JPS57147245A - Positioning method and device for chip bonding - Google Patents

Positioning method and device for chip bonding

Info

Publication number
JPS57147245A
JPS57147245A JP3161981A JP3161981A JPS57147245A JP S57147245 A JPS57147245 A JP S57147245A JP 3161981 A JP3161981 A JP 3161981A JP 3161981 A JP3161981 A JP 3161981A JP S57147245 A JPS57147245 A JP S57147245A
Authority
JP
Japan
Prior art keywords
substrate
chip
tool
monitor
positioning method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3161981A
Other languages
Japanese (ja)
Other versions
JPH0131296B2 (en
Inventor
Noboru Fujino
Seiichi Chiba
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Shinkawa Seisakusho Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd, Shinkawa Seisakusho Co Ltd filed Critical Shinkawa Ltd
Priority to JP3161981A priority Critical patent/JPS57147245A/en
Publication of JPS57147245A publication Critical patent/JPS57147245A/en
Publication of JPH0131296B2 publication Critical patent/JPH0131296B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE:To position a chip to a substrate at an isolated position by producing the substrate and the chip as two images by two cameras, synthesizing into a monitor for outputting. CONSTITUTION:A substrate 1 placed on a substrate positioning base 20 and a chip 2 attracted to a bonding tool 23 are produced as videos by detecting cameras 21, 22, and are synthesized by a monitor. Then, the tool 23 is moved to coincide with the substrate 1 to the position of the chip on the screen of the monitor. When the tool 23 is moved in the predetermined distance, the tool can be positioned directly above the substrate 1.
JP3161981A 1981-03-05 1981-03-05 Positioning method and device for chip bonding Granted JPS57147245A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3161981A JPS57147245A (en) 1981-03-05 1981-03-05 Positioning method and device for chip bonding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3161981A JPS57147245A (en) 1981-03-05 1981-03-05 Positioning method and device for chip bonding

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP26044988A Division JPH02249242A (en) 1988-10-18 1988-10-18 Alignment of chip bonding

Publications (2)

Publication Number Publication Date
JPS57147245A true JPS57147245A (en) 1982-09-11
JPH0131296B2 JPH0131296B2 (en) 1989-06-26

Family

ID=12336224

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3161981A Granted JPS57147245A (en) 1981-03-05 1981-03-05 Positioning method and device for chip bonding

Country Status (1)

Country Link
JP (1) JPS57147245A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60121733A (en) * 1984-07-31 1985-06-29 Shinkawa Ltd Inner lead bonder
JPS6169139A (en) * 1984-09-13 1986-04-09 Toshiba Seiki Kk Identifying device in pellet bonding device
JPS63178540A (en) * 1987-01-20 1988-07-22 Seiko Instr & Electronics Ltd Correcting method of position of mount for ic mounting device
JP2007103667A (en) * 2005-10-04 2007-04-19 Canon Machinery Inc Die bonder
WO2017009980A1 (en) * 2015-07-15 2017-01-19 ヤマハ発動機株式会社 Model data creation device, model data creation method, mounting reference point determination device, and mounting reference point determination method

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60121733A (en) * 1984-07-31 1985-06-29 Shinkawa Ltd Inner lead bonder
JPH0151055B2 (en) * 1984-07-31 1989-11-01 Shinkawa Kk
JPS6169139A (en) * 1984-09-13 1986-04-09 Toshiba Seiki Kk Identifying device in pellet bonding device
JPH0584055B2 (en) * 1984-09-13 1993-11-30 Toshiba Seiki Kk
JPS63178540A (en) * 1987-01-20 1988-07-22 Seiko Instr & Electronics Ltd Correcting method of position of mount for ic mounting device
JP2007103667A (en) * 2005-10-04 2007-04-19 Canon Machinery Inc Die bonder
JP4593429B2 (en) * 2005-10-04 2010-12-08 キヤノンマシナリー株式会社 Die bonder
WO2017009980A1 (en) * 2015-07-15 2017-01-19 ヤマハ発動機株式会社 Model data creation device, model data creation method, mounting reference point determination device, and mounting reference point determination method
JPWO2017009980A1 (en) * 2015-07-15 2018-02-08 ヤマハ発動機株式会社 Model data creation device, model data creation method, mounting reference point determination device, mounting reference point determination method
CN107926148A (en) * 2015-07-15 2018-04-17 雅马哈发动机株式会社 Model data generating means, the generation method of model data, carry datum mark determination device and carry the determining method of datum mark
US10354036B2 (en) 2015-07-15 2019-07-16 Yamaha Hatsudoki Kabushiki Kaisha Model data generation device, method of generating model data, mounting reference point determination device, and method of determining mounting reference point
CN107926148B (en) * 2015-07-15 2019-11-26 雅马哈发动机株式会社 Model data generating means and method carry datum mark determination device and method

Also Published As

Publication number Publication date
JPH0131296B2 (en) 1989-06-26

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