JPH06177182A - Die bonding device and die bonding method using the device - Google Patents

Abstract

PURPOSE:To promote high speed and high reliability by reducing a load on an operator, a pickup mistake and poor die bonding due to mis-adjustment mistake by the operator at the time of changing a die to another kind. CONSTITUTION:A position sensor detecting the positions in the Z-directions (up and down directions) of a collet 3 is provided, the thickness and the height of a collet 3, the push-up needles 17 and a back-up plate 18 to be exchanged at the time of changing a kind of the die 2 in die bonding are previously measured before die bonding by a position sensor so as to correct a parameter relating to the Z-directions for pick up and die bonding basing on this measurement result.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a die bonding apparatus and a die bonding method using this apparatus, and more particularly to the height of a collet suction surface at the time of picking up a die (semiconductor pellet) and the bonding surface at the time of die bonding. This is to optimize the height of.

[0002]

2. Description of the Related Art Conventionally, in a die bonding apparatus, when the type of die to be bonded is changed, it is determined for each type registered in advance in the die bonding apparatus or a control device such as a computer for controlling this apparatus. Various parameters for die bonding are automatically adjusted according to the parameter data. When the type of die is changed, the collet, push-up needle, backup plate, etc. are selectively exchanged for each type of die. For this reason, the thickness of the replaced collet, the height of the push-up needle and the backup plate are different, and the thickness is different depending on the type of die. At that time, it was necessary to manually adjust the height of the bonding surface and reset it. For this reason, there is a problem that the operator is burdened, time is required for adjustment, and if an adjustment error is made, a die pickup error or a die bonding failure occurs.

[0003]

As described above, the conventional die bonding apparatus and die bonding method are
The operator is burdened when changing the die type,
In addition, there is a problem that the efficiency of die bonding is reduced. Further, if the operator makes an adjustment error, a pickup error or a die-bonding failure will occur, resulting in a problem that the reliability is lowered.

The present invention has been made in view of the above circumstances, and can reduce the burden on the operator and
It is an object of the present invention to provide a die bonding apparatus and a die bonding method using this apparatus, which can reduce pick-up errors and die bonding defects caused by operator's adjustment mistakes and can achieve high speed and high reliability of die bonding.

[0005]

That is, a die bonding apparatus according to a first aspect of the present invention comprises a first moving means for relatively moving the collet and the die in an X direction parallel to the surface of the die, and a die surface. Second moving means for relatively moving the collet and the die in the Y direction which is parallel to the X direction and orthogonal to the X direction, and relatively moves the collet and the die in the Z direction orthogonal to the surface of the die. Third moving means, position detecting means for detecting the position of the collet in the Z direction, a reference stand for setting the position of the collet as a reference in the Z direction, and the first and the first when the die type is changed. The second moving means is controlled to move the collet onto the reference stand, the third moving means is controlled to press the collet against the reference stand, and the collet is detected based on the position information by the position detecting means. Ko And a control means for calculating a thickness of the cartridge and correcting the parameter data related to the Z direction for die pick-up and die bonding according to the calculated thickness of the collet. To do.

According to another aspect of the die bonding apparatus of the present invention, the control means controls the first and second moving means to move the collet onto the backup plate when the die type is changed, and the third means. The moving means is controlled to press the collet against the backup plate, the height of the backup plate is calculated based on the position information by the position detecting means, and the die pickup and the die are detected based on the calculated height information of the backup plate. The correction calculation of the parameter data related to the Z direction for die bonding is further performed.

In the die bonding apparatus according to a third aspect of the present invention, the control means causes the first or
While controlling the second moving means to move the collet onto the push-up needle, and controlling the third moving means to press the collet against the push-up needle, based on the position information by the position detecting means. The height of the push-up needle is calculated, and based on the calculated height information of the push-up needle, the correction calculation of the parameter data relating to the Z direction for the die pickup and die bonding is further performed. .

Further, in the die bonding method of the fourth aspect, a step of exchanging a collet for sucking the die when changing the type of the die and a reference for setting a reference position in the Z direction orthogonal to the surface of the die. A step of measuring the thickness of the collet by pressing the collet against the table and detecting the position in the Z direction, and a Z for picking up and die bonding the die based on the measured thickness information of the collet.
The method is characterized by including a step of correcting parameter data relating to the direction, and a step of setting the position of the collet in the Z direction on the basis of the corrected parameter data and performing die pickup and die bonding.

In the die bonding method according to the fifth aspect, when the die type is changed, the backup plate is replaced, and the height of the backup plate is detected by pressing the collet against the backup plate and detecting the position in the Z direction. And a step of correcting parameter data related to the Z direction for die pickup and die bonding based on the measured height information of the backup plate.

According to a sixth aspect of the present invention, there is provided a die bonding method in which a push-up needle is replaced when a die type is changed and a collet is pressed against the push-up needle to detect a position in the Z direction. And the step of correcting parameter data related to the Z direction for die pick-up and die bonding based on the information on the measured height of the push-up needle. .

[0011]

According to the structure as described in claim 1, the thickness of the collet is measured by using the position detecting means and the reference base when the type of the die is changed, and the die is picked up according to the calculated thickness of the collet. Also, since the parameter data related to the Z direction for die bonding can be corrected, the operator's burden can be reduced, and pick-up mistakes and die bonding defects caused by operator's adjustment mistakes can be reduced, speeding up and high die bonding. Reliability can be achieved.

As described in claims 2 and 3, the height of the backup plate and the push-up needle is further measured by the position detecting means, and Z for picking up and die bonding of the die is based on the height information. If the correction calculation of the parameter data related to the direction is further performed, the die pickup and the die bonding can be performed with higher accuracy.

In the method as described in claim 4, the thickness of the exchanged collet is measured in advance prior to die pick-up and die bonding, and it is related to the Z direction based on the measured thickness information of the collet. Since the parameter data is corrected, it is possible to reduce the burden on the operator, reduce the pick-up error and the die-bonding failure caused by the operator's adjustment error, and speed up the die-bonding and increase the reliability.

As described in claims 5 and 6, prior to the die pick-up and die bonding, the heights of the backup plate and the push-up needle that have been exchanged are further measured, and the height of the die is measured based on these height information. If the parameter data relating to the Z direction for pickup and die bonding is further corrected, the die can be picked up and die bonded with higher accuracy.

[0015]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. FIG. 1 shows a schematic configuration of a die bonding apparatus according to an embodiment of the present invention. In FIG. 1, 1 is a wafer, 2, 2, ... Are dies,
3 is a collet for individually picking up these dies 2, 2, ... 4 is a die 2 through the collet 3
2, a suction device for sucking 2, ..., a TV camera for monitoring the state of pickup and die bonding,
6 is a moving mechanism for moving the collet 3, suction device 4 and TV camera 5 in the X direction parallel to the surface of the wafer 1 (die 2, 2, ...), and 7 is also parallel to the surface of the wafer 1. Further, a moving mechanism portion for moving in the Y direction orthogonal to the X direction, 8 is a lead frame, 9 is a frame feed pawl for sequentially feeding the lead frame 8 in the X direction,
Reference numeral 10 is a feeder rail, and 11 is a reference in the Z direction (direction orthogonal to the surface of the wafer 1) for determining the height of the suction surface of the collet 3 during pickup of the die 2 and the height of the bonding surface during die bonding. It is a reference stand. Although not shown, the wafer 1 is placed on an XY stage, and the position of the collet 3 in the X and Y directions is set higher than the surface of the reference table 11 by the moving mechanism units 6 and 7 and the XY stage. Based on this, the position (height) in the Z direction is set, and the pickup position and height of the die 2 and the die bonding position and height to the island portion of the lead frame 8 are determined. Then, the selected die 2 is picked up by the collet 3, and the collet 3 is conveyed onto the island of the lead frame 8 and die-bonded.

FIG. 2 is an enlarged sectional view showing the head portion (the peripheral portion of the collet 3) in FIG. In FIG. 2, 12 is a magnet, 13 is a coil, 14 is a linear guide bearing, 15 is a detent pin for the collet 3, 16 is a sheet to which the dies 2, 2, ...
17 is a push-up needle, 18 is a backup plate,
Reference numeral 19 is a sensor, and 20 is a sensor target. The magnet 12 and the coil 13 form a linear motor 21. The linear motor 21 and the linear guide bearing 14 move the collet 3 in the Z direction.
The push-up needle 17 is driven in the vertical direction by a pulse motor or the like (not shown) so as to project onto the backup plate 18 when the die 2 is picked up.

FIG. 3 is an enlarged view of the vicinity of the sensor 19 and the sensor target 20 shown in FIG. The sensor 19 and the sensor target 20 are the collet 3
Position sensor (hall sensor) for detecting the position of
Work as 2. The position sensor 22 irradiates the sensor target 20 with light, for example, from the sensor 19, and determines the gap ΔL between the sensor 19 and the sensor target 20 based on the phase difference between the reflected light from the sensor target 20 and the irradiated light. , The position (height) of the position sensor 22 itself in the Z direction is detected. Thereby, the position of the suction surface of the collet 3 can be detected. The light emitted from the sensor 19 is not limited to light, but may be other light such as ultrasonic waves.

FIG. 4 schematically shows a signal flow between the linear motor 21, the position sensor 22 and the control computer 23 for driving the collet 3 in the Z direction in the die bonding apparatus shown in FIGS. 1 to 3 above. FIG. Gap Δ detected by the position sensor 22
A position signal corresponding to L is supplied to the control computer 23, and the height of the collet 3 at the time of picking up the die 2 and at the time of die bonding is controlled according to the position information in the Z direction detected by the control computer 23. It is supposed to be done.

Next, the position control of the collet 3 in the Z direction will be described in detail with reference to the flowchart of FIG. The die bonding is executed after the setup is determined by an instruction from the production management main computer, an operator's operation, and a program registered in advance in the die bonding apparatus. When changing the die type, the parameter data for each die type to be changed is read from the memory of the control computer 23 (step 1),
The control parameters of the die bonding apparatus are changed (step 2). At this time, by displaying on the display 23D of the control computer 23, the operator is informed of the setup for changing the product type and the instruction for replacing the parts such as the collet 3, the push-up needle 17 and the backup plate 18 (step 3). The operator replaces the parts in accordance with the display instruction from the control computer 23 (step 4), and when the change of the die bonding setup is completed, the moving mechanisms 6 and 7 move the collet 3 onto the reference table 11. Then, the linear motor 21 is driven to lower the collet 3 and press the suction surface of the collet 3 against the surface of the reference base 11, and the position in the Z direction at this time is detected by the position sensor 22 and is output from the position sensor 22. The thickness ΔC of the collet 3 is calculated based on the position information in the Z direction (step 5). Next, the parameter data relating to the thickness of the collet 3 in the control computer 23 is corrected based on the calculated thickness ΔC of the collet 3 (step 6). Next, the moving mechanism portions 6 and 7 move the collet 3 onto the backup plate 18, and the linear motor 21 is driven to lower the collet 3 to press the suction surface of the collet 3 against the surface of the backup plate 18. The position in the Z direction is detected by the position sensor 22, and the height of the backup plate 18 is calculated based on the position information in the Z direction output from the position sensor 22. Similarly, the moving mechanism section 6,
7, the collet 3 is moved onto the push-up needle 17, the linear motor 21 is driven to lower the collet 3, and the suction surface of the collet 3 is pressed against the push-up needle 17, and the position in the Z direction at this time is detected by the position sensor 22. And the height of the push-up needle 17 is calculated based on the position information in the Z direction (step 7). Calculated backup plate 1
8 and the height of the push-up needle 17 are instructed to the control computer 23 (step 8). Parameters related to the Z direction are corrected based on the height information of the backup plate 18 and the push-up needle 17 (step 9), and the correction result is displayed on the display 23D (step 10). Thereby, the correction parameter for the thickness of the collet 3, the correction parameter for the height of the backup plate 18 and the push-up needle, and the appropriate die bonding height for the changed die type preset in the control computer 22, An appropriate position (height) in the Z direction of the collet 3 during pickup and die bonding can be calculated based on the parameter data such as the die bonding position. Then, when the correction of each parameter is completed, die bonding is started (step 11).

According to such a configuration and method, when the die type is changed, the thickness of the collet 3 is detected by using the position sensor 22 and the reference base 11 prior to die pickup and die bonding. The position sensor 22 is used to detect the heights of the backup plate 18 and the push-up needle 17, and the parameter data relating to the Z direction for picking up the die 2 and die bonding can be corrected based on these data. The load on the operator can be reduced, and the pick-up error and the die bonding failure caused by the operator's adjustment error can be reduced. Therefore, high speed and high reliability of die bonding can be achieved.

In the above embodiment, the case where the collet 3, the backup plate 18 and the push-up needle 17 are replaced when the parts are replaced has been described as an example. However, it is not always necessary to replace all of them, and it is necessary to change the type depending on the type of die. You may exchange selectively. In this case, it suffices to measure only the thickness and height of the replaced component, and the calculation for measuring the thickness and height of the component that has not been replaced and changing the parameters is unnecessary. Therefore, for example, when the collet 3 is replaced and the backup plate 18 and the push-up needle 17 are not replaced, steps 7 to 9 are performed after the process of step 6.
The process proceeds to step 10 without executing the process. The same applies when only some of the other parts are replaced. Further, the collet 3 and the backup plate 1 shown in the above embodiment
8 and push-up needle 17 as well as FIG.
If the height of a support (not shown) that supports the island of the lead frame 8 in FIG. 2 is further measured and the parameter data related to the Z direction for die bonding is corrected, the accuracy of die bonding can be further improved. .

[0022]

As described above, according to the present invention,
Measure the thickness and height of the collet, push-up needle, and backup plate to be replaced when changing the type of die to be die-bonded, and based on the measurement results, in the Z direction for die pick-up and die bonding. Since various related parameters are changed, it is possible to reduce the burden on the operator, reduce pick-up mistakes and die bonding defects caused by operator's adjustment mistakes, and speed up die bonding and improve reliability. A die bonding apparatus and a die bonding method using this apparatus are obtained.

[Brief description of drawings]

FIG. 1 is a perspective view showing a schematic configuration of a die bonding apparatus according to an embodiment of the present invention.

FIG. 2 is a cross-sectional configuration diagram showing an extracted head portion in FIG.

3 is an enlarged view showing the vicinity of the sensor and the sensor target shown in FIG.

FIG. 4 is a diagram for schematically explaining a signal flow among a linear motor for driving a collet, a position sensor, and a control computer in the die bonding apparatus shown in FIGS. 1 to 3.

FIG. 5 is a flowchart for explaining a die bonding method using the die bonding apparatus shown in FIGS. 1 to 4.

[Explanation of symbols]

2 ... Die, 3 ... Collet, 6 ... Moving mechanism part (first moving means), 7 ... Moving mechanism part (second moving means), 11 ... Reference stand, 17 ... Push-up needle, 18 ... Backup plate, 21 ... Linear motor (third moving means), 22 ...
Position sensor (position detecting means), 23 ... Control computer (control means).

Claims (6)

[Claims] 1. A first moving means for relatively moving a collet and a die in an X direction parallel to a die surface, and a collet in a Y direction parallel to the die surface and orthogonal to the X direction. The second moving means for relatively moving the die, the third moving means for relatively moving the collet and the die in the Z direction orthogonal to the surface of the die, and the position of the collet in the Z direction. Position detecting means for detecting, a reference stand for setting a reference position of the collet in the Z direction, and the first and second moving means are controlled at the time of changing the type of the die to control the collet on the reference stand. And move it to
The third moving means is controlled to press the collet against the reference table, the thickness of the collet is calculated based on the position information by the position detecting means, and the thickness of the die is calculated according to the calculated thickness of the collet. A die bonding apparatus comprising: a pickup and a controller for performing correction calculation of parameter data relating to the Z direction for die bonding. 2. The control means controls the first and second moving means to move the collet onto a backup plate when the die type is changed, and controls the third moving means to control the collet. The collet is pressed against the backup plate, the height of the backup plate is calculated based on the position information obtained by the position detecting means, and the Z direction for picking up and die bonding the die based on the calculated height information of the backup plate. The die-bonding apparatus according to claim 1, further comprising a correction calculation of parameter data relating to (1). 3. The control means controls the first and second moving means to move the collet onto a push-up needle when changing the type of die, and controls the third moving means. Press the collet above against the push-up needle,
The height of the push-up needle is calculated based on the position information by the position detecting means, and the parameter data relating to the Z direction for die pick-up and die bonding based on the calculated height information of the push-up needle. 3. The correction calculation according to claim 1 is further performed.
The die bonding apparatus according to. 4. A process for exchanging a collet for adsorbing a die when changing the type of die, and a collet for pressing in a Z direction by pressing a collet against a reference stand for setting a reference position in the Z direction orthogonal to the surface of the die. A step of measuring the thickness of the collet by detecting the position, a step of correcting parameter data related to the Z direction for die pickup and die bonding based on the measured thickness information of the collet, and correction A step of setting the position of the collet in the Z direction based on the obtained parameter data and performing die pickup and die bonding. 5. A step of replacing the backup plate when changing the die type, and a step of pressing the collet against the backup plate to detect the position in the Z direction to measure the height of the backup plate. The die bonding method according to claim 4, further comprising the step of correcting parameter data relating to the Z direction for picking up the die and die bonding based on the information on the height of the backup plate. 6. A step of replacing the push-up needle when changing the die type, and a step of pressing the collet against the push-up needle to detect the position in the Z direction to measure the height of the push-up needle. The method further comprising the step of correcting parameter data relating to the Z direction for picking up and die bonding of the die based on the information on the measured height of the push-up needle. The described die bonding method.