KR20010088635A - Image process line scaning camera of lead frame inspection system - Google Patents

Image process line scaning camera of lead frame inspection system Download PDF

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Publication number
KR20010088635A
KR20010088635A KR1020010049180A KR20010049180A KR20010088635A KR 20010088635 A KR20010088635 A KR 20010088635A KR 1020010049180 A KR1020010049180 A KR 1020010049180A KR 20010049180 A KR20010049180 A KR 20010049180A KR 20010088635 A KR20010088635 A KR 20010088635A
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South Korea
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lead frame
image
feeder
inspection
feed
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KR1020010049180A
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Korean (ko)
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박찬홍
감연규
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-
성우테크론 주식회사
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Length Measuring Devices By Optical Means (AREA)

Abstract

PURPOSE: A method for testing a leadframe by a photography method using a line scanning camera is provided to improve test precision by determining test regions of various sizes and classifying the test regions into smaller regions, and to increase test speed by building a program regarding an inspection, continuous photography and a test method. CONSTITUTION: Image pictures of a 1 unit of a semiconductor leadframe are taken a lot of times regarding line scanning photolithography and an image assembly of a subject of the leadframe in the order of D,E,F,G and H shown in figure 7, using a line scanning camera. The pictured image information is transferred to an algorithm inside an image information processing apparatus according to the order in which the image information is pictured, so that a block image is assembled to one unit. The compound image of the subject is tested as compared with a reference value of a predetermined master image. If the compound image falls within the number of reference pixels, the leadframe is a good product. If the compound image gets out of the number of the reference pixels, the leadframe is defective.

Description

라인스캔닝카메라 촬영법에 의한 리드프레임 검사방법{ IMAGE PROCESS LINE SCANING CAMERA OF LEAD FRAME INSPECTION SYSTEM }Lead frame inspection method by line scanning camera photography {IMAGE PROCESS LINE SCANING CAMERA OF LEAD FRAME INSPECTION SYSTEM}

본 발명은 반도체 리드프레임(1)의 외관상 결함요소 및 리드의 형상에 대한 제품 검사를 하는 방법에 관한 것이다.The present invention relates to a method of inspecting a product for appearance defects of the semiconductor lead frame 1 and the shape of the leads.

기존의 리드프레임(1) 검사기술은 단순육안검사 또는 공구 현미경 검사로 행하여지다가 점차적으로 자동화시스템에 의한 에리어 촬영법을 도입하게되었고 이러한 촬영법에 의한 검사방법으 로서는 광폭의 리드배열식 제품에 대해서는 검사 영역설정의 한계에 도달하게 되었으며 검사 속도에 있어서도 1회 촬영으로 1유니트(2)에 해당하는 영상검사자료(7-1)만 영상정보처리장치 (3)로 전송되고 그 전송된 정보가 마스터 영상(29)과 비교측정 되는 동안 리드프레임(1)의 검사공정은 정지되어 있어야했다.Conventional lead frame (1) inspection technology is performed by simple visual inspection or tool microscopy, and gradually adopts the area photographing method by an automated system. The limit of setting has been reached, and even in the inspection speed, only one image inspection data (7-1) corresponding to one unit (2) is transmitted to the image information processing apparatus (3) in one shot. 29) The inspection process of the leadframe 1 had to be stopped during the measurement.

그리고 종래의 에리어 카메라의 촬영에 있어서는 1유니트(2)의 넓은 영역을 1회 촬영하므로서 카메라의 고해상도 성능과 렌즈의 규격이 정방형이므로 광폭의 리드프레임을 대상으로 한 검사범위에 대하여 검사성능과 효율성을 기대할 수 없는 현상이다.In the conventional area camera shooting, a large area of one unit (2) is photographed once, so that the high resolution performance of the camera and the size of the lens are square. Therefore, the inspection performance and efficiency of the inspection area for the wide lead frame can be improved. This is not expected.

본 발명의 목적은 리드프레임의 검사방법에 있어서 1유니트의 전면을 한번에촬영하고 한번에 분석하므로서 피사체의 넓은 면적에 대한 빛의 명암조절이 곤란하였고 따라서 외관 및 형상검사의 편차가 많이 발생하였으며 촬영과 검사 싸이클 타이밍(33)의 단속에 의한 속도지연과 리드프레임의 공급이송과 정지 싸이클의 반복수행에 따른 기구전체의 진동이 발생하여 정보 검사요건인 피측정물의 무진동 이송과 조명의 명암에 대한 균일성이 유지할수없었으나 본 발명은 라인스캔닝 카메라(7,7-1,7-2) 촬영법에 의한 검사방법에 의하여 형상정도측정을 할 경우 1로트당 최초촬영에서 종료시까지 리드프레임의 일정속도에 따른 연속공급이 지속 되므로 진동이 없으며 좁은 영역의 영상범위(34)를 설정하여 조명투과 및 촬영을 하게 되므로 고밀도의 검사성능을 얻을수 있음을 제시하고 또한 리드 1로트(4)를 기준값 단위로하여 1유니트(2)안에서 다시 촬영범위를 미세분류(D,E,F,G,H) 로 등분하여 이순서대로 연속 촬영한 정보를 그 순서대로 영상조립한후 컴퓨터 영상정보처리장치(3)내의 알고리즘(8)으로 전송하여 마스터영상정보(29)의 표준 영상과 비교검사를 하여 양품(17) 또는 불량(18)을 선별하는 것이고 이러한 유니트(2)에 대한 검사싸이클(33)을 1로트(4) 전체가 끝날때까지 반복되고 다시 또다른 1로트의 촬영 및 전송 그리고 검사하도록 하는 것을 제시하는 것이다.An object of the present invention is to take a picture of the front of one unit at a time in the inspection method of the lead frame and to analyze the contrast of the light over a large area of the subject was difficult, and thus a lot of deviations in appearance and shape inspection occurred and shooting and inspection Velocity delay due to the interruption of the cycle timing 33 and vibration of the entire instrument due to the feed transfer of the lead frame and the repeating of the stop cycle are generated. Although it was impossible to maintain the present invention, when the shape accuracy was measured by the inspection method using the line scanning camera (7,7-1,7-2), the present invention was performed according to the constant speed of the lead frame from the initial shooting to the end of each lot. As continuous supply is maintained, there is no vibration, and light transmission and shooting is done by setting the image range 34 of a narrow area, so that high density inspection In addition, the photographing range was further divided into fine classifications (D, E, F, G, and H) in one unit (2) based on the lead 1 lot (4) as a reference value unit. After assembling the information in that order, it is transmitted to the algorithm 8 in the computer image information processing apparatus 3, and compared with the standard image of the master image information 29 to screen the good or defective product 17 or the defective product 18. It is to suggest that the inspection cycle 33 for this unit 2 is repeated until the end of the whole lot 4, and again to shoot, transfer and inspect another lot.

도1은 라인스캔닝 카메라 촬영 과정을 표기한 평면도이다.1 is a plan view showing a line scanning camera photographing process.

도2는 라인스캔닝 카메라 촬영 과정을 표기한 정면도이다.2 is a front view showing a line scanning camera photographing process.

도3은 라인스캔닝 카메라 촬영 과정을 표기한 우측면도이다.3 is a right side view showing a line scanning camera photographing process.

도4는 리드프레임이 구성되어 있는 로트 단위의 형상도이다.4 is a shape diagram of a lot unit in which a lead frame is formed.

도5는 라인스캔닝 카메라에 의한 리드프레임검사를 진행하는 구성도이다.5 is a block diagram of a lead frame inspection performed by a line scanning camera.

도6은 라인스캔닝 촬영을 위한 리드프레임의 리드형상도이다.6 is a lead shape diagram of a lead frame for line scanning imaging.

도7은 리드프레임 촬영스캔닝영역 분할도이다.7 is a diagram of a lead frame photographing scanning area division.

[도면의 주요부분에 대한 부호의 설명][Explanation of symbols on the main parts of the drawings]

리드프레임 (1) 싸이클타이밍 (33)Leadframe (1) Cycle Timing (33)

라인스캔닝카메라 (7,7-1,7-2) 연속전송 (5)Line Scanning Camera (7,7-1,7-2) Continuous Transmission (5)

영상정보처리장치 (3) 피사체영역 (2)Image Information Processing Equipment (3) Subject Area (2)

알고리즘 (8) 모니터 (20)Algorithm (8) Monitor (20)

로트 (4) 피딩레일 (12)Lot (4) Feeding rails (12)

유니트 (2) 하프밀러 (19)Units (2) Half Millers (19)

마스터 영상 (29) 그립핑 피더 (10-2)Master Image (29) Gripping Feeder (10-2)

양품 (17) 미세분류 (D,E,F,G,H)Good quality (17) Fine classification (D, E, F, G, H)

불량품 (18) 피사체영상취득 (7-3)Poor product (18) Subject image acquisition (7-3)

본 발명의 상기 목적을 달성하기 위하여 리드프레임(1)의 1로트(4)단위를 일정구간의 유니트(2)로 세분하여 연속촬영 하도록 하여 그 입수된 영상정보(7-3)를 마스터(29) 영상이 있는 알고리즘 (8)으로 전송한후 비교검사기능을 완성하도록 하는 시스템을 구성한다.In order to achieve the above object of the present invention, one lot (4) units of the lead frame (1) are divided into units (2) of a predetermined period so that continuous shooting is performed so that the obtained image information (7-3) is mastered (29). A system is constructed to complete the comparison test function after transmission to the algorithm with image (8).

이하 첨부도면에 의거하여 실시 예를 설명하면 다음과 같다.Hereinafter, an embodiment will be described based on the accompanying drawings.

도1은 리드프레임의 검사를 위한 라인스캔닝 카메라촬영과 검사공정을 수행하기 위한 장비의 평면도이다.1 is a plan view of equipment for performing a line scanning camera photographing and inspection process for inspection of a lead frame.

도2는 상기 도1의 검사공정을 수행하기 위해 구성하고있는 장비의 정면도이다.FIG. 2 is a front view of equipment configured to perform the inspection process of FIG.

도3은 상기 도1의 검사공정을 수행하기 위해 구성하고있는 장비의 우측면도이다.Figure 3 is a right side view of the equipment configured to perform the inspection process of Figure 1;

도4는 라인스캔닝카메라 촬영을 위해 필요한 리드프레임의 단위로트 형상도이다.4 is a unit lot shape diagram of a lead frame required for line scanning camera photographing.

도5는 라인스캔닝카메라 촬영으로 리드를 검사하는 절차와 방법을 나타낸 구성도이다.5 is a block diagram showing a procedure and method for inspecting a lead by line scanning camera photographing.

도6은 검사항목인 리드프레임의 상세한 리드형상도이다.6 is a detailed lead shape of a lead frame as an inspection item.

도7은 라인스캔닝카메라로 촬영할 때 구역설정하는 방법을 예시한 스캔닝영역 분할도이다.7 is a scanning area division diagram illustrating a method of zoning when photographing with a line scanning camera.

여기에서 라인스캔닝 카메라(7,7-1,7-2)에의한 세부영역 촬영(7-3)요건인 카메라의 렌즈모양(35)은 직사각형을 채택하며 촬영과 전송 그리고 검사기능을 연속적으로 진행 되도록 하는 것으로 본 발명의 구성과 작용에 대하여는 도면을 참고하여 구체적으로 설명하면 다음과 같다. 리드프레임 검사방법의 구성은 리드의 이송장치인 그립핑 피더에 의해 영상 촬영카메라 아래쪽에 촛점의 동축상이 리드의 최초지점이 정지하도록 하기 위하여 피사체인 리드(1)가 피딩레일 (12)위에서 컴퓨터지령(3)에 의해 정확히 영상촬영위치(36)에 일치시켜야하고 피사체의 위치결정이 확인되면 하프밀러(19)안으로 들어오는 표준 조명의 조건으로 셋팅된 빛을 피사체에 투과시키는 동시에 카메라는 피사체의 영상(7-3)을 촬영한다.Here, the lens shape 35 of the camera, which is a requirement for detailed area shooting (7-3) by the line-scanning cameras (7,7-1,7-2), adopts a rectangle and continuously performs shooting, transmission and inspection functions. The configuration and operation of the present invention to be carried out in detail with reference to the drawings as follows. The configuration of the lead frame inspection method is performed by a gripping feeder, which is a lead feeder, so that the lead 1, which is a subject, stops the first point of the lead at the bottom of the imaging camera. (3) should be exactly matched to the image shooting position 36, and if the object positioning is confirmed, the camera transmits the light set under the condition of the standard lighting coming into the half mirror 19 to the subject, 7-3).

이러한 촬영기능을 반복하여 1로트당 리드의 영상취득이 완성 될 때까지 촬영이 연속적으로 진행되게된다.By repeating this shooting function, the shooting is continuously performed until the acquisition of the lead per lot is completed.

이렇게 촬영된 영상정보는 촬영되는 순서대로 표준영상정보처리장치내의 알고리즘에 전송되고 이 피사체 촬영정보자료는 마스터영상조건과 비교검사 하여 먼저 저장해놓은 검사기준값 이내에 들어오는 제품은 합격품이고 기준값에 미달하는 제품은 불합격처리 되어 각각 분리하게 된다.The captured image information is transmitted to the algorithm in the standard image information processing device in the order in which the images are taken, and the subject photographing information data is compared with the master image condition, and the product that comes within the inspection standard value stored first is a pass product and a product that does not meet the standard value. It is rejected and separated.

이때에 촬영되는 검사영역은 리드 프래임의 전면적에 대하여 프로그램의 설정영역을 규정하면 리드의 진행방향에 대하여 촬영구간이 설정되는 것 이고 그 설정 구간은 반드시 라인스캔닝 카메라(7,7-1,7-2)의 렌즈규격범위 이내에 들어오게 해야하고 리드의 속도 즉 피딩레일(12)상의 피더(10,10-1)이송속도결정은 카메라의 촬영속도 범위이내에서 정미등속이송이 되어야 하는 조건을 만족시킨다.At this time, if the inspection area to be photographed defines the setting area of the program for the entire area of the lead frame, the shooting area is set for the direction of the lead, and the setting area must be a line scanning camera (7,7-1,7). It should be within the lens specification range of -2), and the speed of the lead, that is, the feeder 10, 10-1 feedrate on the feeding rail 12, satisfies the condition that the net speed should be within the shooting speed range of the camera. Let's do it.

이러한 형식의 촬영 구성은 리드프레임(1)의 상부면과 하부면을 동시에 촬영하고 영상정보(7-3)를 전송하여 검사공정까지 완성하기 위해서는 리드프레임(1) 즉 피사체의 상부와 하부에 각각의 카메라(7,7-1,7-2)를 설치하여야하고 영상검사방법은 내부규정으로 정하는 표준영상정보인 마스터영상(29)을 설정하여 기준값 대비 오차값을 판단하여 분리하고 양호품(17)과 불량품 (18)을 컴퓨터프로그램(3)에 의하여 자동분리 시키게 된다. 여기에서 불량품은 1차불량 (18-1)과 2차불량(18-2)을구분하고 미세불량인 1차불량품은 육안검사로 재판정한후 양품 처리되도록 노력하여 불량률을 적게하는 수단으로 불량품로트를 2단계로 분류하는 프로그램을 운용한다.In this type of photographing configuration, the upper and lower surfaces of the lead frame 1 are simultaneously photographed and the image information 7-3 is transmitted to complete the inspection process. Cameras (7,7-1,7-2) should be installed, and the image inspection method is to set the master image (29), which is the standard image information prescribed by the internal regulations, to judge and separate the error value from the reference value, ) And the defective product 18 are automatically separated by the computer program (3). Here, the defective goods are divided into primary defects (18-1) and secondary defects (18-2), and the primary defects that are micro defects are judged by visual inspection and tried to be processed. Operate a program to classify in two stages.

라인스캔닝안의 미세등분(7-3)한 촬영수가 1유니트(2)가되면 한번의 검사공정을 진행시키게되는데 그러한 공정을 1로트(4) 완성시까지 반복 수행하는 것이다.When the number of finely divided (7-3) shots in the line scanning reaches one unit (2), one inspection process is performed, and such a process is repeatedly performed until the completion of one lot (4).

앞에서 전술한 기술내용으로부터 본 리드프레임(1) 검사방법은 다양한 규격의 검사영역을 설정(34)하여 세분화된 미세영역(7-3)으로 다시 분류하여 촬영하므로서 검사정밀도를 향상시키고 검사공정간에 발생했던 장비구동에 대한 진동을 제거하여 정미검사와 연속촬영 및 검사방법에 대한 프로그램 구축으로 검사속도를 높일수 있다.The lead frame (1) inspection method seen from the foregoing description of the technique improves inspection accuracy and generates between inspection processes by setting (34) inspection regions of various standards and classifying them into subdivided fine regions (7-3). By eliminating the vibration of the equipment operation, the inspection speed can be increased by the program for the net inspection, continuous shooting, and the inspection method.

그리고 컴퓨터 주제어장치(3)에 의해서 촬영유니트(2)를 세분화한후 카메라의 영상취득(촬영)속도 와 리드프레임(1)의 이송속도를 정확히 셋팅하여 촬영, 전송, 검사의 공정진행의 싸이클타이밍(33)을 일정하게 유지시켜 주므로 고품질의 자동검사 시스템을 운용하게된다.After subdividing the photographing unit 2 by the computer main controller 3, the timing of the process of photographing, transmitting, and inspecting by accurately setting the image acquisition (shooting) speed of the camera and the feed rate of the lead frame 1 is set. (33) is kept constant, so a high quality automatic inspection system is operated.

Claims (4)

도7에서 리드프레임의 피사체영상물의 라인스캔닝 촬영과 영상조립에 대하여 반도체 리드 프레임의 1유니트를 라인스캔닝카메라를 사용하여 많은 횟수의 영상촬영을 도7의 D, E, F, G, H의 순서로하여 이 촬영된 영상정보를 촬영순서에 따라 영상정보처리장치내의 알고리즘으로 전송하여 하나의 유니트로 블록영상이 조립되게 한 후 이렇게 얻어진 피사체 조합영상을 미리 정해진 마스터영상의 기준값과 비교검사하여 기준값 픽셀수량이내의 것은 양품이 되고 기준값 픽셀수량이외의 것은 불량품이 되는 판단방식의 리드프레임 검사방법.In FIG. 7, line scanning and photographic assembly of the subject image of the lead frame are performed by using a line scanning camera on one unit of the semiconductor lead frame. A large number of images are taken by D, E, F, G, and H of FIG. In this order, the captured image information is transmitted to the algorithm in the image information processing apparatus according to the photographing order, so that the block image is assembled into one unit, and the combined object image thus obtained is compared with the reference value of the predetermined master image. A lead frame inspection method according to the judgment method in which a value within the reference value pixel quantity becomes a good product and a value other than the reference value pixel quantity becomes a defective product. 도1에서 반도체 리드검사장비에 대하여.1, the semiconductor lead inspection equipment. 도2의 피딩레일(12)위에서 동축선상의 피더(10,10-1)를 이용한 리드프레임 이송방법으로서 리드프레임(1)을 촬영위치로 이송하는데 있어서 리드프레임(1)을 촬영위치로 이송할때에 앞쪽의 공급 그립핑피더(10)이송속도와 뒤쪽의 퓨싱피더(10-1)의 이송속도를 구분하여 앞쪽의 공급 그립핑피더(10)이송속도는 빠르게 되고 뒤쪽의 퓨싱피더(10-1)의 이송속도는 카메라의 영상촬영속도와 같게 셋팅하여 두 개의 피더가 일정한 싸이클 타임으로 반복하여 작동하게 하는 피더의 이송방법.In the lead frame transfer method using the coaxial feeders 10 and 10-1 on the feeding rail 12 of FIG. 2, the lead frame 1 may be transferred to the shooting position in the transfer of the lead frame 1 to the shooting position. In this case, the feed rate of the front feed gripping feeder 10 and the feed rate of the rear fusing feeder 10-1 are distinguished, and the feed rate of the feed feed gripping feeder 10 at the front becomes faster and the rear feeding feeder 10- is fed. The feed speed in 1) is set equal to the camera's video shooting speed so that two feeders can be repeatedly operated at a constant cycle time. 위 제 2항에 있어서, 피딩레일(12)을 이용한 리드프레임의 이송방법에 대하여, 도2에서 리드프레임 제품을 고정된 피딩레일(12)위에 탑재하여 피더인 도1의 피더(10,10-1)로 이송시키는 원리로서 공급용 피더로 이송하거나 취출용 피더(12)로 취출할 때 피딩레일(12)위에 있는 도1의 리드프레임(1)이 탑재된 상태로 직접 레일 위에서 슬라이딩하여 이송 되도록 하는 리드프레임 이송방법.3. The feeder according to claim 2, wherein the lead frame feed method using the feeding rail 12 is mounted on the fixed feeding rail 12 in FIG. 1) As a principle of transferring to the feeder feeder or to take out the feeder feeder (12) when the lead frame (1) of Figure 1 on the feeding rail 12 is mounted so as to slide directly on the rail Lead frame feed method. 위 제3항에 있어서, 검사 완성품 트레이박스 자동 취출 방법에 대하여. 도1에서 트레이박스(45)를 이용하여 제품을 적재하고 취출하는 것으로서 컴퓨터제어에 따라 투입컨베어에 의해 트레이가 투입되어 제품이 로트단위량 만큼 수납장인 트레이박스(45)에 적재되면 그 단위로트인 번들단위로 자동포장하여 컴퓨터제어신호에 의해 취출용 컨베어를 타고 적재 위치까지 이송시키게 하는 트레이박스 자동취출 방법.The method according to claim 3, wherein the inspection finished product tray box is automatically taken out. In FIG. 1, when the product is loaded and taken out using the tray box 45, the tray is inserted by the input conveyor according to computer control, and when the product is loaded in the tray box 45 which is a storage unit by lot unit quantity, the unit lot in Automatic tray box take-out method that automatically packs in bundles and transfers the take-out conveyor to the loading position by computer control signal.
KR1020010049180A 2001-08-14 2001-08-14 Image process line scaning camera of lead frame inspection system KR20010088635A (en)

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KR101012703B1 (en) * 2004-04-01 2011-02-09 삼성테크윈 주식회사 Method for detecting of lead frame scrap badness
KR101050839B1 (en) * 2004-05-15 2011-07-21 삼성테크윈 주식회사 Leadframe inspection method
KR102194786B1 (en) * 2020-09-16 2020-12-23 에스에스오트론 주식회사 PCB automatic subdivision device of semiconductor package
CN115235532A (en) * 2022-07-01 2022-10-25 江阴新基电子设备有限公司 Optical inspection machine

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JPS55163856A (en) * 1979-06-06 1980-12-20 Toshiba Corp Apparatus for positioning semiconductor device enclosure
JPH0835827A (en) * 1994-07-26 1996-02-06 Toshiba Corp Tester for checking bend of lead
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KR101012703B1 (en) * 2004-04-01 2011-02-09 삼성테크윈 주식회사 Method for detecting of lead frame scrap badness
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CN115235532A (en) * 2022-07-01 2022-10-25 江阴新基电子设备有限公司 Optical inspection machine

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