JPH0414900A - Outer lead bonding device - Google Patents

Abstract

PURPOSE:To enable a number of IC pieces to be soldered and obtain an outer lead bonding device which is superb in productivity by constituting a transfer mechanism and a hating mechanism separately and independently. CONSTITUTION:A transfer mechanism 16 has a slide block 21, a sucking nozzle 22 is mounted to a tip, and a heating mechanism has two heating heads 23 and two sets of heating chips 26. Then, a thin plate 40 is placed while it is in contact with an inside surface of each heating chip 26, and the sucking nozzle 22 moves toward an upper part of a center 24 of the heating heads 23 while sucking pieces 2 and then descends, thus placing the pieces 2 onto a substrate 4. Then, the heating chip 26 moves and holds an external lead wire 3 of the pieces 2 for performing soldering. And, the heating chip 26 is constantly being heated by each built-in heater and the external lead wire 3 of the pieces 2 is pressed onto the substrate 4 by the thin plate 40. However, since the thin plate 40 has an improved cooling property, solder is coagulated in a short time, thus enabling each function to be performed in parallel for reducing time and improving productivity.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention involves cutting a plurality of IC chips bonded on a carrier tape into individual pieces, and connecting the external lead wires of the individual pieces to a wiring pattern formed on a substrate. This invention relates to an outer lead bonding device for joining and soldering together to form a circuit.

2. Description of the Related Art A conventional outer lead bonding device is a device that cuts one type of carrier tape on which an IC is bonded into individual pieces and solders one type of individual piece onto a substrate. Therefore, the device and heating device that sucks the individual pieces and transfers them onto the substrate are integrated, and since the suction nozzle is attached to the center of two pairs of heating knobs, they move together to attract and transfer the pieces. ,
It had a heating structure.

The problem that the invention aimed to solve In recent years, there has been an increasing demand for a device that can solder individual pieces of different types of ICs onto a circuit board. In this case, it was difficult to replace the heating head, and since the transfer device and the heating device were integrated, it took a long time because it was not possible to move on to the next operation until the soldering was completed.

In addition, the heating chip melts the solder by controlling the temperature of the built-in heater, then turns off the heater to lower the temperature, and then heats the chip until the solder solidifies.

If the external lead wires of the individual pieces were not held down by the tabs, the external lead wires of the individual pieces would rise above the wiring pattern, resulting in problems such as a long cooling time.

The present invention eliminates the above-mentioned conventional drawbacks, and aims to provide an outer lead bonding device that can solder a wide variety of IC pieces and has excellent productivity. .

Means for Solving the Problems In order to solve the above problems, the present invention provides a method for punching out external lead wires of a carrier tape in which an IC is bonded to the center of a plurality of patterned internal lead wires into individual pieces. selecting a plurality of types of molds and one of the plurality of molds, and sucking and taking out the back side of the individual piece using a suction means;
It is equipped with a piece pick-up mechanism for transporting the pieces to the position of the recognition camera, and further includes a suction nozzle that sucks up the pieces transported to the recognition position, θ rotation of this suction nozzle, vertical movement, and arbitrary wiring pattern on the board. a transfer mechanism having means for transporting the board to the position, a camera for recognizing the position 1 of the external lead wire of the individual piece picked up at the recognition position, and an xy child table for moving the board to an arbitrary position 1. , consists of a heating mechanism for soldering the wiring pattern on the board and the individual external lead wires transferred to an arbitrary position. A heating head and two opposing heating chips that can be moved back and forth relative to each other are grown within the heating head, and the above-mentioned transfer I! The heating mechanism and the heating mechanism are constructed separately and independently from each other.

Function: With the configuration of the present invention, various pieces of carrier films with ICs can be soldered onto a substrate with one device, and productivity can be improved by shortening the soldering time.

Example Embodiments of the present invention will be described below with reference to the drawings.

FIG. 5 is a perspective view showing a portion of the Kinary tape 1 and the piece 2 soldered onto the substrate 4.

An IC 5 is bonded to the center of the carrier tape 1, and external lead wires 3 are arranged on four sides. Which carrier tape 1 is used is just one example, and there are cases in which external lead wires are drawn out only on two sides.

FIG. 1 shows an embodiment of the outer lead bonding apparatus of the present invention, and FIG. 2 shows the structure of the apparatus 0 of the present invention. The carrier tape 1 is supplied in a state where it is wound around the feeder 8 and the glue 7. The carrier tape 1 is pulled out by the winding roller 9 and fed into the mold 1. Twenty cents 8 and molds 1 can be arranged in one or more sets depending on the type of carrier tape 1. The carrier tape l is punched out into individual pieces 2 by the mold 11, and the individual pieces 2 are lifted up onto the upper part of the mold 11. On the other hand, the piece retrieval mechanism 12 has a suction table 13 at its tip.
After the suction table 2 moves to the mold 11 for supplying the pieces 2, this suction table 13 is inserted between the molds 11. Next suction table 1
3 adsorbs the back side of the individual piece 2 by vertical movement, moves to the position of the recognition camera 14, and waits. This recognition camera 1
4 is attached to the slider 15, making it possible to change the position setting.

A slide block 21 is provided on the side 16 of the transfer aircraft driven by the drive motor 15, and a suction nozzle 22 is attached to the tip of the slide block 21. The suction nozzle 22 is movable in the direction of an arrow 17 by a pulse motor 19, and moves to above the suction table 13, then descends to suck up the pieces 2. On the other hand, the suction table 13 moves to the next mold. With the suction nozzle 22 suctioning the individual pieces 2,
The external lead wire 3 of the individual piece 2 is detected by the recognition camera 14 from below.
The correction amount is stored as data. If the external lead wire 3 is misaligned in the θ direction, the rotation motor 20 rotates the suction nozzle 22 to correct it. Next, the suction nozzle 22 moves forward in the direction of arrow I7 to the center 24 of the heating head 23.

The substrate 4 in FIG. 1 is placed on an
It is transported by the XY table 45 to a position where the two coincide with each other. At this time, the amount of correction data for the external lead wire 3 described above is added.

FIG. 3 is a perspective view showing the heating mechanism 25, which has two heating rads 23 and two sets of heating chips 26. These two sets of heating chips 26 are attached with tips having different lengths so as to correspond to the width direction of the external lead wire 3 of the individual piece 2. The heating head 23 can be easily switched by the slide shaft 30 and the motor 29. The heating head 23 also has a slider 33 and a drive motor 31 for moving up and down, a disk 27 capable of rotating in a plane of 90 degrees, a rotation motor 34, and a pole screw 32.

The two sets of heating chips 26 are arranged at the same distance from the same position as the center 24 of the disc 27, and can be moved back and forth by a slide shaft 37 on the disc 27 and a widthwise motor 35. That is, as shown in FIG. 4, a width adjustment motor 35 is attached via a mounting piece 28 to a disk 27 having a rectangular through hole 27a formed in the center thereof, and this width adjustment motor 35 operates a gear 36a, 36b to rotate the ball screw 38, and the U-shaped slide block 3
9 is slid along a slide shaft 37. These two slide shafts 37 have one end and a support shaft 4 in the center.
The two slide shafts 37 are connected by a shaft connecting lever 46 which is pivotally supported at 4, and the two slide shafts 37 can be slid in mutually opposite directions by one width shifting motor 35. A U-shaped parallel plate spring 47 is fixed to the center of the slide block 39, and a heating chip 26 is attached to the front surface of the parallel plate spring 47. Both ends of the heating chip 26 are held by the slide block 39. The pressure lever 48 is pressed. Further, a U-shaped spring receiver 49 is attached to one end of the slide block 39 via a slide shaft 41, a coil spring 42 is inserted into this slide shaft 41, and the spring receiver 49 is always attached downward. Forced. A thin plate 40 is attached to this spring receiver 49.

A pair of such members are arranged facing each other on the disk 27 to constitute the heating rod 23.

Next, the operation of the heating chip 26 will be explained with reference to FIG.

A thin plate 40 is arranged in contact with the inner surface of each heating tip 26, and each thin plate 40 is always pushed downward by a slide shaft 41 and a coil spring 42 on both sides of the heating tip 26. ing. FIG. 6(a) is a side view showing a state in which the suction nozzle 22 has moved to above the center 24 of the heating pad 23 with the individual piece 2 being suctioned. FIG. 6(b) shows a state in which the suction nozzle 22 has descended and placed the individual pieces 2 on the substrate 4. Next, the heating chip 26 moves in the direction of the arrow 43, and as shown in FIG. 6(C), the heating chip 26 presses the external reed wire 3 of the piece 2 and performs soldering. This heating chip 26
are constantly heated by the built-in heater (approximately 3
00°C). FIG. 6(d) is a diagram in which the heating chip 26 has been raised slightly (about 5 m). piece 2
The external lead wire 3 is still pressed onto the substrate 4 by the thin plate 40. Thin plate 40 (thickness approx. 0.3
0.5 vagina) has good heat dissipation, so the solder can solidify in a short time. At this time, it is more effective to make a plurality of round or square holes below the thin plate 40 or to blow cooling air to the lower end of the thin plate 40.

Next, the heating tip 26 rises and returns to the state shown in FIG. 6(a). On the other hand, at the stage shown in FIG. 6(C), the suction nozzle 22 can rise and return to the position above the recognition camera 14 described above.

When there are external lead wires 3 on the four sides of the individual piece 2, (
After performing the operations from a) to FIG. 6(d), the disk 27
The suction nozzle 22 is rotated 90 degrees by the rotary motor 34.
By repeating the same operation in a state where the 4 sides are not reached, soldering on all four sides is possible.

Effects of the Invention As described above, according to the present invention, in response to the demand for an apparatus that can solder individual pieces of different types of ICs onto one substrate, by separating the transfer mechanism and the heating head, In addition, by automatically moving the heating chip back and forth and up and down, each function can be performed in parallel, making it possible to reduce the time by approximately 5 seconds. This can be automatically handled by moving in the width direction. In addition, by attaching a thin plate to the inner side surface of the heating chip, the solder solidification time can be shortened, and a single outer lead bonding machine can handle many types of ICs.
Furthermore, it is highly effective in improving productivity.

[Brief explanation of the drawing]

Fig. 1 is a perspective view of an outer lead bonding device according to an embodiment of the present invention, Fig. 2 is a perspective view showing the structure of the main parts, Fig. 3 is a perspective view of the heating mechanism, and Fig. 4A is the same. FIG. 5 is a perspective view of the main parts of the heating head section; FIG. 5 is a perspective view showing a part of the carrier film soldered to the substrate; FIGS. It is a side view showing. 1...Carrier tape, 2...Individual piece,
3... External lead wire, 4... Board, 5
...IC16...Pattern, 7...
...Reel, 8...Cassette, 9...
・Unwinding roller, 10...device, 11...
... Mold, 12 ... Piece removal mechanism, 13
・・・・・・Observation stand、】４・・・Recognition camera、１
5...Slider, I6...Transfer am side, F...Arrow, 18...Drive motor, 19...Pulse motor, 20 ... Rotating motor, 21 ... Slide bronc, 22.
...Suction nozzle, 23...Heating head,
24...Center, 25...Heating mechanism, 26...Heating chip, 27...Disc, 28...Mounting piece, 29. ·····motor,
30...Slide axis, 3I...Drive motor, 32...Ball screw, 33...
Slider, 34...Rotation motor, 35...
... Width shifting motor, 36a, 36b ... Gear, 37 ... Slide shaft, 38 ... Ball screw, 39 ... Slide bronc, 40 ...・
...Thin plate, 41...Slide shaft, 42...
...Coil spring, 43...Arrow, 44
......Spindle, 45...xY child table 4
6...Connection lever, 47...Parallel plate spring, 48...Pressure lever, 49...Spring holder. Name of agent: Patent attorney Shigetaka Awano, 1 person, 1st rM 7 Sole 6, 80 dern Diagram I key, Itade 35s, < Sota Diagram Diagram (α)

Claims (3)

[Claims] (1) A plurality of types of molds for punching out the outer lead wires of a carrier tape in which an IC is bonded to the center of a plurality of internal lead wires on which a pattern is formed, into individual pieces, and one of the plurality of molds described above. and a suction nozzle for sucking up the individual pieces that have been conveyed to the recognition position. , a transfer mechanism having means for θ rotation of the suction nozzle, vertical movement, and means for transporting the suction nozzle to the position of an arbitrary wiring pattern on the board, and a camera that recognizes the position of the external lead wire of the individual piece suctioned at the recognition position. It consists of an The heating mechanism has two sets of heating heads that can individually move up and down and rotate 90 degrees, and further includes two opposing heating chips that can move back and forth relative to each other within the heating heads, and the transfer mechanism and the heating mechanism. The outer lead bonding device is characterized in that the outer lead bonding devices are separated and independent from each other. (2) The outer lead bonding apparatus according to claim 1, wherein each of the two sets of heating heads is capable of attaching two heating chips of two types having different lengths corresponding to the widths of the external lead wires of the individual pieces. (3) The two sets of heating heads each have a thin plate on the inner surface of the two opposing heating chips that can move back and forth, rotate 90 degrees, and move up and down, and this thin plate is constantly pushed downward by a slider and a spring. The outer lead bonding apparatus according to claim 1, wherein the outer lead bonding apparatus follows the movement of the heating chip.