JPS55165641A - Device for bonding pellet - Google Patents

Device for bonding pellet

Info

Publication number
JPS55165641A
JPS55165641A JP7228879A JP7228879A JPS55165641A JP S55165641 A JPS55165641 A JP S55165641A JP 7228879 A JP7228879 A JP 7228879A JP 7228879 A JP7228879 A JP 7228879A JP S55165641 A JPS55165641 A JP S55165641A
Authority
JP
Japan
Prior art keywords
pellet
hole
holder
mounting section
sucked
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7228879A
Other languages
Japanese (ja)
Inventor
Masakazu Ozawa
Tatsuo Sugimoto
Shunei Uematsu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP7228879A priority Critical patent/JPS55165641A/en
Publication of JPS55165641A publication Critical patent/JPS55165641A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor

Abstract

PURPOSE:To perform accurate positioning and improve the yield of bonding, by vibrating a positioning hole in putting a pellet into the hole. CONSTITUTION:When a pellet 2 is put into the positioning hole 6 of a holder 5, the holder is vibrated so that the pellet staying on the slope of the hole 6 is quickly moved to its bottom. When the entire bottom surface of the pellet comes into contact with the bottom of the positioning hole, the pellet 2 is vacuum-sucked through a hole 10. A collet 8 is then moved to a place over the holder 5, sucks the pellet, conveys it to a pellet mounting section 9 and rubs the pellet thereon so that it is fixed on the mounting section. Since the pellet is accurately positioned on the bottom of the hole 6 by the vibration for a prescribed time, the pellet is sucked by the collect without being damaged and is fixed with desired accuracy on the mounting section. This results in greatly reducing defects.
JP7228879A 1979-06-11 1979-06-11 Device for bonding pellet Pending JPS55165641A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7228879A JPS55165641A (en) 1979-06-11 1979-06-11 Device for bonding pellet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7228879A JPS55165641A (en) 1979-06-11 1979-06-11 Device for bonding pellet

Publications (1)

Publication Number Publication Date
JPS55165641A true JPS55165641A (en) 1980-12-24

Family

ID=13484934

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7228879A Pending JPS55165641A (en) 1979-06-11 1979-06-11 Device for bonding pellet

Country Status (1)

Country Link
JP (1) JPS55165641A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5850751A (en) * 1981-09-22 1983-03-25 Shinkawa Ltd Replacing method for die
FR2672427A1 (en) * 1991-02-04 1992-08-07 Schiltz Andre METHOD AND DEVICE FOR INSERTING CHIPS INTO HOUSINGS OF A SUBSTRATE BY INTERMEDIATE FILM.
JP2015211188A (en) * 2014-04-30 2015-11-24 株式会社春日工作所 Positioning device and semiconductor inspection device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5310968A (en) * 1976-07-19 1978-01-31 Hitachi Ltd Pellet bonding method
JPS53148970A (en) * 1977-06-01 1978-12-26 Hitachi Ltd Positioning device for minute parts

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5310968A (en) * 1976-07-19 1978-01-31 Hitachi Ltd Pellet bonding method
JPS53148970A (en) * 1977-06-01 1978-12-26 Hitachi Ltd Positioning device for minute parts

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5850751A (en) * 1981-09-22 1983-03-25 Shinkawa Ltd Replacing method for die
JPS6243542B2 (en) * 1981-09-22 1987-09-14 Shinkawa Kk
FR2672427A1 (en) * 1991-02-04 1992-08-07 Schiltz Andre METHOD AND DEVICE FOR INSERTING CHIPS INTO HOUSINGS OF A SUBSTRATE BY INTERMEDIATE FILM.
JP2015211188A (en) * 2014-04-30 2015-11-24 株式会社春日工作所 Positioning device and semiconductor inspection device

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