JP3063806B2 - Semiconductor device lead straightening apparatus and method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device lead straightening apparatus and method for automatically correcting vertical and horizontal deformation of a plurality of leads extending from the side of an IC package.

[0002]

2. Description of the Related Art Conventionally, an IC in a semiconductor device (IC) is used.
(Integrated Circuit) Correction in the vertical direction (coplanarity) of the lead derived from the side of the package is first
The C package is set in a forming mold, and all leads are uniformly deformed to a plastic deformation amount or more regardless of the amount of lead bending deformation.

[0003]

Therefore, in the conventional correction method, if the amount of bending deformation of each lead is different, the amount of correction of each lead will be different. That is, even if all the leads are deformed to the same position for correction, if the amount of bending deformation before correction is different,
The force applied to each lead is also different, and not all leads are corrected to the same position. For this reason, there has been a problem that high-precision lead correction cannot be performed.

Further, this method can be used only for correction of bending deformation in the vertical direction, but not for correction of lead pitch. Therefore, to correct the lead pitch, for example, the lead was adjusted to the gauge and separately corrected one by one.
For this reason, there were problems such as poor workability.

[0005] The present invention has been made in view of the above problems, its object is vertical and the lead correction in the horizontal direction rapidly and lead correction device of a semiconductor apparatus which can be performed accurately and It is to provide a method .

[0006]

SUMMARY OF THE INVENTION In order to achieve the above object, the present invention relates to a lead correcting apparatus for a semiconductor device for correcting deformation in a vertical direction and a horizontal direction of a plurality of leads extending from a side surface of an IC package. A lead inspection unit that detects an amount of deformation of each of the leads in the up, down, left, and right directions and compares the lead with a standard value to determine whether the lead is good or not; A means for individually clamping the leads, and a clamp part of the clamp means being moved up and down in accordance with the amount of deformation detected by the lead inspection part. Vertical correction means for correcting vertical deformation of the clamped lead, and a clamp portion of the clamp means are moved in the horizontal direction. It is provided with a left and right direction correcting means for correcting the lateral direction of deformation of the clamp and lead. In addition, the present invention relates to an aspect of an IC package.
In the vertical and horizontal directions of multiple leads
Of lead correction method of semiconductor device to correct deformation
To detect the amount of deformation of each lead in the vertical and horizontal directions
And lead inspection to judge the quality by comparing with the standard value
Part according to the amount of deformation detected by the lead inspection part.
Having a lead straightening unit for correcting the deformation of the lead,
The lead inspection part is for each lead of the IC package
When measuring the amount of deformation in the vertical and horizontal directions for each lead
First, compare it with the standard value, and
Is a lead that is subject to correction exceeding the specified value
Only the corrective operation is performed in response to the value exceeding the specified value.
It was made.

[0007]

According to this structure, the lead inspection section detects the amount of bending deformation in the up-down (coplanarity) and left-right (lead pitch) directions for each lead, and then moves up and down in accordance with the amount of deformation in the lead correcting section. In addition, the correction in the left-right direction can be performed for each lead. Further, the vertical and horizontal correction of each lead can be performed simultaneously. Furthermore, after measuring the amount of deformation of the lead, the lead can be corrected and the lead can be measured again.

[0008]

Embodiments of the present invention will be described below in detail with reference to the drawings. FIG. 1 is a schematic block diagram of a lead correcting device for a semiconductor device according to an embodiment of the present invention. In FIG. 1, the lead correction device of the semiconductor device has a central processing unit (CPU) 1, to which a memory 2, a lead inspection unit 3, a lead correction unit 4 and the like are connected.

More specifically, the memory 2 has a ROM in which a program and the like for operating the present apparatus according to a predetermined procedure are written, and a RAM in which a standard value of read for each type of semiconductor is stored. doing. The lead inspection unit 3 includes an IC package 8 in a semiconductor device.
For each lead 9 is derived from the side (see FIG. 3 and FIG. 6), after detecting the vertical (Kopuranarite chromatography) and right (lead pitch) direction of bending deformation amount, compared with the standard value in the memory 2 And outputs a signal corresponding to the amount of bending deformation. The lead straightening unit 4 performs vertical and horizontal correction for each lead 9 in accordance with the amount of bending deformation of each lead 9 detected by the lead inspection unit 3. The lead straightening unit 4 moves the clamp unit 7 in the vertical direction according to the amount of bending deformation detected by the lead inspection unit 3 and a clamp unit 7 for individually clamping each lead 9. Vertical correcting means 5 for correcting bending deformation of the lead 9 in the vertical direction,
Similarly, there is provided a right and left direction correcting means 6 for moving the clamp means 7 in the left and right direction and correcting bending deformation of the clamped lead 9 in the left and right direction.

FIGS. 2 to 4 show a specific mechanism configuration of the lead correcting section 4. FIG. 2 is a schematic top view thereof, and FIG. 3 is a schematic view taken along a line AA in FIG. FIG. 4 is a schematic side view seen from the direction along BB in FIG. 2 to 4, the lead correcting unit 4 includes an I
It comprises a stage section 10 on which the C package 8 is set, and a portion constituting each mechanical section of the clamping means 7, the vertical correcting means 5, and the horizontal correcting means 6.

The stage 10 includes a turntable 11 that rotates at every 90 degrees, a mounting jig 12 fixedly and rotatably mounted on the turntable 11, and an arm 1.
The holding jig 14 is provided so as to face the mounting jig 12 while being rotatably supported at 3, and a plunger 15 for switching the vertical position of the holding jig 14 and the like. Then, the holding jig 14 includes a plunger 15.
When the semiconductor device is set on the mounting jig 12, the upper and lower positions are switched and moved by the above operation.
It is moved to an upper position so as to be largely separated from the mounting jig 12, and after setting, it is moved to a lower position and pressed on the IC package 8, and the IC package 8 is pressed down together with the mounting jig 12 from above and below. it can. When the turntable 11 is rotated in this state, the IC package 8
While holding down, is rotated together with the turntable 11 and the mounting jig 12, so that the direction of the lead 9 in this semiconductor device can be switched in a horizontal plane.

The left and right direction correcting means 6 is a feed screw member 1 rotatably mounted between a pair of columns 17 fixed to the base 16 so as to lie substantially parallel to the base 16 and to be rotatable.
8, a pair of upper and lower guide members 19 also arranged between the pair of columns 17 in parallel with the feed screw member 18, and both forward and reverse directions fixedly attached to one column 17 to rotate the feed screw member 18. And a movable member 21 which is screw-fed by the rotation of the feed screw member 18 and can move in the horizontal (left / right) direction. Further, the pair of guide members 19 are attached to the moving member 21 so as to penetrate therethrough, and when the screw is fed by the feed screw member 18, the rotation is suppressed by the pair of guide members 19, and the movable member 21 is horizontally moved. Only have to be able to move.

The vertical direction correcting means 5 is rotatably mounted in a state substantially perpendicular to the base 16 between a pair of arm portions 21a projecting from the upper and lower ends of the moving member 21 at substantially right angles in the same direction. A pair of left and right guide members 23 disposed between the pair of arm portions 21a in parallel with the feed screw portion 22;
and a drive motor 24 rotatable in both forward and reverse directions for rotating the feed screw member 22 which is fixedly mounted on the a. 25. The clamp half 25 has a pair of upper and lower guide members 23.
When the screw is fed by the feed screw member 22, rotation is suppressed by the pair of guide members 23 so that the guide member 23 can move only in the vertical direction.

The clamp means 7 has a clamp claw 25 at its tip.
a, a clamp half 26 attached to the clamp half 25 via a support shaft 27 so as to be rotatable in the vertical direction, and causing the clamp half 26 to rotate. Clamp half 25 and clamp half 2
6 and a plunger 28 disposed between them. Further, on the distal end side of the clamp half 26, a clamp claw 26a corresponding to the clamp claw 25a of the clamp half 25 is provided.
Is provided. Then, each of the clamp claws 25a,
When the clamp half 26 rotates with respect to the clamp half 25 in a direction in which the clamp claw 26a approaches the clamp claw 25a, only one lead 9 of the semiconductor device set on the stage 10 is interposed between the clamp half 26 and the clamp 9a. It can be clamped.

Next, the basic operation of the lead correction unit 4 configured as described above for lead correction will be described. First, the clamp claws 25a of the clamp half 25 and the clamp half 26
Of the semiconductor device set on the stage unit 10 is moved to the position before the lead 9 that needs to be corrected. Also, the clamp half 26 of the plunger 28
Is controlled so that the clamp claw 26a is
In a state in which the lead 9 is opened apart from the position a (indicated by a dashed line in FIG. 3), the lead 9 requiring correction is arranged between the clamp claws 25a and 26a serving as the clamp portions. The movement to the lead 9 is performed by rotating the driving motor 20 and moving the moving member 21 in the horizontal direction by this rotation. When the moving member 21 is moved to a predetermined position, the movement is stopped. Next, the plunger 28 is operated, and the clamp claw 26a is rotated toward the clamp claw 25a, so that both clamp claws 25a,
The lead 9 is clamped between 26a. Next, in this state, the drive motor 20 is rotated, and the moving member 21 is moved. Then, together with the moving member 21, the clamp half 2
5 and 26 move in the horizontal direction. In addition, the lead 9 clamped by the clamp claws 25a and 26a receives a force in the horizontal (lead pitch) direction by this movement, and is bent leftward or rightward by an amount corresponding to the amount of movement to perform the correction. In addition, when the drive motor 24 is rotated and the clamp half 25 is moved together with the clamp half 26a, the lead 9 clamped by the clamp claws 25a, 26a receives a force in the vertical (coplanar retain) direction, and this movement Vertical correction is performed according to the amount.

Accordingly, in the lead correcting section 4, when the moving member 21 is moved by driving the drive motor 20 in a state where the leads 9 are unclamped by the clamp claws 25a and 26a, the lead 9 corresponds to one of the desired leads 9. The clamp claws 25a and 26a can be arranged at the set positions.
When the turntable 11 is rotated in this unclamped state, the lead 9 of the semiconductor device on the mounting jig 12
The direction with respect to the clamp claws 25a and 26a can be switched. Next, when the drive motor 20 is driven in a state where the lead 9 requiring correction is clamped by the clamp claws 25a and 26a, the lead 9 can be corrected in the left and right ((lead pitch) direction) according to the driving amount. When the drive motor 24 is driven, the lead 9 can be corrected in the up-down (coplanarity) direction according to the drive amount.

FIG. 5 is a block diagram showing the flow of the semiconductor device when the semiconductor device lead straightening apparatus of this embodiment is used. The operation of the lead straightening device for a semiconductor device shown in FIGS. 1 to 4 will now be described with reference to FIG.
First, when a semiconductor device is to be corrected using a lead correction device for a semiconductor device, as shown in FIG. Non-defective product storage section 3 having trays for storing IC packages 8 after inspection and correction.
2 and a defective product storage section 33 are prepared, and the semiconductor device is moved by the robot (not shown).

Then, in the inspection, the semiconductor device is taken out of the measured object storage unit 31 and transferred to the lead inspection unit 3. Then, the lead inspection unit 3 measures the amount of deformation of each lead of the semiconductor device in the vertical and horizontal directions, and takes out each lead No. as shown in FIGS. 7 and 8, for example, and compares this with the standard value. . Here, the lead 9 exceeding the standard value is to be corrected, and if there is no lead 9 exceeding the standard value, the semiconductor device is transferred from the lead inspection unit 3 as it is to the non-defective measured object storage unit 32 as a non-defective product. Is stored. On the other hand, when any one of the leads 9 exceeds the standard value, the lead 9 is transferred to the lead correcting unit 4 and set on the stage unit 10 to perform correction. In this correction, for the lead 9 to be corrected, the drive motor 20 and the drive motor 24 are driven by an amount corresponding to a value exceeding the standard value in the vertical and horizontal corrections as described above. Corrective action is performed. After the correction, the lead 9 is returned to the inspection lead inspection section 3 again, and if there is no lead 9 which is deformed beyond the standard value, it is transferred to the non-defective measurement object storage section 32 and deformed beyond the standard value. If there is any, it is returned to the lead straightening section again and straightened again. After the correction, the lead inspection section 3 again inspects the lead. If all the leads 9 are corrected within the standard value, the non-defective product storage section 32 is corrected. Instead, it is transferred to the defective measurement object storage unit 33 and processed as a defective.

[0019]

As described above, according to the apparatus and method for correcting a lead of a semiconductor device according to the present invention, the amount of bending deformation in the up-down (coplanarity) and left-right (lead pitch) directions for each lead in the lead inspection unit. Is detected, and then vertical and horizontal corrections can be performed for each lead in accordance with the amount of deformation in the lead correction section, thereby enabling highly accurate lead correction. In addition, since the vertical and horizontal correction of each lead can be performed at the same time, workability is remarkably improved. Furthermore, after measuring the amount of deformation of the lead, the lead can be corrected and the lead can be measured again, so that effects such as improvement in yield can be expected.

[Brief description of the drawings]

FIG. 1 is a schematic block diagram of a lead straightening device for a semiconductor device according to an embodiment of the present invention.

FIG. 2 is a schematic top view showing a mechanical part of a lead correcting unit in the lead correcting device of the semiconductor device.

FIG. 3 is a schematic side view as viewed from a direction along the line AA in FIG. 2;

FIG. 4 is a schematic side view as seen from a direction along the line BB in FIG. 3;

FIG. 5 is a block diagram showing a flow of an IC package when a lead straightening device for a semiconductor device according to one embodiment of the present invention is used.

FIG. 6 is an external perspective view illustrating an example of a semiconductor device.

FIG. 7 is a diagram showing an example of inspection data relating to coplanarity of a lead in a semiconductor device.

FIG. 8 is a diagram showing an example of inspection data relating to a lead pitch of a lead in a semiconductor device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Central processing part (CPU) 2 Memory 3 Lead inspection part 4 Lead correction part 5 Vertical direction correction means 6 Right and left direction correction means 8 IC package 9 Lead 25a Clamp nail 26a Clamp nail

Claims (2)

(57) [Claims] 1. A lead correction device for a semiconductor device for correcting deformation in a vertical and horizontal direction of a plurality of leads derived from a side surface of an IC package, wherein an amount of deformation of each of the leads in a vertical and horizontal direction is detected. A lead inspection unit that determines pass / fail by comparing with a standard value, and a lead correction unit that corrects the deformation of the lead according to the amount of deformation detected by the lead inspection unit, wherein the lead correction unit includes: Means for individually clamping the leads, and means for vertically moving the clamp portion of the clamp means in accordance with the amount of deformation detected by the lead inspection section to correct vertical deformation of the clamped leads. Vertically correcting means and moving the clamp portion of the clamp means in the left and right direction to correct the left and right deformation of the clamped lead. Lead correcting apparatus for a semiconductor device which is characterized by providing a lateral direction correcting means because. 2. It is derived from the side of the IC package.
Corrects vertical and horizontal deformation of multiple leads
In the read correcting method of a semiconductor device that detects the amount of deformation vertical and horizontal directions of each of the leads
A lead inspection unit that judges the quality by comparing with the standard value
And according to the amount of deformation detected by the lead inspection unit,
A lead correcting section for correcting lead deformation, wherein the lead inspection section is provided for each lead of the IC package.
And measure the amount of vertical and horizontal deformation for each lead
With the standard value, and the lead straightening unit becomes a target of correction exceeding the standard value.
Only for leads that exceed the specified values.
Lead straightening of a semiconductor device characterized by performing a straightening operation
Method.