JPS62274205A - Method and device for inspecting lead flatness - Google Patents

Method and device for inspecting lead flatness

Info

Publication number
JPS62274205A
JPS62274205A JP11738886A JP11738886A JPS62274205A JP S62274205 A JPS62274205 A JP S62274205A JP 11738886 A JP11738886 A JP 11738886A JP 11738886 A JP11738886 A JP 11738886A JP S62274205 A JPS62274205 A JP S62274205A
Authority
JP
Japan
Prior art keywords
lead
inspection
gap
flatness
image signal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11738886A
Other languages
Japanese (ja)
Inventor
Mitsuhiro Momota
Kazuo Toyoda
Toshikazu Oshino
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Renesas Eastern Japan Semiconductor Inc
Original Assignee
Hitachi Tokyo Electronics Co Ltd
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Tokyo Electronics Co Ltd, Hitachi Ltd filed Critical Hitachi Tokyo Electronics Co Ltd
Priority to JP11738886A priority Critical patent/JPS62274205A/en
Publication of JPS62274205A publication Critical patent/JPS62274205A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To improve the accuracy and efficiency of inspection by picking up the image of the gap between a lead and a reference surface and inspecting the flatness.
CONSTITUTION: The image of the gap between the lead 11 of a semiconductor device 2 which consists of a package body 10 having a semiconductor pellet 9 molded out of synthetic resin and the lead 11 and a stage surface 4a as the reference surface of an inspection state 4 is picked up by a TV camera 5 and a light-dark image signal is obtained through lighting 3. This image signal is processed by an image signal processing part 12 to calculate the lead flatness from the gap (d) and perform automatic inspection, thereby improving the accuracy and efficiency of the lead inspection.
COPYRIGHT: (C)1987,JPO&Japio
JP11738886A 1986-05-23 1986-05-23 Method and device for inspecting lead flatness Pending JPS62274205A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11738886A JPS62274205A (en) 1986-05-23 1986-05-23 Method and device for inspecting lead flatness

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11738886A JPS62274205A (en) 1986-05-23 1986-05-23 Method and device for inspecting lead flatness

Publications (1)

Publication Number Publication Date
JPS62274205A true JPS62274205A (en) 1987-11-28

Family

ID=14710413

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11738886A Pending JPS62274205A (en) 1986-05-23 1986-05-23 Method and device for inspecting lead flatness

Country Status (1)

Country Link
JP (1) JPS62274205A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0255106U (en) * 1988-10-14 1990-04-20
JPH03137502A (en) * 1989-10-23 1991-06-12 Matsushita Electron Corp Inspecting apparatus
JPH04157744A (en) * 1990-10-20 1992-05-29 M I Technol:Kk Method for measuring floating of lead pin of flat-package type ic
JPH04157743A (en) * 1990-10-20 1992-05-29 M I Technol:Kk Method for measuring floating of lead pin of flat-package type ic

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0255106U (en) * 1988-10-14 1990-04-20
JPH03137502A (en) * 1989-10-23 1991-06-12 Matsushita Electron Corp Inspecting apparatus
JPH04157744A (en) * 1990-10-20 1992-05-29 M I Technol:Kk Method for measuring floating of lead pin of flat-package type ic
JPH04157743A (en) * 1990-10-20 1992-05-29 M I Technol:Kk Method for measuring floating of lead pin of flat-package type ic

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