JPH04350950A - Chip positioner - Google Patents

Abstract

PURPOSE:To prevent a chip on a stage from being out of position during bonding. CONSTITUTION:The following are provided: a stage 11 to mount a chip 1; XY tables 13,14 to move this stage 11 in the XY directions; a regulation means of position of the chip larranged on this stage 11; and a vacuum chuck means 18 to vacuum chuck this position regulation means 17 so as to slide on this stage 11. Further, a chip positioner is constituted of press contactors 33,34 that are located by the side of this stage 11 and are pressed on the position regulation means 17 by XY movement of this stage 11 to press this means 17 on the chip 1 and an initialization means 36 that is pressed on this position regulation means 17 to reset this position regulation means 17 to a home position.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip positioning device, and more particularly to means for regulating the position of a chip mounted on a stage in an inner lead bonding device, a stud bump forming device, or the like.

0002

2. Description of the Related Art FIG. 5 shows a conventional inner lead bonding means. In the figure, 1 is a chip placed on a stage 101, and an electrode 2 on the top surface of this chip 1
, press the lead L of the film carrier with the pressing tool 102.
This allows them to be pressed one by one for bonding.

0003

[Problem to be Solved by the Invention] Since the number of leads L is extremely large, in some cases over 500, while bonding the leads L to each electrode 2 one by one, the chip 1 gradually The position is shifted, and the lead L is connected to the electrode 2.
There was a problem that the bonding gradually became difficult.

[0004] Such problems similarly occur in stud bump forming means that forms bumps on the electrodes 2 of the chip 1 with wires using the wire bonding method.

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a chip positioning device that is equipped with means for firmly positioning a chip during bonding of leads, wires, etc. to the chip.

[0006]

[Means for Solving the Problems] To achieve this, the present invention provides a stage on which a chip is mounted, an XY table for moving this stage in the XY directions, and a means for regulating the position of the chip disposed on this stage. , a suction means for slidably adsorbing the position regulating means onto the stage; A pusher that presses the position regulating means against the chip, and an initializing means that presses the position regulating means and returns the position regulating means to its original position by moving the stage in the X and Y directions. It constitutes a positioning device.

[0007]

[Operation] In the above structure, the position regulating means is pressed against the chip mounted on the stage to correct the positional deviation of the chip. In this state, the position regulating means is fixed on the stage by the suction means, so that the chip is firmly positioned so as not to shift during the bonding operation to the chip.

[0008] When a predetermined bonding operation is completed, the stage moves in the X and Y directions, so that the initializing means presses against the position regulating means, and the position regulating means returns to its original position.

[0009]

Embodiments Next, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is an overall view of an inner lead bonding apparatus. A film carrier 20 is pitch-fed by a sprocket 21.

Reference numeral 10 denotes a positioning device for the chip 1. 1
1 is a stage, and a chip 1 is placed on this stage 11.
will be installed. 12 is θ where this stage 11 is installed
table, 13 is X table, 14 is Y table, 15
is a Z table. By driving these tables 12 to 15, the stage 11 moves in the θ direction (horizontal rotation direction) and the XYZ directions.

Reference numeral 22 is a wafer provided on the side of the stage 11 as a chip supply means, and a transfer head 23
The chip 1 is attracted to the nozzle 24 and transferred and mounted on the stage 11. Note that instead of the wafer 22, a tray containing the chips 1 or the like may be provided.

Two key-shaped position regulating means 16 and 17 are provided on the stage 11. As shown in FIG. 4, one position regulating means 16 is fixed on the stage 11, while the other position regulating means 17 is placed on the stage 11 so as to be slidable. This position regulating means 1
A large number of suction holes 18 are formed in the mounting area 7. This suction hole 18 communicates with suction means (not shown), and suctions the position regulating means 17 so that it can freely slide on the stage 11.

In FIG. 1, reference numeral 30 denotes pressing means provided on the side of the stage 11. A key-shaped plate 32 is attached to the upper part of the fixing bracket 31 of this pressing means 30, and on the orthogonal inner surface of this plate 32,
Pushers 33 and 34 are attached via spring members 35 (see also FIG. 4). Further, a key-shaped position regulating piece 36 serving as an initializing means is vertically provided at the end of the plate 32.

In FIG. 1, 40 is a bonding device which includes a main body box 41, an arm 42 extending from this main body box 41 onto the film carrier 20, and a pressing tool 43 held by this arm 42. It has become. This bonding means 40 is supported by an XY table 46. A camera 44 observes the chip 1 on the stage 11 and the lead L of the film carrier 20, and is driven by an XY table 45 to move in the XY directions.

The present device has the above-mentioned configuration, and its operation will be explained next with reference to FIG. 2.

The chip 1 on the wafer 22 is mounted on the stage 11 by the transfer head 23 (see FIG. 2(a)).
. This chip 1 mounted on the stage 11 has a positional shift in the XYθ directions, and this positional shift is corrected as follows.

By driving the XY tables 13 and 14, the stage 11 is moved toward the plate 32, and the position regulating means 1 is moved.
7 onto the pushers 33 and 34 (see Figure 2(b)).
. The position regulating means 17 moves the stage 1 by the suction means 18.
Therefore, the position regulating means 17 is pushed by the pushers 33 and 34 and slides toward the chip 1, and the chip 1 is clamped by the position regulating means 16 and 17. , the positional deviation in the XYθ directions is roughly corrected. In this case, the spring material 35 serves as a cushion.

Next, the XY tables 13 and 14 are driven to move the chip 1 directly below the camera 44, and the positional deviation of the chip 1 in the XYθ directions is precisely detected.

Next, the XYθ tables 12, 13, and 14 are driven to precisely correct the positional deviation in the XYθ directions.
This chip 1 is moved directly below the film carrier 20. In this case, the film carrier 20 is
By observing the lead L in advance and determining the position of this lead L accurately, the chip 1 is positioned directly under the film carrier 20 so that the lead L and the electrode 2 of the chip 1 are properly connected. (Figure 2(c)
reference).

Next, the Z table 15 is driven to raise the stage 11, and the electrode 2 of the chip 1 is joined to the tip of the lead L. Next, while driving the XY table 46 and moving the pressing tool 43 in the XY directions, the pressing tool 43 presses the leads L against the electrodes 2 of the chip 1 one by one to perform inner lead bonding.

The number of leads L and electrodes 2 is extremely large, and it takes a considerable amount of time to bond all the leads L to the electrodes 2. As described above, in the conventional means, the chip 1 gradually shifts position during this time, and the lead L
However, in this method, the tip 1 is kept in position by the position regulating means 16 during that time.
, 17, so that
Chip 1 will not be displaced.

When inner lead bonding is completed as described above, the Z table 15 is driven in the opposite direction, the stage 11 is lowered, and the XY tables 13,
14 is driven to return the stage 11 to the original position shown in FIG. 2(a), but before that, the position regulating means 17 is returned to the original position as follows.

FIG. 3 shows this situation. In this case, the XY tables 13 and 14 are driven to move the stage 11 directly below the key-shaped regulation position piece 36 (see solid line in FIG. 3). Next, by driving the XY tables 13 and 14 and moving the stage 11 in the XY directions, the position regulating piece 36 is pressed against the inner surface of the positioning means 17, and the positioning means 17 is slid to its original position (see the chain line in FIG. 3). .

After the position regulating means 17 has been returned to its original position in this manner, the XY tables 13 and 14 are driven to return the stage 11 to its original position as shown in FIG. Prepare for inner lead bonding.

The present invention is not limited to the above-described embodiment; for example, instead of the suction means 18, the position regulating means 17 may be suctioned onto the stage 11 by a magnet.

[0027]

As explained above, the present invention comprises a stage on which a chip is mounted, an XY table for moving this stage in the XY directions, a means for regulating the position of the chip disposed on this stage, and A suction means for slidably adsorbing the position regulating means onto the stage; and a suction means disposed on the side of the stage, which presses against the position regulating means as the stage moves in the XY direction, thereby regulating the position. A chip positioning device consisting of a pusher that presses the means against the chip, and an initialization means that presses against the position regulating means and returns the position regulating means to its original position by moving the stage in the X and Y directions. With this configuration, chip position correction and chip positioning during bonding can be performed to prevent chip positional deviation and to perform bonding work satisfactorily.

[Brief explanation of the drawing]

FIG. 1: Overall diagram of a bonding device according to the present invention

[Figure 2
】Explanatory diagram of the bonding process according to the present invention

[Fig. 3] Plan view during initialization according to the present invention

[Fig. 4] Cross-sectional view of main parts according to the present invention

[Fig. 5] Perspective view during bonding according to conventional means

[Explanation of symbols]

1 Chip 11 Stage 13 X table 14 Y table 17 Position regulating means 18 Adsorption means 33 Pusher 34 Pusher 36 Initialization means

Claims (1)

[Claims] Claim 1: A stage on which a chip is mounted, an XY table for moving this stage in the XY direction, a position regulating means for the chip disposed on the stage, and a position regulating means for sliding the position on the stage. a suction means that freely attracts the suction; and a pusher located on the side of the stage that presses against the position regulating means and presses the position regulating means against the chip as the stage moves in the X and Y directions. A chip positioning device comprising: and an initializing means for returning the position regulating means to its original position by pressing against the position regulating means as the stage moves in the X and Y directions.