CN214953101U - Detection system - Google Patents

Abstract

The application discloses a detection system. The detection system is used for detecting the workpiece and comprises a mounting device, a first detection device and a second detection device, wherein the first detection device is mounted on the mounting device and used for imaging a to-be-detected surface of the workpiece to obtain a two-dimensional image and detecting a two-dimensional defect on the to-be-detected surface; the second detection device is arranged on the mounting device, images are formed on the three-dimensional features on the surface to be detected by the second detection device to obtain a three-dimensional image, and the three-dimensional image is used for detecting three-dimensional defects on the surface to be detected. In addition, in the same detection system, the two-dimensional defects and the three-dimensional defects can be detected without transferring the workpiece to other detection equipment for defect detection again, so that the detection efficiency is improved.

Description

Detection system

Technical Field

The application relates to the technical field of industrial detection, in particular to a detection system.

Background

The wafer can be processed into various circuit device structures to form integrated circuit products with specific electrical functions. The processing and manufacturing process of a general wafer is complicated, and if a defect exists on the wafer, the manufactured integrated circuit product is invalid, and the yield of the product is low, so the defect on the wafer needs to be detected so as to remove the defect in time or stop the manufacturing process. At present, a plane detector is generally used for detecting 2D defects on the surface of a wafer, and observation of a detection result shows that the defects on the surface of the wafer cannot be perfectly inspected only by detecting the 2D defects, so that the detection effect is poor.

SUMMERY OF THE UTILITY MODEL

The embodiment of the application provides a detection system.

The detection system of the embodiment of the application is used for detecting a workpiece, and comprises an installation device, a first detection device and a second detection device, wherein the first detection device is installed on the installation device, images a to-be-detected surface of the workpiece to obtain a two-dimensional image, and is used for detecting two-dimensional defects on the to-be-detected surface; the second detection device is arranged on the mounting device, images the three-dimensional features on the surface to be detected to obtain a three-dimensional image, and is used for detecting the three-dimensional defects on the surface to be detected.

In some embodiments, the first detecting means and the second detecting means are mounted in parallel to each other on the mounting means, and the first detecting means is mounted on one side of the second detecting means in a direction in which the dimension is smallest among the length, width and height directions.

In some embodiments, the first detection device includes at least one imaging lens, the second detection device includes a plurality of detection channels, and a height at which optical axes of the plurality of detection channels intersect is the same as a height at which a focal plane of the imaging lens is located.

In some embodiments, the first detection device comprises a first beam splitter, a first imaging assembly, and a second imaging assembly, wherein light reflected or scattered by the workpiece is split into a first beam and a second beam by the first beam splitter; the first imaging component is used for receiving the first light beam for imaging; the second imaging component is used for receiving the second light beam for imaging.

In some embodiments, the first detection device further comprises an objective lens group, the objective lens group comprises a plurality of objective lenses with different magnifications, a plurality of objective lenses are used for alternatively switching to the optical path of the first detection device, and the light reflected or scattered by the workpiece reaches the first light splitter after passing through the objective lenses.

In some embodiments, the second detection device includes a plurality of detection channels, the plurality of detection channels are arranged at different inclination angles, and the plurality of detection channels are used for acquiring images of the same three-dimensional feature.

In some embodiments, each of the detection channels includes a light source, a beam splitter, an imaging lens, and a detector, wherein light emitted from the light source is reflected or transmitted by the beam splitter to the workpiece, and light reflected or scattered by the workpiece passes through the beam splitter and the imaging lens and is received by the detector.

In some embodiments, the detection system further includes a carrying device, the carrying device is configured to carry the workpiece and move the workpiece in a predetermined plane, and the mounting device is configured to move the first detection device and/or the second detection device in a direction perpendicular to the predetermined plane.

In certain embodiments, the detection system further comprises a processing device communicatively coupled to the first detection device and the second detection device;

the processing device acquires position information of the three-dimensional feature according to the two-dimensional image, the position information is sent to the second detection device, and the second detection device images the three-dimensional feature when aligning to the position corresponding to the position information.

In some embodiments, when the first detecting device is aligned with the surface to be detected and the second detecting device is aligned with the three-dimensional feature, the first detecting device images the surface to be detected and the second detecting device images the three-dimensional feature.

In the detection system of the embodiment of the application, a first detection device and a second detection device are arranged simultaneously, wherein the first detection device detects the two-dimensional defect on the surface to be detected, the second detection device detects the three-dimensional defect on the surface to be detected, various types of defects on the surface to be detected can be completely detected, the detection effect is good, in addition, in the same detection system, the detection on the two-dimensional defect and the three-dimensional defect can be realized, the workpiece does not need to be transferred into other detection equipment for defect detection again, the detection time is shortened, the detection efficiency is improved, and the cost of the detection equipment is reduced.

Additional aspects and advantages of embodiments of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.

Drawings

The above and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

FIG. 1 is a schematic diagram of a detection system according to certain embodiments of the present disclosure;

FIG. 2 is a schematic structural view of a first detecting device according to some embodiments of the present disclosure;

FIG. 3 is a schematic structural view of a second detecting device according to some embodiments of the present disclosure;

FIG. 4 is a schematic structural view of a second detecting device according to some embodiments of the present disclosure;

FIG. 5 is a schematic flow chart of a detection method according to some embodiments of the present disclosure;

FIG. 6 is a schematic structural view of a detection system according to certain embodiments of the present application;

FIG. 7 is a schematic view of a workpiece according to certain embodiments of the present application;

FIG. 8 is a schematic structural view of a detection system according to certain embodiments of the present application;

FIG. 9 is a schematic view of a workpiece according to certain embodiments of the present application;

FIG. 10 is a schematic diagram of a detection system according to certain embodiments of the present application.

Description of the main elements and symbols:

the inspection system 100, the workpiece 200, the mounting device 10, the first inspection device 20, the first beam splitter 21, the first imaging assembly 22, the first lens 221, the first sensor 222, the second imaging assembly 23, the second lens 231, the second sensor 232, the second beam splitter 24, the reflector 25, the dark field light source 26, the objective lens 27, the second inspection device 30, the inspection channel 31, the light source 311, the beam splitter 312, the imaging lens 313, the detector 314, the inspection channel 32, the light source 321, the beam splitter 322, the imaging lens 323, the detector 324, the inspection channel 33, the light source 331, the beam splitter 332, the imaging lens 333, the detector 334, the frame 40, the transport device 50, the carrier device 60, and the processing device 70.

Detailed Description

Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below by referring to the drawings are exemplary only for the purpose of explaining the embodiments of the present application, and are not to be construed as limiting the embodiments of the present application.

Referring to fig. 1, fig. 1 is a schematic structural diagram of an inspection system 100 according to some embodiments of the present disclosure, the inspection system 100 being used for inspecting a workpiece 200.

Specifically, the detected workpiece 200 may be a wafer, a chip, a substrate, a film, a display panel, a housing of an electronic device, a cover plate of an electronic device, an electronic component of an electronic device, or the like, and the detected workpiece 200 is taken as an example in this application, it is understood that the specific type of the workpiece 200 may be other, and is not limited herein.

The inspection system 100 may be an industrial inspection tool, and the inspection system 100 may be configured to inspect parameters such as the position and size of a selected feature on the workpiece 200, or the inspection system 100 may be configured to inspect the workpiece 200 for defects to determine whether the workpiece 200 meets quality requirements. In one example, after any one of the processes of the workpiece 200 is completed, the inspection system 100 is used to inspect whether the workpiece 200 is qualified, so as to improve the yield of the final workpiece 200 product and reduce the production cost.

Referring to fig. 1, the detecting system 100 includes a mounting device 10, a first detecting device 20, and a second detecting device 30.

For example, the mounting device 10 may be mounted on the rack 40 of the detection system 100, and the rack 40 may be a mounting carrier in the detection system 100, and the electrical structure, the pneumatic system, and the like of the detection system 100 may be mounted on the rack 40. In one example, the mounting device 10 may be movably mounted to the frame 40, such that the mounting device 10 may slide or rotate relative to the frame 40.

The mounting device 10 can be used to mount functional components such as the first detecting device 20 and the second detecting device 30. When the mounting device 10 moves relative to the frame 40, the first detecting device 20 and the second detecting device 30 are driven to move relative to the frame 40, so as to adjust the detecting angle, the detecting position, the detecting height, and the like. Specifically, the mounting device 10 may be a bracket, and the mounting device 10 may be provided with a fixing structure for fixing the first detecting device 20 and the second detecting device 30, which will not be described in detail herein.

The first detecting device 20 is mounted on the mounting device 10, and the first detecting device 20 may be fixedly mounted on the mounting device 10 or movably mounted on the mounting device 10, which is not limited herein.

The first inspection device 20 images the surface to be inspected of the workpiece 200 to obtain a two-dimensional image, and is used to inspect a two-dimensional defect on the surface to be inspected. The first detecting device 20 may be configured to capture a two-dimensional image of the surface to be detected, for example, the first detecting device 20 may capture the two-dimensional image by line scanning, for example, the first detecting device 20 may capture the two-dimensional image by area array imaging, and for example, the first detecting device 20 may capture the two-dimensional image by line scanning or area array imaging selectively, which is not limited herein.

The two-dimensional defect can be detected through a two-dimensional image, and the defect located on the surface to be detected can be, for example, the two-dimensional defect can be an unnecessary scratch, an unnecessary dead spot, an unnecessary bump or pit, a feature whose two-dimensional size does not meet the standard, a feature whose position does not meet the standard, a feature whose color does not meet the standard, a feature whose deflection direction does not meet the standard, and the like on the surface to be detected.

The second detecting device 30 is mounted on the mounting device 10, and the second detecting device 30 may be fixedly mounted on the mounting device 10 or movably mounted on the mounting device 10, which is not limited herein.

The second detection device 30 images the three-dimensional feature on the surface to be detected to obtain a three-dimensional image, and is used for detecting the three-dimensional defect on the surface to be detected. Specifically, the second detection device 30 performs three-dimensional imaging on the three-dimensional feature on the surface to be detected, and may obtain a three-dimensional image by using any principle that can perform three-dimensional imaging, for example, a three-dimensional image by using the principle of multi-view stereo imaging, a three-dimensional image by using the principle of structured light imaging, a three-dimensional image by using the principle of spectral co-aggregation, a three-dimensional image by using the principle of time-of-flight imaging, a three-dimensional image by using the principle of interferometer, or the like, without being limited thereto.

Wherein, the three-dimensional defect can be a defect which needs to be detected by comparing the three-dimensional size of the three-dimensional feature with the standard size, for example, the three-dimensional defect can be a feature with too high or too low height on the surface to be detected, and too deep or too deep depth

The feature of (a), the feature of which the change rate of the height does not meet the requirement, etc., it is understood that there may be other specific types of the three-dimensional defect, which is not illustrated herein.

Referring to fig. 1, in the example shown in fig. 1, the detecting system 100 further includes a carrying device 60 and a conveying device 50. The carrier 60 can be used to hold the workpiece 200, and in one example, the carrier 60 can also move the workpiece 200. The conveying device 50 can be used for conveying the workpiece 200 to be detected onto the carrying device 60 for the detection of the first detection device 20 and the second detection device 30. The conveying device 50 may also be used to remove the inspected workpiece 200 from the carrier 60 and convey the workpiece to a good product collection site or a defective product collection site. The conveying device 50 may be a robot, such as a two-joint robot, a three-joint robot, etc., without limitation.

In the detection system 100 of the embodiment of the present application, the first detection device 20 and the second detection device 30 are simultaneously disposed, wherein the first detection device 20 detects the two-dimensional defect on the surface to be detected, the second detection device 30 detects the three-dimensional defect on the surface to be detected, various types of defects on the surface to be detected can be completely detected, the detection effect is good, in addition, in the same detection system 100, the detection on the two-dimensional defect and the three-dimensional defect can be realized, the workpiece 200 does not need to be transferred to other detection equipment for defect detection again, the detection time is shortened, the detection efficiency is improved, and the cost of the detection equipment is reduced.

Referring to fig. 1, in some embodiments, the first detecting device 20 and the second detecting device 30 are installed on the installation device 10 in parallel, and the first detecting device 20 is installed on one side of the second detecting device 30 in the direction of the smallest dimension among the length, width and height directions.

The first detection device 20 and the second detection device 30 are installed in parallel, so that the first detection device 20 and the second detection device 30 can detect the same workpiece 200 to be detected, and after the workpiece 200 is detected by the first detection device 20, the workpiece 200 can be detected by the second detection device 30 without being transported in a large range by the transport device 50. The first detection device 20 is installed on one side with the smallest size in the length direction, the width direction and the height direction of the second detection device 30, so that after the first detection device 20 and the second detection device 30 are installed in parallel, the whole size cannot be too large in any one direction, the phenomenon that the workpiece 200 needs to be driven to move too large in a certain direction during detection is avoided, and the whole layout of the detection system 100 is facilitated.

Specifically, in the example shown in fig. 1, the length, width, and height directions of the second detecting device 30 are the X direction (direction perpendicular to the paper surface), the Y direction, and the Z direction shown in fig. 1, respectively, where X-Y-Z is a cartesian coordinate system, and the direction with the smallest dimension is the Y direction, and the first detecting device 20 and the second detecting device 30 are installed in parallel in the Y direction. Of course, in other examples, if the direction of the smallest dimension is the X direction, the first detecting device 20 and the second detecting device 30 may be installed in parallel along the X direction, and the present invention is not limited thereto.

With continued reference to fig. 1, in some embodiments, the first detecting device 20 includes at least one imaging lens, and the second detecting device 30 includes a plurality of detecting channels, and the height of the intersection of the optical axes of the detecting channels is the same as the height of the focal plane of the imaging lens.

Specifically, the first detection device 20 and the second detection device 30 both detect the workpiece 200 by means of optical imaging, and the focal plane of the imaging lens of the first detection device 20 is the same as the height of the intersection of the optical axes of the plurality of detection channels of the second detection device 30, so that after the first detection device 20 detects the two-dimensional defect of the workpiece 200, the second detection device 30 can be used to detect the three-dimensional defect of the workpiece 200 without adjusting the relative height of the workpiece 200 and the second detection device 30, and in addition, when the first detection device 20 detects the two-dimensional defect, the second detection device 30 can also simultaneously detect the three-dimensional defect, thereby improving the efficiency of detecting the workpiece 200.

Referring to fig. 2, fig. 2 is a schematic structural diagram of a first detecting device 20 according to some embodiments of the present disclosure, in which the first detecting device 20 includes a first beam splitter 21, a first imaging assembly 22, and a second imaging assembly 23. The light reflected or scattered by the workpiece 200 is split into a first beam and a second beam by the first beam splitter 21. The first imaging assembly 22 is configured to receive the first light beam for imaging. The second imaging assembly 23 is used for receiving the second light beam for imaging.

The first imaging assembly 22 and the second imaging assembly 23 are disposed in the first detecting device 20, so that the two-dimensional image can be selectively obtained by using the first imaging assembly 22 or the two-dimensional image can be obtained by using the second imaging assembly 23 according to different detecting requirements, so as to adapt to more various detecting requirements.

In an example, the first imaging component 22 may be a color imaging component, the second imaging component 23 may be a black-and-white imaging component, and when the two-dimensional defect detection device is used, the two-dimensional image of the surface to be detected may be captured by the second imaging component 23, so as to perform preliminary detection on the two-dimensional defect, thereby improving the efficiency of detecting the two-dimensional defect, and at the position where the two-dimensional defect exists in the preliminary detection, the two-dimensional defect detection device may further perform re-detection on the position where the two-dimensional defect may exist, thereby improving the accuracy of detecting the two-dimensional defect. In another example, the first imaging assembly 22 may be a black and white imaging assembly, the second imaging assembly 23 may be a color imaging assembly, or both the first imaging assembly 22 and the second imaging assembly 23 may be black and white imaging assemblies, or both the first imaging assembly 22 and the second imaging assembly 23 may be a color imaging assembly, which is not limited herein.

In the example shown in fig. 2, the first imaging assembly 22 includes a first lens 221 and a first sensor 222. The first lens 221 may be a single lens or a lens group, and the first light beam passes through the first lens 221 and reaches the first sensor 222. Of course, the first imaging assembly 22 may not include the first lens 221, and the first light beam is split by the first beam splitter 21 and then directly received by the first sensor 222.

In the example shown in fig. 2, the second imaging assembly 23 includes a second lens 231 and a second sensor 232. The second lens 231 may be a single lens or a lens assembly, and the second light beam passes through the second lens 231 and reaches the second sensor 232. Of course, the second imaging assembly 23 may not include the second lens 231, and the second light beam is split by the first beam splitter 21 and then directly received by the second sensor 232.

Referring to the example shown in fig. 2, the first detecting device 20 further includes a second beam splitter 24 and a reflector 25, the light can be reflected to the second beam splitter 24 by the reflector 25, and the second beam splitter 24 reflects and projects the light onto the workpiece 200. The light reflected by the workpiece 200 reaches the second beam splitter 24, passes through the second beam splitter 24, and reaches the first beam splitter 21. The light may be emitted from an external light source and transmitted to the first detecting device 20 by a light guide device such as an optical fiber, and the light projected onto the workpiece 200 may be used as bright field light.

In addition, the first detection device 20 may further include a dark field light source 26, and light emitted from the dark field light source 26 is projected onto the workpiece 200, scattered by the workpiece 200, and then reaches the second beam splitter 24. Dark field light source 26 may be a ring light source, a bar light source, an arc light source, or any other light source with any shape, and is not limited herein.

Referring to fig. 2, in some embodiments, the first detecting device 20 further includes an objective lens assembly (not shown) including a plurality of objective lenses 27 with different magnifications. The plurality of objective lenses 27 are used to alternatively switch to the optical path of the first detecting device 20, and the light reflected or scattered by the workpiece 200 passes through the objective lenses 27 and reaches the first beam splitter 21.

By switching different objective lenses 27, different shooting magnifications of the first detection device 20 can be switched to meet detection requirements for different detection accuracies. Specifically, in one example, when the position of the two-dimensional defect needs to be located, the objective lens 27 with a smaller magnification may be switched so that the field of view is larger, and the position of the two-dimensional defect can be located quickly; when specific information of the two-dimensional defect needs to be further detected, the objective lens 27 with larger magnification can be switched, so that the precision of two-dimensional imaging is higher, and the precision of detecting the two-dimensional defect is improved.

Referring to fig. 3, fig. 3 is a schematic structural diagram of a second detection device 30 according to some embodiments of the present disclosure, in some embodiments, the second detection device 30 includes a plurality of detection channels 31, 32, and 33, the plurality of detection channels 31, 32, and 33 are disposed at different inclination angles, and the plurality of detection channels 31, 32, and 33 are used to acquire images of the same three-dimensional feature.

A plurality of detection channels 31, 32 and 33 with different inclination angles are arranged, so that images of three-dimensional features can be acquired from multiple angles, and a three-dimensional image with more complete information can be further obtained. Specifically, the number of the detection channels 31, 32, and 33 may be any number equal to or greater than two, such as two, three, four, five, six, seven, and eight. In the example shown in fig. 3, the centers of the three detection channels 31, 32, 33 intersect at a point, the detection channel 31 and the detection channel 33 are respectively disposed at two sides of the detection channel 32, specifically, the center of the detection channel 32 may be arranged perpendicular to the workpiece 200, and the detection channel 31 and the detection channel 33 are symmetrically arranged with respect to the detection channel 32.

Referring to fig. 4, fig. 4 is a schematic structural diagram of a second detecting device 30 according to some embodiments of the present disclosure, in some embodiments, each of the detecting channels 31, 32, and 33 includes a light source 311, 321, and 331, a beam splitter 312, 322, and 332, an imaging lens 313, 323, and 333, and a detector 314, 324, and 334. Light emitted from the light sources 311, 321, 331 is reflected or transmitted by the beam splitters 312, 322, 332 to the workpiece 200, and light reflected or scattered by the workpiece 200 is received by the detectors 314, 324, 334 after passing through the beam splitters 312, 322, 332 and the imaging lenses 313, 323, 333.

By such an arrangement, each detection channel 31, 32, 33 is eventually able to receive bright field light and dark field light to detect three-dimensional features more comprehensively.

Taking the detection channel 31 as an example, the light emitted from the light source 311 is reflected or transmitted to the workpiece 200 by the beam splitter 312, and after the light reflected or scattered by the workpiece 200 reaches the beam splitter 312, the beam splitter 312 transmits or reflects the light to the imaging lens 313, and the light passes through the imaging lens 313 and is received and imaged by the detector 314.

The structures of the detection channel 31, the detection channel 32, and the detection channel 33 are substantially similar except for the difference of the inclination angles, and the specific structures of the detection channel 32 and the detection channel 33 may refer to the description of the detection channel 31, and are not described herein again.

Referring to fig. 1 again, in some embodiments, the carrying device 60 is used for carrying the workpiece 200 and driving the workpiece 200 to move in a predetermined plane. The mounting device 10 is used to move the first detecting device 20 and/or the second detecting device 30 in a direction perpendicular to the predetermined plane.

The workpiece 200 is driven to move in the predetermined plane, so that the first detection device 20 and the second detection device 30 can detect any position on the surface to be detected of the workpiece 200, the mounting device 10 drives the first detection device 20 and/or the second detection device 30 to move along the direction perpendicular to the predetermined plane, and the focus of the first detection device 20 and/or the second detection device 30 falls on the surface to be detected of the workpiece 200, so that clear two-dimensional images and three-dimensional images are obtained.

Specifically, the predetermined plane may be a plane parallel to an X-Y plane in fig. 1, before the detection, the mounting device 10 may drive the first detection device 20 and the second detection device 30 to perform a coarse adjustment in the Z direction to improve the efficiency of the height adjustment, during the detection, the height of the surface to be detected of the workpiece 200 may be detected according to the height measurement device, and according to the height, the mounting device 10 may drive the first detection device 20 and the second detection device 30 to perform a fine adjustment in the Z direction to improve the precision of the height adjustment.

Of course, in other examples, the carrier 60 may drive the workpiece 200 to move in the X direction, the Y direction and the Z direction, while the first detecting device 20 and the second detecting device 30 remain stationary, which is not limited herein.

Referring to fig. 5, fig. 5 is a schematic flow chart of a detection method according to some embodiments of the present disclosure, the detection method is used for detecting a workpiece 200, and the detection method includes the steps of:

01: imaging the surface to be detected of the workpiece 200 by the first detection device 20 to obtain a two-dimensional image;

02: detecting a two-dimensional defect of the surface to be detected according to the two-dimensional image, and acquiring position information of a three-dimensional feature on the surface to be detected;

03: imaging the three-dimensional feature using the position information and by the second detection device 30 to obtain a three-dimensional image; and

04: and detecting the three-dimensional defect of the surface to be detected according to the three-dimensional image.

Referring to fig. 6, fig. 6 is a schematic structural diagram of a detection system 100 according to some embodiments of the present disclosure, in some embodiments, the detection system 100 includes a processing device 70, and the processing device 70 is communicatively connected to the first detection device 20 and the second detection device 30. The first inspection device 20 may be used to perform step 01, that is, the first inspection device 20 may be used to image the surface to be inspected of the workpiece 200 to obtain a two-dimensional image. The processing device 70 may be configured to perform step 02, that is, the processing device 70 may be configured to detect a two-dimensional defect of the surface to be detected according to the two-dimensional image and acquire position information of the three-dimensional feature. The second detecting device 30 may be configured to perform step 03, that is, the second detecting device 30 may be configured to image the three-dimensional feature by using the position information of the three-dimensional feature to obtain a three-dimensional image. The processing device 70 may also be configured to perform step 04, that is, the processing device 70 may be configured to detect a three-dimensional defect of the surface to be detected according to the three-dimensional image.

Specifically, in step 01, the first detection device 20 images the to-be-detected surface of the workpiece 200 to obtain a two-dimensional image, and for how to obtain the two-dimensional image by shooting, reference may be made to the description of the first detection device 20, which is not described herein again. When the first detection device 20 obtains the two-dimensional image, each shooting can be performed only on one part of the surface to be detected of the workpiece 200, and after the current part is shot, the next part of the surface to be detected is shot until the whole surface to be detected of the workpiece 200 is shot, so that a plurality of two-dimensional images are obtained.

In step 02, according to the two-dimensional image, the two-dimensional defect of the surface to be detected is detected, and the position information of the three-dimensional feature on the surface to be detected is obtained. Specifically, the processing device 70 may compare the two-dimensional image captured by the first detecting device 20 with a standard defect-free image to detect whether the workpiece 200 has a two-dimensional defect. It is to be understood that the processing means 70 may continuously take new two-dimensional images while the first detecting means 20 performs step 02.

Meanwhile, the processing device 70 may also locate the position information of the three-dimensional feature to be detected through the two-dimensional image, and specifically, the position information of the three-dimensional feature, such as the position coordinate, may be calculated through the position coordinate aligned by the first detecting device 20 when the two-dimensional image is captured and the position of the three-dimensional feature in the two-dimensional image.

For example, as shown in fig. 7, fig. 7 is a schematic diagram of a workpiece 200 according to some embodiments of the present application, and by analyzing a two-dimensional image, it is determined that a three-dimensional feature 201 exists in the workpiece 200, and position information of the three-dimensional feature 201 is recorded.

In step 03, the three-dimensional feature is imaged by using the position information of the three-dimensional feature and the second detection device 30 to obtain a three-dimensional image. The position information of the three-dimensional feature acquired by the processing device 70 may be sent to the second detecting device 30, and when the second detecting device 30 is aligned with the position corresponding to the position information, the second detecting device 30 images the three-dimensional feature. For details of how to capture the three-dimensional image, reference may be made to the above description of the second detection device 30, which is not described herein again.

In step 04, the three-dimensional defect of the surface to be detected is detected according to the three-dimensional image, and the processing device 70 may compare the information of the three-dimensional feature in the three-dimensional image with the information of the three-dimensional image in the standard model to detect whether the currently shot three-dimensional feature meets the quality standard, that is, detect whether the currently shot three-dimensional feature has the three-dimensional defect.

Referring to fig. 6 and 8, fig. 8 is a schematic structural diagram of the inspection system 100 according to some embodiments of the present disclosure, when inspecting the workpiece 200, since the three-dimensional feature can be inspected only after position information of the three-dimensional feature is acquired according to the two-dimensional image, when the workpiece 200 is initially inspected, the workpiece 200 can be driven to move, so that the position relationship among the workpiece 200, the first inspection device 20 and the second inspection device 30 is as shown in fig. 6, the first inspection device 20 performs two-dimensional imaging on the surface to be inspected of the workpiece 200, and the second inspection device 30 does not operate first.

With the detection, the position information of a part of the three-dimensional features is detected, and a part of the surface to be detected is not subjected to two-dimensional imaging, at this time, the workpiece 200 may be driven to move, so that the position relationship among the workpiece 200, the first detection device 20 and the second detection device 30 is as shown in fig. 8, the first detection device 20 performs two-dimensional imaging on the surface to be detected, and simultaneously, the second detection device 30 performs three-dimensional imaging on the three-dimensional features. Referring to fig. 8 and 9, wherein fig. 9 is a schematic diagram of a workpiece 200 according to some embodiments of the present disclosure, a two-dimensional feature 202 is imaged by the first inspection device 20, and a three-dimensional feature 201 is imaged by the second inspection device 30. Thus, the efficiency of detecting the workpiece 200 is improved.

As the detection is performed, all the two-dimensional defects are detected, the position information of all the three-dimensional features is detected, and only whether the three-dimensional features have three-dimensional defects is not detected yet, at this time, the workpiece 200 may be driven to move, so that the position relationship among the workpiece 200, the first detection device 20, and the second detection device 30 is as shown in fig. 10, fig. 10 is a schematic structural diagram of the detection system 100 according to some embodiments of the present application, the first detection device 20 does not operate, and at the same time, the second detection device 30 performs three-dimensional imaging on the three-dimensional features. And completing the detection of the current workpiece 200 until the second detection device 30 detects all the three-dimensional features.

In summary, in the detection system 100 and the detection method of the embodiment of the present application, the first detection device 20 and the second detection device 30 are simultaneously arranged, wherein the first detection device 20 detects the two-dimensional defect on the surface to be detected, and the second detection device 30 detects the three-dimensional defect on the surface to be detected, so that various types of defects on the surface to be detected can be completely detected, and the detection effect is good.

In the description herein, reference to the description of the terms "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example" or "some examples" or the like means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.

Any process or method descriptions in flow charts or otherwise described herein may be understood as representing modules, segments, or portions of code which include one or more executable instructions for implementing specific logical functions or steps of the process, and the scope of the preferred embodiments of the present application includes other implementations in which functions may be executed out of order from that shown or discussed, including substantially concurrently or in reverse order, depending on the functionality involved, as would be understood by those reasonably skilled in the art of the present application.

Although embodiments of the present application have been shown and described above, it is to be understood that the above embodiments are exemplary and not to be construed as limiting the present application, and that changes, modifications, substitutions and alterations can be made to the above embodiments by those of ordinary skill in the art within the scope of the present application.

Claims (10)

1. An inspection system for inspecting a workpiece, the inspection system comprising:

a mounting device;

the first detection device is arranged on the mounting device and used for imaging the surface to be detected of the workpiece to obtain a two-dimensional image and detecting two-dimensional defects on the surface to be detected; and

the second detection device is arranged on the mounting device and used for imaging the three-dimensional features on the surface to be detected to obtain a three-dimensional image and detecting the three-dimensional defects on the surface to be detected.

2. The inspection system according to claim 1, wherein the first inspection device and the second inspection device are mounted in parallel to the mounting device, and the first inspection device is mounted on one side of the second inspection device in a direction in which the dimension is smallest among the length, width, and height directions.

3. The detection system according to claim 1, wherein the first detection device comprises at least one imaging lens, the second detection device comprises a plurality of detection channels, and the height of the intersection of the optical axes of the plurality of detection channels is the same as the height of the focal plane of the imaging lens.

4. The detection system according to claim 1, wherein the first detection device comprises:

a first beam splitter, by which light reflected or scattered by the workpiece is split into a first beam and a second beam;

a first imaging assembly for receiving the first light beam for imaging; and

a second imaging assembly for receiving the second light beam for imaging.

5. The inspection system of claim 4, wherein the first inspection device further comprises an objective lens assembly including a plurality of objective lenses of different magnifications for alternatively switching into the optical path of the first inspection device, wherein light reflected or scattered by the workpiece passes through the objective lenses before reaching the first beam splitter.

6. The inspection system of claim 1, wherein the second inspection device includes a plurality of inspection channels, the plurality of inspection channels being arranged at different oblique angles, the plurality of inspection channels being configured to capture images of the same three-dimensional feature.

7. The inspection system of claim 6, wherein each of the inspection channels comprises a light source, a beam splitter, an imaging lens, and a detector, wherein the light from the light source is reflected or transmitted by the beam splitter to the workpiece, and the light reflected or scattered by the workpiece is transmitted through the beam splitter and the imaging lens and received by the detector.

8. The detecting system according to any one of claims 1 to 7, wherein the detecting system further comprises a carrying device for carrying the workpiece and moving the workpiece in a predetermined plane, and the mounting device is used for moving the first detecting device and/or the second detecting device in a direction perpendicular to the predetermined plane.

9. The detection system according to any one of claims 1 to 7, further comprising a processing device communicatively connected to the first detection device and the second detection device;

the processing device acquires position information of the three-dimensional feature according to the two-dimensional image, the position information is sent to the second detection device, and the second detection device images the three-dimensional feature when aligning to the position corresponding to the position information.

10. The inspection system of any one of claims 1 to 7, wherein the first inspection device is aligned with the surface to be inspected, and the second inspection device is aligned with the three-dimensional feature, the first inspection device images the surface to be inspected, and the second inspection device images the three-dimensional feature.

Images