JPH023543B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to an inner lead bonder for bonding a die to leads provided in advance at equal intervals on a carrier tape.

(Prior Art) Conventionally, two methods are known for inner lead bonding. The first method consists of positioning and mounting a wafer consisting of a plurality of dies divided at equal intervals on a table driven in the XYZ directions, and disposing a carrier tape that is intermittently transferred above the table. , the carrier tape is directly pressed against the die using a bonding tool placed above the carrier tape for bonding.

However, this method uses a camera placed above the carrier tape to detect the overlapping patterns of the die and leads to align the die and leads, making it difficult to detect misalignment of the die pattern. It has its drawbacks.

In addition, the wafer is attached to a plate made of ceramic or glass with a low-melting adhesive and is divided into equal intervals, so the method of bonding by pressing the carrier tape directly onto the wafer as described above is called bonding. At times, the heat from the bonding tool is transmitted to the dies surrounding the bonded die, melting the adhesive and easily causing the die to shift position, and also melting the adhesive from the slicing line of the adjacent die and causing the dies to adjoin due to capillary action, etc. It may rise to the surface of the die and contaminate the die, making it impossible to detect the die. In addition, plate warpage, flatness, and heat resistance greatly affect the die and leads after bonding.

In addition, in order to prevent the inner leads of the carrier tape to be bonded from touching the pads of the adjacent dies, the inner leads near the bonding tool must be curved away from the die, and the carrier tape must Adversely affect.

The second method is to place a table on which the wafer is placed and driven in the XY directions at a position away from the bonding position of the carrier tape, and to position the die between the bonding position and the table. A die positioning position having a positioning claw is provided, and one die is vacuum-suctioned from the wafer by a first transfer arm, transferred to the die positioning position, and positioned by the positioning claw. Next, a second transfer arm vacuum-chucks the positioned die and transfers it to a bonding position. Thereafter, the carrier tape is pressed against the die using a bonding tool from above the carrier tape to perform bonding.

This method has the advantage that the die is positioned away from the bonding position, so the camera placed above the bonding position only needs to detect the lead of the carrier tape. Since the die is sucked and transferred again by the transfer arm, there is a drawback that the position of the die may be shifted during suction and when suction is released.

On the other hand, in the case of carrier tape, it is necessary to accurately position the leads of the carrier tape with respect to the die. For this reason, the detection position of the positioned lead is moved below the detection camera to automatically recognize and correct the lead position of the carrier tape.
The lead is moved to the bonding position again.

Conventionally, such a carrier tape positioning device has been disclosed, for example, in Japanese Patent Publication No. 57-53972 and Japanese Patent Application Laid-Open No.
The one shown in Publication No. 58-141 is known.

However, in the conventional film carrier positioning device, the lead section positioned by the positioning claw is simply brought into pressure contact with the guide plate by the tension of the tape. When the tape that has been moved and positioned is moved, the position of the tape lead that has been positioned will shift due to vibration.
There was a drawback that the accuracy of the bonding position of the lead relative to the pellet deteriorated.

(Object of the Invention) An object of the present invention is to provide an inner lead bonder that can prevent the misalignment of the die, which is a drawback of the second method, and also prevent the misalignment of the leads of the carrier tape. be.

(Embodiments of the Invention) The present invention will be described below with reference to illustrated embodiments.
FIG. 1 is an overall perspective view showing an embodiment of the present invention, FIG. 2 is a plan view of FIG. 1, and FIG. 3 is a view taken from the arrow 3 in FIG.
- Side explanatory view of the 3rd part, Figures 4 and 5 are the 1st
FIG. 6 is a sectional view of the main part taken along line 6--6 in FIG. 4, and FIG. 7 is a side view of the wafer suction plate.

As shown in FIGS. 1 and 2, a tape loader section 12 and a tape unloader section 13 are disposed on pedestals 14 on both sides of a bonding head 11 having a bonding tool 10, respectively.
A reel 15 is rotatably supported on the tape loader section 12, and a carrier tape 16 having leads provided at equal intervals and a spacer tape 17 for protecting the leads of the carrier tape 16 are stacked on the reel 15. They are wrapped together.
A reel 18 for overlapping and winding the carrier tape 16 and spacer tape 17 is rotatably supported on the tape unloader section 13, and this reel 18 is driven by a reel drive motor (not shown). be done.

Also, the carrier tape 1 wound on the reel 15
6 below the bonding tool 10 and the reel 1
In order to guide the tape to the 8 side, carrier tape guide rollers 20, 21, 22, and 23 are rotatably disposed in the tape loader section 12 and the tape unloader section 13, respectively. Further, a guide member 24 is provided below the bonding tool 10, guide rollers 25, 26 are provided on both sides of the guide plate 24, and sprocket holes formed on both sides of the carrier tape 16 are provided on both sides of the guide rollers 25, 26. Sprocket wheels 27 and 28 that engage with the tape are rotatably attached to the tape position adjusting plate 29, respectively. The tape position adjustment plate 29 is fixed to an XY table 30 that is driven in the XY directions.
Further, the one sprocket wheel 28 is rotationally driven in one direction by a stepping motor (not shown). In addition, in order to guide the spacer tape 17 wound around the reel 15 to the reel 18 side, the tape loader section 12 and the tape unloader section 13 have spacer tape guide rollers 31 and 3, respectively.
2 is rotatably attached.

As shown in FIGS. 1, 2, and 3, below the bonding tool 10, a rotary table 40 that rotates and is driven up and down is arranged with its center of rotation deviated from the bonding tool 10. The rotary table 40 is mounted on an X and Y table 41 that is driven in the X and Y directions. Also, on the rotary table 40 is a bonding tool 10.
Die mounting stands 42A and 42B are fixed directly below and concentrically with the position directly below. A pair of opposing die positioning claws 43A, 43B are provided above the die mounting base 42B.
These die positioning claws 43A, 43B are opened and closed by a drive mechanism (not shown).

A wafer mounting XY table 50 is provided in front of the die positioning claws 43A, 43B (on the opposite side from the bonding tool 10). A wafer 52 consisting of a plurality of dies 51
A wafer substrate 53 on which is fixed is positioned and fixed. Also, XY table 50 for wafer placement.
Inside is this XY table 5 for placing the wafer.
A plunger 54 for vacuum suctioning the back side of the wafer 52 of the wafer substrate 53 positioned at
A push-up needle 55 for pushing up one die 51 is disposed within the die 4 so as to be movable up and down. Between the die positioning claws 43A, 43B and the wafer mounting XY table 50, one die 51 on the wafer mounting XY table 50 is vacuum-adsorbed and positioned at the die positioning claws 43A, 43B. A die transfer lever 56 that can move up and down and swing is disposed on the die mounting table 42B.

A loader side wafer substrate cassette 60 and an unloader side wafer substrate cassette 61 are arranged on both sides of the wafer mounting XY table 50. The loader side wafer substrate cassette 60 is adapted to be driven up and down, and a plurality of wafer substrates 53 to which wafers 52 are fixed are stored vertically at equal intervals. In addition, the loader side wafer substrate cassette 60 is open on the wafer placement XY table 50 side, and a conveyor 62 extending from inside the loader side wafer substrate cassette 60 to the wafer placement XY table 50 side is provided through this open portion. . The unloader side wafer substrate cassette 6
1 consists of a U-shaped box with only the upper and right sides open, and wafer substrates 53 are stacked directly on top of each other.

Above the conveyor 62 and above the unloader side wafer substrate cassette 61, wafer suction plates 63A and 63B are respectively arranged, and these wafer suction plates 63A and 63B are fixed to arms 64A and 64B, respectively. . The arms 64A, 64B are fixed to sliding bodies 66A, 66B which are slidably and rotatably attached to a guide rod 65 extending from the side of the conveyor 62 to the side of the unloader side wafer substrate cassette 61, The sliding body 66A is not shown between the conveyor 62 and the wafer placement XY table 50, and the other sliding body 66B is not shown between the wafer placement XY table 50 and the unloader side wafer substrate cassette 61. It is driven by a drive device to reciprocate.

The wafer suction plates 63A, 63B have a seventh
As shown in the figure, a plurality of suction cups 70 for vacuum suctioning the wafer substrate 53 are attached. The suction cup 70 is connected via a pipe 72 to a vacuum hole 71 formed in the arms 64A, 64B.
is connected to a vacuum device (not shown) via a pipe.

Further, above the push-up needle 55, that is, above the die pick-up position 80, a die defect detection camera 81 for detecting chips, defective marks, etc. on the die 51 is disposed, and a pair of die positioning claws 4
A die position pattern detection camera 83 for detecting the position pattern of the die 51 is disposed above the die positioning position 82, above the carrier tape 16 and above the bonding tool 10, that is, above the die positioning position 82. A lead position pattern detection camera 85 for detecting the position pattern of the leads of the carrier tape 16 is disposed above the bonding position 84, and these cameras 81, 83, 85 are attached to a camera holder fixed to the frame 14. It is fixed at 86.

As shown in FIGS. 1 and 4, there is a gap between the bonding position 84 and the guide roller 26.
A positioning pawl lever 90 having a positioning pawl 90a that engages with a sprocket hole of the carrier tape 16 is provided at an end thereof. Positioning claw lever 9
0 is the eccentric shaft 91 located directly above the positioning claw 90a.
A fulcrum shaft 92 is rotatably supported by the fulcrum shaft 92 and the other end is fixed to the tape position adjustment plate 29.
It is urged by a tension coil spring 93 and is always in slidable contact with the outer periphery of the . The eccentric shaft 91 is configured to reciprocate approximately 90 degrees by a drive means (not shown).

A clamper 100 having spring properties is disposed at the bonding position 84 below the guide plate 24, and this clamper 100 is attached to a clamp arm 101. The clamp arm 101 is rotatably supported on a shaft 102 on which the guide roller 25 is rotatably supported.
The clamper 100 and the clamp arm 101 are each provided with a window at a portion corresponding to the bonding portion of the lead portion of the carrier tape 16. A spring guide 104 is fixed to a shaft 103 on which the guide roller 26 is rotatably supported, and a spring 105 disposed in the spring guide 104 causes the clamp arm 101 to move the clamper 100 onto the guide plate 24. It is biased to press into contact. Further, the eccentric shaft 91 has a positioning claw 90a of the positioning lever 90.
When the clamp arm 101 is located away from the sprocket foil of the carrier tape 16,
A clamp release lever 106 that presses downward is fixed.

(Action) Next, the action will be explained. The loader side wafer substrate cassette 60 is moved by a vertical drive mechanism (not shown).
When the pitch is lowered, the lowest wafer substrate 53 is placed on the conveyor 62. Next, the conveyor 60 is operated by a drive mechanism (not shown), and the wafer substrate 53 is transferred to the wafer mounting XY table 50 side. Next, the arm 64A is rotated downward, and the suction cup 70 fixed to the wafer suction plate 63A comes into contact with the wafer 52. In this state, a vacuum device (not shown) operates, the vacuum hole 71 of the arm 64A becomes evacuated, and the suction cup 70 suctions the wafer 52 via the pipe 72. Then arm 6
4A rotates upward and picks up the wafer 52 together with the wafer substrate 53 from the conveyor 62. Next, the sliding body 66A moves in the direction of the wafer mounting XY table 50, and the wafer substrate 53 is transferred above the wafer mounting XY table 50. Subsequently, the arm 64A is rotated downward to position the wafer substrate 53 on the wafer mounting XY table 50. At the same time, the vacuum of the wafer suction plate 63A is cut off, and the wafer substrate 53 is left on the wafer mounting XY table 50 and the arm 6
4A is rotated upward and then moved above the conveyor 62.

When the wafer substrate 53 is placed on the wafer placement XY table 50 as described above, the wafer substrate 53 is positioned and fixed on the wafer placement XY table 50 by a positioning mechanism (not shown).
Next, the wafer mounting XY table 50 is driven in the XY direction by a drive mechanism (not shown), and the die 51
After correcting the inclination between the XY table 50 and the axis using the θ motor, the die 51 to be picked up is moved to the die pickup position 80 directly below the die defect detection camera 81. Then, the die defect detection camera 81 detects whether the die 51 is good or defective. If a die 51 is defective, the next die 51 is moved to the die pick-up position 80 and detected in the same manner. If the die 51 is good, the plunger 54 rises and the plunger 5
The vacuum of No. 4 operates to vacuum-adsorb the wafer 52.
At the same time, the die transfer lever 56 is rotated by a drive mechanism (not shown) directly above the die pick-up position 80, and then lowered. As a result, the vacuum suction collet 57 fixed to the tip of the die transfer lever 56 transfers the detected good die 5.
1, and the vacuum of the vacuum suction collet 57 works to suction the die 51. Next, the die transfer lever 56
At the same time as rising, the push-up needle 55 rises and pushes up the die 51. As a result, the die 51 is attracted to the vacuum suction collet 57 and picked up. The die transfer lever 56 is then rotated above the die positioning position 82 and then lowered. As a result, the die 51 adsorbed by the vacuum suction collet 57 comes into contact with the die mounting table 42B, and the vacuum of the vacuum suction collet 57 is cut off. Next, the die transfer lever 56 transfers the die 51 to the die mounting table 42.
Leave it on B and go up, then rotate and return to the original starting position. Further, as described above, when the die 51 is picked up from the wafer placement XY table 50 by the vacuum suction collet 57 of the die transfer lever 56, the wafer placement XY table 50 is picked up.
is driven in the XY directions, and the die 51 to be picked up next is detected by the die defect detection camera 81.

When the die 51 is placed on the die mounting table 42B as described above, the die positioning claws 43A and 43B are moved in the closing direction by a drive mechanism (not shown), and the positions of the die 51 in the X direction and the θ direction are adjusted. be done. Thereafter, the die positioning claws 43A, 43B are moved in the opening direction. When the position of the die 51 in the X direction is adjusted, a positional shift of the pattern of the die 51 in the X and Y directions is detected by the die position pattern detection camera 83 and is stored in a storage device (not shown). After that, the rotary table 40 is rotated 180 degrees, and at the same time the XY table 41
The positional deviation is corrected by
Located in

On the other hand, each time the sprocket wheel 28 is intermittently driven by a drive mechanism (not shown), the carrier tape 16 wound around the reel 15 is moved to the carrier tape guide rollers 20, 21, the sprocket wheel 27,
The tape is sent through a carrier tape guide roller 25,
The lead of carrier tape 16 is sent to bonding position 84. Also, the carrier tape 1 slackened between the sprocket foil 28 and the reel 18.
6 is detected by a detection means (not shown), and the reel 18 is thereby driven by a drive mechanism (not shown).
Carrier tape 16 is wound onto reel 18. At the same time, the spacer tape 17 wound around the reel 15 is moved by the spacer tape guide roller 31,
32 and then wound onto the reel 18 together with the carrier tape 16 in an overlapping manner. In this state,
The bonding tool 10 is located at a position set back from directly above the bonding position 84.

In this way, the carrier tape 16 is fed,
When the lead of the carrier tape 16 is roughly positioned at the bonding position, the eccentric shaft 91 is then rotated approximately 90 degrees, and the positioning claw lever 90 is moved from the state shown in FIG. 5 to the state shown in FIG. , engages with the sprocket hole of the roughly positioned carrier tape 16, transfers the carrier tape 16 by a further small amount and stops, and accurately positions the carrier tape 16.

Furthermore, when the eccentric shaft 91 rotates approximately 90 degrees as described above, the clamp release lever 106 also rotates from the state shown in FIG. 5 to the state shown in FIG. , the clamp 100 presses the carrier tape 16 against the guide plate 24.

In this state, the tape position adjustment plate 29 is driven in the XY directions to move the detection position of the lead of the carrier tape 16 below the lead position pattern detection camera 85, so that the detection position of the lead of the carrier tape 16 is detected. The carrier tape 16 corresponds to the pattern of the die 51 detected by the die position pattern detection camera 83 as described above.
The positional deviation of the lead pattern is calculated by an arithmetic device (not shown). Then, the tape position adjustment plate 29 is again driven in the XY direction by the XY table 30, and the operation of positioning the lead of the carrier tape 16 at the calculated and corrected position is performed. When the XY table 30 is driven in the XY directions, the sprocket wheels 27 and 28 are moved via the table position adjustment plate 29. Since the claws of the sprocket wheels 27 and 28 are engaged with the sprocket holes of the carrier tape 16, when the sprocket wheels 27 and 28 are moved as described above, the carrier tape between the sprocket wheels 27 and 28 is moved. Part 16 is also moved. As a result, the pattern of the leads of the carrier tape 16 at the bonding position 84 is aligned with the pattern of the die 51.

Next, the rotary table 40 is raised and the die 51 is pressed against the lead of the carrier tape 16. At the same time, the bonding head 11 is driven and the bonding tool 10 is moved to the bonding position 84.
The die 51 is moved directly above the carrier tape 16 and then lowered to bond the die 51 to the leads of the carrier tape 16. Thereafter, the bonding tool 10 is raised and retreated, and the rotary table 40 is lowered.

When the bonding is completed, the eccentric shaft 91 is rotated approximately 90 degrees in the opposite direction to that shown in FIG.
In the state shown in the figure, the positioning pawl 92a moves and leaves the sprocket hole of the carrier tape 16, and at the same time, the clamp release lever 106 pushes down the clamp arm 101, and the clamper 100 leaves the carrier tape 16. This completes one cycle of die bonding. Thereafter, the above operation is repeated to sequentially bond the die 51 to the leads of the carrier tape 16.

In this way, die bonding is performed sequentially, and when the good die 51 of the wafer 53 positioned and placed on the wafer placement XY table 50 runs out, the sliding body 66B moves in the direction of the wafer placement XY table 50. The wafer suction plate 63B is positioned above the die pick-up position 80. Subsequently, the arm 64B is rotated downward, and the suction cup 70 fixed to the wafer suction plate 63B comes into contact with the wafer substrate 53. In this state, a vacuum device (not shown) operates, the vacuum hole 71 of the arm 64B is evacuated, and the suction cup 70 suctions the wafer substrate 53 via the pipe 72. Thereafter, the arm 64B rotates upward and picks up the wafer substrate 53 from the wafer mounting XY table 50. Next, the sliding body 66B moves toward the wafer substrate cassette 61 on the unloader side, and the wafer substrate 53 moves toward the wafer substrate cassette 61 on the unloader side.
1. Then, the vacuum of the wafer suction plate 63B is cut off, and the wafer substrate 53 is stored in the wafer substrate cassette 61 on the unloader side. When the wafer substrate 53 is removed from the wafer mounting XY table 50, the wafer substrate 5 with the wafer 52 in the loader-side wafer substrate cassette 60 is removed again by the above-described operation.
3 is transferred to the wafer mounting XY table 50, positioned and mounted, and the above-described bonding cycle is sequentially repeated.

In this way, the rotary table 40 having a size including the die positioning position 82 and the bonding position 84 is provided, and after positioning the die 51 at the die positioning position 82 on the rotary table 40, the rotary table 40 is rotated. Since the positioned die 51 is placed at the bonding position 84, the die 51 at the bonding position 84 is determined by the rotation accuracy of the rotary table 40, and the die 51 is placed at the bonding position 84 without any displacement. , high-precision bonding is performed.

In addition, the carrier tape 1 is
6 is pressed against the guide plate 24, the positioning device is moved in the X and Y directions, so that the position of the carrier tape 16 does not shift due to vibrations caused by the movement of the device, and the positioned lead portion of the carrier tape 16 can be bonded. It can be secured until the end, improving bonding position accuracy. Further, during bonding, the periphery of the bonding portion of the lead of the carrier tape 16 is pressed by the clamper 100, so that the shape of the lead becomes uniform, there is no edge shot between the lead and the pellet, and the yield is improved.

In addition, in the above embodiment, the
The wafer 52 was supplied to the XY table 50, but
A tray containing separated dies may be provided. Moreover, although two die mounting tables 42A and 42B are provided on the rotary table 40, three or more die mounting tables may be provided and rotated at a rotation angle depending on the number of die mounting tables. Further, the rotary table 40 does not need to be formed into a circular shape, and the die mounting tables 42A, 4
A shape in which only the portion 2B is connected may be used. Further, the die may be placed directly on the rotary table 40 without providing the die mounting tables 42A and 42B.

Further, in the above embodiment, the clamp release lever 106 is fixed to the eccentric shaft 91, but a separate shaft for fixing the clamp release lever 106 may be provided. Further, the positioning of the carrier tape 16 is performed by a positioning pawl lever 9 rotatably supported on an eccentric shaft 91.
For example, as shown in Japanese Patent Application Laid-Open No. 51-43075,
A pawl member having an inclined portion at the tip may be slidable up and down on the guide block and biased downward by a spring, so that the pawl member engages with a sprocket hole of the tape to perform positioning.

(Effects of the Invention) As is clear from the above description, according to the present invention, the die is positioned on the rotary table, and the positioned die is positioned at the bonding position by rotating the rotary table. Precision bonding is performed.

In addition, in the die positioning position, the die is positioned in the X direction and the θ direction, and the deviation in the Y direction is recognized and corrected. There is no need to replace the claws, and the usability of dies and work efficiency are significantly improved.

Also, press the tape against the guide member with a clamper,
Since the clamp release member releases the pressure of the clamper when feeding the tape, bonding accuracy and yield are improved.

[Brief explanation of drawings]

Fig. 1 is a perspective view showing one embodiment of the present invention;
The figure is a plan view of Fig. 1, and Fig. 3 is the view from arrow 3- in Fig. 2.
4 and 5 show the vicinity of the bonding tool in FIG. 1, FIG. 4 is a front view with the clamper in the raised state, FIG. 5 is a front view with the clamper in the lowered state, and FIG. 6 is a side view of three parts. 7 is a sectional view of the main part taken along the line 6--6 in FIG. 4, and FIG. 7 is a side view of the wafer suction plate. 10...Bonding tool, 16...Carrier tape, 24...Guide plate, 40...Rotary table, 51...Die, 56...Die transfer lever,
82...Die positioning position, 84...Bonding position, 100...Clamper, 10
1... Clamp arm, 106... Clamp release lever.

Claims (1)

[Claims] 1. Send the dies one by one to the die positioning position for positioning, and send the positioned dies to the bonding position, while sending the lead of the carrier tape to the lower surface of the guide member provided at the bonding position to position the die. In an inner lead bonder that is positioned above and presses and bonds the lead of the carrier tape to the die using a bonding tool, the rotary table has a size that includes the die positioning position and the bonding position, and the rotary table is , a drive mechanism that drives in the Y and Z axis directions, and a die position correction mechanism having a claw provided in the die positioning position section above the rotary table and correcting the inclination in the θ direction of the die sent to the die positioning position. An inner lead bonder comprising: a clamper that presses the carrier tape against the guide member; and a clamp release member that releases the pressure of the clamper when feeding the carrier tape.