CN215493243U

CN215493243U - Detection device

Info

Publication number: CN215493243U
Application number: CN202121648018.4U
Authority: CN
Inventors: 黄有为; 方一; 陈鲁; 张嵩
Original assignee: Shenzhen Zhongke Feice Technology Co Ltd
Current assignee: Shenzhen Zhongke Feice Technology Co Ltd
Priority date: 2021-05-14
Filing date: 2021-07-19
Publication date: 2022-01-11
Anticipated expiration: 2031-07-19

Abstract

The utility model discloses a detection device, which comprises a light source module, an image acquisition module and an object stage, wherein the object stage is used for bearing an object to be detected, the light source module is used for providing detection light for a detection area of the object to be detected, and the image acquisition module is used for acquiring an image of the detection area. The image acquisition module comprises at least one image acquisition channel, each image acquisition channel comprises an image sensor and an objective lens, the image acquisition module comprises at least one image acquisition channel, the image acquisition module comprises a first image acquisition channel, and the lens plane of the objective lens and the plane where the photosensitive surface of the image sensor is located intersect on the same straight line. Because the view finding channel of one image acquisition channel in the image acquisition module meets the Schlemm's law, the detection area of the object to be detected is within the depth of field of the image acquisition channel, and the image definition is further improved, so that the detection effect is improved.

Description

Detection device

Technical Field

The utility model relates to the technical field of semiconductor detection, in particular to a detection device.

Background

The wafer is a thin slice cut from a silicon column, which is mainly used as a basic material for producing electronic components, and in order to ensure the production quality of the electronic components, quality inspection is usually performed on the wafer to detect defect points of the wafer. With the rapid development of the semiconductor manufacturing level, the integration level of the wafer is continuously improved, the stability and reliability of the process of the wafer put higher demands on the semiconductor detection technology, and the high-precision detection of the surface defects of the wafer becomes an important part in the process of the process. In the early semiconductor optical inspection method, the wafer is generally placed in a bright environment, and the surface is inspected by manual visual inspection or sampling inspection to see whether the defect such as dust or dirt exists on the surface. However, as the feature size of the crystal grain is continuously reduced, the size of the defect is correspondingly reduced, and the simple detection method obviously cannot meet the requirements of high precision and high efficiency. Since the detection sensitivity of different wafer defects varies depending on the optical environment (wavelength, intensity, illumination mode, etc.), it is necessary to adopt different imaging modes for defects in a targeted manner to realize high-precision detection of defects on the surfaces of various wafers in one optical system in order to better display the defects and reduce the false rate. The semiconductor manufacturing process needs dozens of process flows, various defects of different types can be caused in the process, any defect can cause product rejection, and a set of high-precision and strong-compatibility detection system is needed to realize the rapid and accurate detection of various defects. At present, most wafer detection equipment based on optical imaging adopts a single light source for illumination, and after a camera shoots an image, whether the image is qualified or not is judged manually or software is used for classification. However, not all defects on the wafer can be revealed by a single light source due to imperfections introduced by the material itself or by the process. In addition, patterned wafer detection equipment is generally adopted for wafer detection, and the patterned wafer detection equipment has many types, including electronic detection equipment, bright field detection equipment and dark field detection equipment, and the detection principle is basically the same. On a semiconductor wafer, electronic devices of the same pattern are manufactured side by side, random defect points are generally caused by particles such as dust and appear at random positions, and the probability that defect points repeatedly appear at specific positions is extremely low, and therefore, the patterned wafer inspection apparatus can detect defects by comparing pattern images of adjacent chips (also referred to as dies). In the actual detection process, the image capturing device of the patterned wafer detection equipment needs to be focused accurately in order to acquire a clear detection image, however, the lens plane and the imaging plane of the image capturing device cannot be parallel to each other, the imaging plane has a close-range difference and a long-range difference, so that the image capturing device is difficult to acquire an imaging plane which is focused uniformly, the wafer detection accuracy is reduced, and the detection effect is poor.

Disclosure of Invention

The application provides a detection device for solve the relatively poor technical problem of wafer detection effect.

According to a first aspect, an embodiment provides a detection apparatus, including a light source module, an image acquisition module, and a stage;

the object stage is used for bearing an object to be tested;

the light source module is used for providing detection light for the detection area of the object to be detected;

the image acquisition module is used for acquiring an image of a detection area of the object to be detected; the image acquisition module comprises at least one image acquisition channel, and each image acquisition channel comprises an image sensor and an objective lens; the objective lens is used for imaging the detection area of the object to be detected on the photosensitive surface of the image sensor so that the image sensor can acquire the image of the detection area of the object to be detected; the image acquisition module comprises at least one image acquisition channel, wherein the at least one image acquisition channel comprises a first image acquisition channel;

the lens plane of the objective lens of the first image acquisition channel and the plane where the photosensitive surface of the image sensor is located intersect on the same straight line, and the lens plane is a plane passing through the center point of the objective lens and perpendicular to the optical axis.

In one embodiment, the light source module comprises a detection light source, a first incidence assembly and a second incidence assembly; the first incidence assembly is used for enabling the light of the detection light source to form the detection light and enabling the detection light to be vertically incident to the detection area of the object to be detected; the second incidence assembly is used for enabling the light of the detection light source to form the detection light and enabling the detection light to be obliquely incident to the detection area of the object to be detected.

In one embodiment, the image sensor is a two-dimensional image sensor; and/or the image sensor is a time delay integration sensor; the integral direction of the time delay integral sensor is vertical to a straight line which is intersected by the plane of the mirror plane and the plane of the light sensing surface of the image sensor.

In one embodiment, the detection light source forms a rectangular light spot on the detection area of the object to be detected through the first incidence assembly and/or the second incidence assembly;

the straight line of the intersection of the lens plane of the objective lens of the first image acquisition channel and the plane of the photosensitive surface of the image sensor is parallel to the extending direction of the long edge of the rectangular light spot.

In an embodiment, the light source module further includes a light path switching component, and the light path switching component is configured to transmit the light of the detection light source to the first incident component or the second incident component;

or, the detection light source includes a first light source and a second light source, the first incident assembly is used for vertically incident the light of the first light source to the detection area of the object to be detected, and the second incident assembly is used for obliquely incident the light of the second light source to the detection area of the object to be detected.

In an embodiment, the stage includes a bearing device, and the bearing device is configured to bear the object to be detected, and make a plane of a detection area of the object to be detected, a mirror plane of the objective lens of the first image capturing channel, and a plane of a photosensitive surface of the image sensor of the first image capturing channel intersect with each other on the same straight line.

In one embodiment, the image acquisition module comprises at least two image acquisition channels; the image acquisition module further comprises a second image acquisition channel, and a light sensing surface of an image sensor of the second image acquisition channel is parallel to a lens plane of the objective lens.

In one embodiment, a first acute included angle is formed between the optical axis of the first image acquisition channel and the normal of the surface of the detection area of the object to be detected; and a second acute included angle is formed between the optical axis of the second image acquisition unit and the normal line of the surface of the detection area of the object to be detected, and the first acute included angle is larger than the second acute included angle.

In one embodiment, the image acquisition module comprises at least two image acquisition channels; the image acquisition module also comprises a third image acquisition channel;

a first acute included angle is formed between the optical axis of the first image acquisition channel and the normal of the surface of the detection area of the object to be detected;

a third acute included angle is formed between the optical axis of the third image acquisition channel and the normal line of the surface of the detection area of the object to be detected, and the third acute included angle is the same as the first acute included angle;

the lens plane of the objective lens of the third image acquisition channel is parallel to the photosensitive surface of the image sensor or has an acute included angle.

In an embodiment, the optical axes of each image capturing channel included in the image acquiring module are located on the same plane, the plane where the optical axis of each image capturing channel is located is a channel plane, and the channel plane is perpendicular to or coplanar with the incident plane of the detection light.

In an embodiment, the image acquisition module includes a field of view of each image acquisition channel covering a same point preset in the detection area of the analyte.

According to the embodiment, the detection device comprises the light source module, the image acquisition module and the object stage, wherein the object stage is used for bearing the object to be detected, the light source module is used for providing detection light for the detection area of the object to be detected, and the image acquisition module is used for acquiring the image of the detection area. The image acquisition module comprises at least one image acquisition channel, each image acquisition channel comprises an image sensor and an objective lens, the image acquisition module comprises at least one image acquisition channel, the image acquisition module comprises a first image acquisition channel, and the lens plane of the objective lens and the plane where the photosensitive surface of the image sensor is located intersect on the same straight line. Because in the image acquisition module, a viewing channel of an image acquisition channel meets the Schlemm's law, the detection area of the object to be detected is within the depth of field of the image acquisition channel, and the definition of the detected image is further improved, so that the detection effect is improved.

In one embodiment, the images of the same detection area are acquired simultaneously through a plurality of image acquisition channels, so that the detection is more accurate.

Furthermore, the rectangular light spots are used for scanning the object to be detected, so that the detection speed can be improved; the image sensor is a time delay integral sensor, and the time delay integral sensor acquires a final detection image through the integral of a plurality of images with time delay, so that the contrast of the detection image can be improved; the time delay integral sensor is a two-dimensional sensor, a straight line intersecting a plane where a lens plane of the objective lens of the first image acquisition channel and a light sensing surface of the image sensor are located is parallel to the long side direction of the rectangular light spot, so that a detection area can accord with the Schlemm's law in the direction perpendicular to the extension direction of the linear light spot, the contrast of an image formed by the sensor in the direction perpendicular to the straight line direction can be improved, and the contrast of the detection image after image integration is improved in a multiplied mode.

Drawings

FIG. 1 is a schematic diagram of an exemplary embodiment of a detection device;

FIG. 2 is a schematic diagram of a light source module according to an embodiment;

FIG. 3 is a schematic diagram of an embodiment of an image capture module;

fig. 4 is a schematic structural diagram of a detection device in another embodiment.

Detailed Description

The present application will be described in further detail below with reference to the accompanying drawings by way of specific embodiments. Wherein like elements in different embodiments are numbered with like associated elements. In the following description, numerous details are set forth in order to provide a better understanding of the present application. However, those skilled in the art will readily recognize that some of the features may be omitted or replaced with other elements, materials, methods in different instances. In some instances, certain operations related to the present application have not been shown or described in detail in order to avoid obscuring the core of the present application from excessive description, and it is not necessary for those skilled in the art to describe these operations in detail, so that they may be fully understood from the description in the specification and the general knowledge in the art.

Furthermore, the features, operations, or characteristics described in the specification may be combined in any suitable manner to form various embodiments. Also, the various steps or actions in the method descriptions may be transposed or transposed in order, as will be apparent to one of ordinary skill in the art. Thus, the various sequences in the specification and drawings are for the purpose of describing certain embodiments only and are not intended to imply a required sequence unless otherwise indicated where such sequence must be followed.

The numbering of the components as such, e.g., "first", "second", etc., is used herein only to distinguish the objects as described, and does not have any sequential or technical meaning. The term "connected" and "coupled" when used in this application, unless otherwise indicated, includes both direct and indirect connections (couplings).

The wafer surface defect detection is to detect whether the wafer surface has defects such as grooves, particles, scratches and the like and the positions of the defects before or during the preparation of the chip. At present, the common technique for detecting the surface defects of the wafer is an optical detection technique, which has the advantages of high detection speed, no pollution and the like. However, the existing optical detection technology has the main disadvantages of relatively slow detection speed and long time consumption. Dark field scanning is an important method for detecting defects on the surface of a wafer, the defects on the surface of the wafer are detected in two incidence modes of oblique incidence and normal incidence according to different images of the different defects under the irradiation of light beams with different incidence angles, a non-imaging point scanning mode is generally adopted to realize the dark field detection of the defects, but the point scanning detection speed is slower. The reason for the slow speed is that the optical axis of the image acquisition channel is not perpendicular to the plane of the detection area of the wafer, so that it is difficult to ensure that the detection area of the wafer to be detected is within the field depth range of the image sensor.

In the embodiment of the application, the image of the detection area is acquired through at least one image acquisition channel, wherein the view finding channel of one image acquisition channel meets the Schlemm's law, so that the detection area of the object to be detected is within the depth of field of the image acquisition channel, the image definition is improved, and the detection effect is further improved.

The first embodiment is as follows:

referring to fig. 1, a schematic structural diagram of a detection apparatus in an embodiment is shown, the detection apparatus includes a light source module 1, an image obtaining module 2, and a stage 3. The object stage 3 is used for carrying an object to be tested, and the light source module 1 is used for providing detection light to the detection area 41 of the object to be tested 4. The image acquisition module 2 is used for acquiring an image of the detection area 41 of the object 4 to be detected. The image acquisition module 2 comprises at least one image acquisition channel, each image acquisition channel comprising an image sensor and an objective lens. The objective lens is used for imaging the detection area 41 of the object 4 on the photosensitive surface of the image sensor, so that the image sensor acquires an image of the detection area 41 of the object 4. Among the at least one image capturing channel included in the image capturing module 2, a first image capturing channel 21 is included. The mirror plane 213 of the objective lens 212 of the first image capturing channel 21 intersects with the plane of the photosensitive surface 214 of the image sensor 211 on the same straight line L. The lens plane 213 of the objective lens 212 is a plane passing through the center point of the objective lens 212 and perpendicular to the optical axis. In one embodiment, the image sensor of the image acquisition channel is a two-dimensional image sensor. Specifically, the image sensor of the image acquisition channel is a time delay integration sensor, and a straight line intersecting a plane where the mirror plane and the photosensitive surface of the image sensor are located is parallel to the extending direction of the linear light spot. The integration direction of the time delay integration sensor is perpendicular to a straight line L where the mirror plane 213 intersects the plane of the light-sensing surface 214 of the image sensor 211. In this embodiment, the image capturing module 2 may further include a plurality of image capturing channels, wherein the mirror plane 213 of the objective lens 212 intersects with a plane of the photosensitive surface 214 of the image sensor 211.

In one embodiment, the stage 3 includes a carrying device for carrying the object 4, and the plane 215 of the detection area of the object 4, the lens plane 213 of the objective lens, and the plane 214 of the image sensor 211 of the first image capturing channel 21 intersect with each other on the same straight line L.

In one embodiment, the image acquisition module comprises at least two image acquisition channels and further comprises a second image acquisition channel 22, wherein the light-sensitive surface of the image sensor of the second image acquisition channel 22 is parallel to the lens plane of the objective lens. In other embodiments, the detection means may comprise only one image acquisition channel, i.e. only the first image acquisition channel.

Referring to fig. 2, which is a schematic structural diagram of a light source module in an embodiment, the light source module 1 is used for outputting detection light irradiated to a detection area 41 of an object 4 to be detected, and includes a detection light source 11, a first incident assembly 12, and a second incident assembly 13. The first incident assembly 12 is used for making the light of the detection light source 11 form the detection light and making the detection light vertically incident on the detection area 41 of the object 4, and the second incident assembly 13 is used for making the light of the detection light source 11 form the detection light and making the detection light obliquely incident on the detection area 41 of the object 4. In one embodiment, the detection light source 11 forms a linear light spot on the detection area 41 of the object 4 through the first incident assembly 12 and/or the second incident assembly 13. In one embodiment, a line intersecting the plane of the lens plane 213 of the objective lens of the first image capturing channel 21 and the plane of the light sensing surface 214 of the image sensor is parallel to the extending direction of the linear light spot.

In an embodiment, the detection light source 11 forms a rectangular light spot on the detection area 41 of the object 4 through the first incident assembly and/or the second incident assembly, and specifically, the rectangular light spot is a linear light spot or a square light spot. In one embodiment, the image sensor of the image capturing channel is a time delay integration sensor, and the integration direction of the time delay integration sensor is perpendicular to a straight line L intersecting the mirror plane 213 and the plane where the photosensitive surface 214 of the image sensor 211 is located. In this embodiment, because the object to be detected is scanned by the rectangular light spot, the detection speed can be increased, the image sensor is a time delay integral sensor, and the time delay integral sensor obtains a final detection image by integrating a plurality of images with time delay, so that the contrast of the detection image can be increased. The time delay integral sensor is a two-dimensional sensor, and because the straight line intersecting the plane where the lens plane of the objective lens of the first image acquisition channel and the photosensitive surface of the image sensor are located is parallel to the long side direction of the rectangular light spot, the detection area can accord with the Schlemm's law in the extending direction perpendicular to the rectangular light spot, so that the contrast of the image formed by the sensor in the vertical direction along the rectangular light spot is improved, and the contrast of the detection image after image integration is improved in a multiplied manner. The extension direction of the linear light spot is perpendicular to the long side direction of the linear light spot, wherein the straight line of intersection of the lens plane of the objective lens of the first image acquisition channel and the plane of the light sensing surface of the image sensor is parallel to the extension direction of the linear light spot. When the rectangular light spot is a square light spot, the long side refers to any one side of the square light spot. In one embodiment, the image sensor includes a plurality of rows and a plurality of columns of pixels, specifically, 1048 × 1048 pixels and 1048 × 532 pixels.

In an embodiment, the light source module 1 further includes a light path switching component 14, and the light path switching component 14 is configured to transmit the light of the detection light source 11 to the first incident component 12 or the second incident component 13. In one embodiment, the detection light source 11 includes a first light source and a second light source, the first incident component is used for vertically irradiating the light of the first light source to the detection area of the object to be detected, and the second incident component is used for obliquely irradiating the light of the second light source to the detection area of the object to be detected.

Referring to fig. 3, a schematic structural diagram of an image acquisition module in an embodiment is shown, where the image acquisition module includes a plurality of image acquisition channels, and in an embodiment, the detection image acquisition module includes a first image acquisition channel 21, a second image acquisition channel 22, a third image acquisition channel 23, a fourth image acquisition channel 24, and a fifth image acquisition channel 25. The lens plane 213 of the objective lens 212 of the first image capturing channel 21, the photosensitive surface 214 of the image sensor 211, and the plane 215 where the detection area 41 of the object 4 is located intersect with each other on the same straight line L, and the first image capturing channel 21 satisfies the schemer's law, so that the detection area 41 of the object 4 is within the depth of field of the first image capturing channel 21. In an embodiment, the focusing point of the image acquisition of the first image acquisition channel 21, the second image acquisition channel 22, the third image acquisition channel 23, the fourth image acquisition channel 24 and the fifth image acquisition channel 25 is the central point of the detection area 41 of the object 4. In one embodiment, a first acute included angle α is formed between the optical axis 216 of the first image capturing channel 21 and the normal 210 of the surface of the detecting region 41 of the object 4. A second acute included angle β is formed between the optical axis 217 of the second image collecting unit 22 and the normal of the surface of the detection area 41 of the object 4 to be detected, and the first acute included angle α is larger than the second acute included angle β. Because first image acquisition channel 21 satisfies the samm's law, so first acute included angle alpha can be greater than second acute included angle beta, then first image acquisition channel 21 and second image acquisition channel 22 can not shelter from each other and influence on spatial position, therefore image acquisition module can set up a plurality of image acquisition channels to these image acquisition channels can detect image acquisition simultaneously, and do not influence each other. In other embodiments, the lens plane of the objective lens of the second image capturing channel 22 intersects the plane of the photosensitive surface of the image sensor in the same straight line.

In an embodiment, a third acute angle γ is formed between the optical axis 218 of the third image capturing channel 23 of the image capturing module and the normal 210 of the surface of the detecting region 41 of the object 4, and the third acute angle γ is the same as the first acute angle α, wherein the lens plane of the objective lens of the third image capturing channel 23 is parallel to the photosensitive surface of the image sensor or has an acute angle. Because the included angles between the optical axes of the first image collecting channel 21 and the third image collecting channel 23 and the surface normal 210 of the detection area 41 of the object 4 to be detected are the same, images of different monitoring areas can be obtained under the same angle, that is, images of the monitoring areas under different depth of field conditions can be obtained, so that the detection is more accurate and reliable. In one embodiment, the image acquisition module includes a field of view area of each image capturing channel covering a same point preset in the detection area 41 of the object 4. In other embodiments, the mirror plane of the objective lens of the third image capturing channel 23 intersects the plane of the photosensitive surface of the image sensor in the same straight line. Specifically, in this embodiment, the centers of the field of view of each image capturing channel included in the image capturing module are all overlapped.

The application discloses detection device, including light source module, image acquisition module and objective table, the objective table is used for bearing the determinand, and light source module is used for providing detection light to the detection area of determinand, and image acquisition module is used for acquireing detection area's image. The image acquisition module comprises at least one image acquisition channel, each image acquisition channel comprises an image sensor and an objective lens, the image acquisition module comprises at least one image acquisition channel, the image acquisition module comprises a first image acquisition channel, and the lens plane of the objective lens and the plane where the photosensitive surface of the image sensor is located intersect on the same straight line. In the image acquisition module, a view finding channel of an image acquisition channel meets the Schlemm's law, so that the detection area of the object to be detected is within the depth of field of the image acquisition channel, the image definition is further improved, and the detection effect is improved.

When the photosensitive surface of the image sensor of the image acquisition channel is parallel to the lens plane of the objective lens, the area within the range of the depth of field of the image acquisition channel is a cylindrical area with a generatrix parallel to the image acquisition channel, the width difference of the detection area within the image acquisition channel is h/sin alpha, h is the depth of field of the first image acquisition channel, and alpha is the included angle between the optical axis of the image acquisition channel and the normal of the detection area. The larger alpha, the smaller the width of the detection region within the image acquisition channel. When the first acute included angle is large, and the plane of the photosensitive surface of the image sensor of the image acquisition channel, the lens plane of the objective lens and the plane of the detection area are compared with the same straight line, the area in the range of the depth of field is the area between the two planes which take the same straight line as an intersection line and take the plane of the detection area as an angular bisector, so that the detection area can be in the range of the depth of field. Therefore, the lens plane of the objective lens of the first image acquisition channel and the plane where the photosensitive surface of the image sensor is located are intersected on the same straight line, and the detection precision can be effectively improved on the premise of saving space and equipment cost. In embodiments, the first acute included angle is 55 ° to 85 °, and the second acute included angle is 10 ° to 40 °. Specifically, the first acute included angle is 15 °, 20 °, 25 ° or 30 °, and the second acute included angle is 60 ° or 75 °.

Example two:

referring to fig. 4, which is a schematic structural diagram of the detection apparatus in another embodiment, an image acquisition module of the detection apparatus includes a first image acquisition channel 21, a second image acquisition channel 22, a fourth image acquisition channel 24, and a fifth image acquisition channel 25, a light source module includes a detection light source 11 and a second incidence component 13, and the second incidence component 13 is used for making light of the detection light source 11 form detection light and obliquely enter a detection area 41 of the object to be detected 4. In this embodiment, the light source module may further include a first incidence component, and the first incidence component enables the detection light to be incident to the surface of the object to be detected perpendicularly.

In an embodiment, the optical axes of each image capturing channel included in the image capturing module are located on the same plane, and the plane where the optical axis of each image capturing channel is located is a channel plane. In one embodiment, the channel plane is coplanar with the incident plane of the light of the detection light source, i.e. the optical axis 216 of the first image capturing channel 21, the optical axis 217 of the second image capturing channel 22, the optical axis 218 of the fourth image capturing channel 24 and the optical axis 219 of the fifth image capturing channel 25 are all located on the same channel plane, which is coplanar with the incident plane of the detection light. In other embodiments, the optical axis of each image capturing channel included in the image capturing module is located in the same channel plane, and the channel plane is perpendicular to the incident plane of the light of the detection light source, that is, the optical axis 216 of the first image capturing channel 21, the optical axis 217 of the second image capturing channel 22, the optical axis 218 of the fourth image capturing channel 24, and the optical axis 219 of the fifth image capturing channel 25 are all located in the same channel plane, and the channel plane is perpendicular to the incident plane of the detection light. As shown in fig. 4, when the channel plane where the optical axis of each image capturing channel is located is perpendicular to the incident plane of the detecting light, the first image capturing channel 21, the second image capturing channel 22, the fourth image capturing channel 24, and the fifth image capturing channel 25 can acquire images of the monitoring area under different depth of field conditions, so that the detection is more accurate and reliable.

In one embodiment, the detection device further comprises an upper computer, and the upper computer is used for acquiring the image of the detection area acquired by the image acquisition module and detecting the quality of the object to be detected according to the image of the detection area.

In an embodiment of the present application, the image obtaining module includes a plurality of image capturing channels, so that an included angle is formed between a lens plane of the objective lens of one of the image capturing channels and a plane where the photosensitive surface of the image sensor is located, and the lens plane of the objective lens of the image capturing channel, the plane where the photosensitive surface of the image sensor is located and a plane where the detection area is located intersect in a same straight line, so that the viewing channel of the image capturing channel satisfies the schem's law, and thus the detection area is located within the depth of field of the image capturing channel, and the image definition is improved. In another embodiment of the present application, when the image acquisition module includes two image acquisition channels with different inclination angles, that is, included angles between optical axes of the two image acquisition channels and a surface normal of the detection area are different, a mirror plane of an objective lens of the image acquisition channel with a larger inclination angle, a plane where a photosensitive surface of the image sensor is located, and a plane where the detection area is located intersect with the same straight line, so that the detection area is located within a depth of field, and image sharpness is improved. In other embodiments of the present application, when the image acquisition module includes two image acquisition channels with the same inclination angle, that is, the included angles between the optical axes of the two image acquisition channels and the surface normal of the detection area are the same, the lens plane of the objective lens of one of the image acquisition channels, the plane where the photosensitive surface of the image sensor is located, and the plane where the detection area is located intersect in the same straight line.

The present invention has been described in terms of specific examples, which are provided to aid understanding of the present application and are not intended to be limiting of the present application. For a person skilled in the art to which the application pertains, several simple deductions, modifications or substitutions may be made according to the idea of the application.

Claims

1. The detection device is characterized by comprising a light source module, an image acquisition module and an object stage;

the object stage is used for bearing an object to be tested;

2. The inspection apparatus of claim 1, wherein the light source module comprises an inspection light source, a first incident assembly and a second incident assembly; the first incidence assembly is used for enabling the light of the detection light source to form the detection light and enabling the detection light to be vertically incident to the detection area of the object to be detected; the second incidence assembly is used for enabling the light of the detection light source to form the detection light and enabling the detection light to be obliquely incident to the detection area of the object to be detected.

3. The detection device of claim 2, wherein the image sensor is a two-dimensional image sensor; and/or the image sensor is a time delay integration sensor; the integral direction of the time delay integral sensor is vertical to a straight line which is intersected by the plane of the mirror plane and the plane of the light sensing surface of the image sensor.

4. The detection device according to claim 3, wherein the detection light source forms a rectangular light spot on the detection area of the object to be detected through the first incidence component and/or the second incidence component;

5. The detection apparatus according to claim 2, wherein the light source module further comprises a light path switching component, and the light path switching component is configured to enable light of the detection light source to propagate to the first incidence component or the second incidence component;

6. The inspection device of claim 1, wherein the stage includes a carrier for carrying the object to be inspected and causing a plane of an inspection area of the object to be inspected, a plane of a lens of the objective lens of the first image capturing channel and a plane of a photosensitive surface of the image sensor of the first image capturing channel to intersect in a same straight line.

7. The detection apparatus as claimed in claim 1, wherein the image acquisition module comprises at least two image acquisition channels; the image acquisition module further comprises a second image acquisition channel, and a light sensing surface of an image sensor of the second image acquisition channel is parallel to a lens plane of the objective lens.

8. The detecting device for detecting the rotation of a motor rotor according to the claim 7, wherein a first acute included angle is formed between the optical axis of the first image collecting channel and the normal of the surface of the detecting area of the object to be detected; and a second acute included angle is formed between the optical axis of the second image acquisition unit and the normal line of the surface of the detection area of the object to be detected, and the first acute included angle is larger than the second acute included angle.

9. The detection apparatus as claimed in claim 1, wherein the image acquisition module comprises at least two image acquisition channels; the image acquisition module also comprises a third image acquisition channel;

10. The detecting device according to any one of claims 7, 8 or 9, wherein the optical axes of each image capturing channel included in the image capturing module are located on the same plane, the plane where the optical axes of the image capturing channels are located is a channel plane, and the channel plane is perpendicular to or coplanar with the incident plane of the detecting light.

11. The detecting device for detecting the objects according to claim 1, wherein the image acquiring module includes a field of view of each image collecting channel covering a same point preset in the detecting area of the objects.