 Matsushita Electronics Corp Lead frame for semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS497861A (en) * 1972-05-12 1974-01-24
JPS5332672A (en) * 1976-09-07 1978-03-28 Matsushita Electronics Corp Lead frame for semiconductor device

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56104459A (en) * 1980-01-25 1981-08-20 Hitachi Ltd Semiconductor device
JPS57133655A (en) * 1981-02-10 1982-08-18 Pioneer Electronic Corp Lead frame
JPS6350049A (en) * 1986-08-19 1988-03-02 Mitsubishi Electric Corp Resin sealed type semiconductor device
JPH0579173B2 (en) * 1986-08-19 1993-11-01 Mitsubishi Electric Corp
JPH02125651A (en) * 1988-11-04 1990-05-14 Nec Corp Lead frame
JPH0487655U (en) * 1990-11-19 1992-07-30
JP2527803Y2 (en) * 1990-11-19 1997-03-05 サンケン電気株式会社 Lead frame for resin-sealed electronic components
EP0724294A3 (en) * 1995-01-25 1998-09-02 Nec Corporation Semiconductor device mounted on tub having central slit pattern and peripheral slit pattern for absorbing thermal stress
EP4156247A3 (en) * 2021-09-07 2023-06-14 Hitachi Power Semiconductor Device, Ltd. Semiconductor device with a semiconductor chip bonded between a first, plate-shaped electrode with a groove and a second electrode
TWI823480B (en) * 2021-09-07 2023-11-21 日商日立功率半導體股份有限公司 Semiconductor device

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