JPH0584055B2 - - Google Patents

Description

TECHNICAL FIELD OF THE INVENTION The present invention relates to a pellet bonding apparatus, and more particularly to a pellet bonding apparatus having a recognition device.

[Technical Background of the Invention] One of the semiconductor manufacturing processes is to sequentially hold pellets from a pellet supply position using a suction holder called a collect, then transport the pellets to a substrate such as a lead frame, and fix the pellets at a predetermined position on the substrate. There is a bonding process. A pellet bonding device is used in this process. An example of this is shown in FIG. 2, a part of which is shown as a block diagram. In the figure, 1 is an XY table installed at the pellet supply position, and a bracket 2 is placed on this XY table 1.
is fixedly placed. Note that the XY table 1 can be moved in the XY directions by an X-axis drive motor 1x and a Y-axis drive motor 1y, respectively. A cassette ring 4 having a number of pellets 3 is held horizontally in the bracket 2. Reference numeral 5 denotes a substrate, such as a lead frame, to which the pellets 3 transported to the bonding position are bonded, and is intermittently transported along a transport guide 7 provided with a guide groove 6 by a transport mechanism (not shown). Reference numeral 8 denotes a collet that adsorbs and releases the pellets 3 as appropriate, and is provided at one end of a collet arm 10 supported by an arm support 9, and the other end is driven by a drive device (not shown) provided within the arm support 9. The suction nozzle 8a of the collet 8 reciprocates between the pellet supply position and the bonding position with respect to the arm support 9.
It is driven to move up and down on the top. The arm support 9 is also provided on an XY table 11, and is connected to an X-axis drive motor 11x and a Y-axis drive motor 11.
By driving y, the arm support 9, the collect arm 10, and the collect 8 are integrally moved to XY.
be moved in the direction

Above the pellet supply position and the bonding position, a first imager 12 and a second imager 13 are provided, each having an optical axis at each position.
The first imager 12 captures an image of the pellet 3 that has reached the pellet supply position by moving the XY table 1, and the second imager 13 transports the pellet 3 along the transport guide 7 by a transport mechanism (not shown). Then, an image of the substrate 5 positioned at the bonding position, particularly an image of the bonding location where the pellet 3 is bonded, is captured. Note that the imager 1
As 2 and 13, a photo array, ITV camera, etc. are used. The image signal captured by the first imager 12 is converted into a signal by the first imager control circuit 14, and then sent to the first monitor 15 and the first recognition device 1.
6 and the first recognition device 16 recognizes the pellet 3.
Information such as the presence or absence of defective marks, the presence or absence of cracks, the amount of positional deviation with respect to the pellet feeding position, etc. is automatically detected. On the other hand, the image signal captured by the second imager 13 is similarly converted into a signal by the second imager control circuit 17, and then inputted to the second monitor 18 and the second recognition device 19. The recognition device 19 automatically detects information about the substrate 5, such as the amount of positional deviation with respect to the bonding position. Although the method for detecting information on the pellet 3 and the substrate 5 will not be described in detail here, automatic detection is possible by a known method such as a pattern matching method. The information on the pellets 3 and the substrate 5 thus obtained is input to a control device 20, which controls the pellet bonding apparatus.

Now, in such a configuration, pellets 3 are sequentially supplied to the pellet supply position by the movement of the XY table 1. The first imager 12 captures an image of the pellet 3 that has reached the pellet supply position, and its signal is input to the first monitor 15 and first recognition device 16 via the first imager control circuit 14. The first recognition device 16 determines whether the pellet 3 is a good product or a defective product, and if it is a good product, the amount of deviation from the pellet supply position is further detected. This detected value is sent to the control device 20, and if it is a defective product, the next pellet is positioned at the pellet supply position, and if it is a good product but there is a deviation from the pellet supply position, the deviation is zeroed. so that the X-axis drive motor 1
A signal is sent to the x and Y axis drive motors 1y. If the cassette ring 4 is made rotatably adjustable with respect to the bracket 2, it is possible to correct any deviation in the rotational direction of the pellets 3 that have reached the pellet supply position. After this correction is completed, the pellet 3 is sucked and held by the pellet 8.

On the other hand, the substrate 5 is transported to the bonding position. The second imager 13 captures an image of the substrate 5 that has reached the bonding position, and its signal is input to the second monitor 18 and second recognition device 19 via the second imager control circuit 17. 2 recognition device 1
At step 9, the amount of deviation of the substrate 5 from the bonding position is detected and input to the control device 20. Thereupon, the collet 8 holding the pellet 3 by suction is moved to above the bonding position by a drive device (not shown) provided in the arm support 9. Here, the amount of deviation detected by the second recognition device 19 is
The X-axis drive motor 11x and Y-axis drive motor 11y of the XY table 11 are further driven, and the collector 8
After this correction, the collet 8 is lowered and the pellet 3 is bonded to the bonding position of the substrate 5.

[Problems in the Background Art] In the pellet bonding apparatus described above, the pellets supplied to the pellet supply position,
In addition, since bonding is performed based on information about the substrate being transported and positioned at the bonding position, extremely accurate bonding work can be performed. However, the imager 1 provided at the pellet supply position and the bonding position
Since recognition devices 16 and 19 are provided for each of the pellet bonding devices 2 and 13, a large space must be taken up to install these two recognition devices in the pellet bonding device, resulting in an increase in the size of the entire device. . Furthermore, the cost is high because two recognition devices are required.

[Object of the Invention] The present invention has been made in order to eliminate the above-mentioned drawbacks of the conventional method. It is possible to perform extremely accurate pellet bonding work in the same way as in the conventional method, and to create pellets that are relatively inexpensive and can be miniaturized. An object of the present invention is to provide a recognition device for a bonding device.

[Embodiment of the Invention] An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 shows a pellet bonding apparatus to which the present invention is applied, some of which are shown in block diagram form, and the same parts as in FIG. 2 are given the same numbers and their explanations will be omitted. The difference from FIG. 2 is that only one recognition device is provided. 30 is the recognition device. The image signal of the pellet 3 from the first imager 12 is input to the recognition device 30 via the first imager control circuit 14, and the image signal of the substrate 5 from the second imager 13 is inputted to the recognition device 30. is inputted via the imager control circuit 17 of the camera. The recognition device 30 includes a switching means 31, and the switching means 31 selectively selects one of the signals inputted from the first and second imager control circuits 14 and 17 into the recognition device 30. take in. A switching signal for actuating the switching means 31 is programmed in the control device 20 and is transmitted from the control device 20. The switching means 31 switches the signal from the first imager control circuit 14 to the recognition device 3.
If 0 is entered, the first
Similarly to the recognition device 16, information on the pellets 3 supplied to the pellet supply position is automatically detected and the detected value is input to the control device 20.

On the other hand, when the signal from the second imager control circuit 17 is input to the recognition device 30 due to the operation of the switching means 31 by the switching signal from the control device 20,
Similar to the second recognition device 19 described in FIG.
Information about the substrate 5 transported to the bonding position is automatically detected, and the detected value is input to the control device 20.

Next, the operation of the above embodiment will be explained. The first imager 12 captures an image of the pellet that has reached the pellet supply position, and the second imager 13 captures an image of the substrate 5 that has been transported to the bonding position. The signal conversion via the second imager control circuit 17 is the same as in the conventional case. Here, both the output signals from the first and second imager control circuits can be input to the recognition device 30. Based on the switching signal from the control device 20, the switching means 31 in the recognition device 30 first takes in the signal from the first imager control circuit 14, detects information on the pellets 3 that have reached the pellet supply position, and performs control. Based on the output from the recognition device 30, the control device 20 drives and controls the X-axis drive motor 1x and the Y-axis drive motor 1y so that non-defective products are positioned at the pellet supply position without deviation. Thereafter, the pellet 3 is held by suction in the collect 8. When the detection of information on pellet 3 at the pellet supply position is completed,
The switching means 31 is switched by a switching signal from the control device 20, and the signal from the second imager control circuit 17 is taken into the recognition device 30, and information on the substrate 5 transported to the bonding position, for example, the amount of displacement is detected. It is also input to the control device 20. Thereafter, the collet 8 holding the pellet 3 by suction is moved to above the bonding position. Thereafter, the X-axis drive motor 11x and Y-axis drive motor 11y of the XY table 11 are further driven by the amount of deviation of the substrate 5 to correct the position of the collect 8. After this correction, the collet 8 descends and transfers the pellet 3 to the substrate 5. Bond to the bonding position.

[Effects of the Invention] According to the present invention, pellet bonding work can be performed extremely accurately, and the equipment for that purpose can be made smaller in size than conventional ones, and the cost can also be significantly reduced.

[Brief explanation of the drawing]

FIG. 1 shows a pellet bonding apparatus to which the present invention is applied, partially shown in a block diagram, and FIG. 2 shows an example of a conventional pellet bonding apparatus, partially shown in a block diagram. 1, 11...XY table, 1x, 11x...
X-axis drive motor, 1y, 11y...Y-axis drive motor, 3...Pellet, 5...Substrate, 8...Collection, 12...First imager, 13...Second imager, 14... ...first imager control circuit, 16...first recognition device, 17...second imager control circuit,
19...Second recognition device, 20...Control device, 3
0...Recognition device, 31...Switching means.

Claims (1)

[Claims] 1 A pellet bonding device that sequentially transports pellets from a pellet supply position to predetermined positions on a substrate for bonding, at least a first imager that captures an image of the supplied pellets;
a second imager that captures an image of the substrate; a first recognition device that automatically detects information about the pellet from the pellet image captured by the first imager;
A recognition device for a pellet bonding apparatus comprising a second recognition device that automatically detects information on the substrate from a substrate image captured by a second image pickup device, wherein the first recognition device and the second recognition device are provided. In addition to using a single recognition device for dual use,
This single confirmation device, the first imager and the second
A switching means is provided between the first image pickup device and the first image pickup device, and the single confirmation device automatically detects pellet information from the pellet image captured by the first image pickup device when connected to the first image pickup device. . A recognition device for a pellet bonding apparatus, characterized in that when connected to the second image pickup device, information about the substrate is automatically detected from a substrate image captured by the second image pickup device.