JPS62270272A - Method and device for soldering - Google Patents

Abstract

PURPOSE:To improve the reliability and working efficiency in soldering by performing the soldering, dropping the solder of a fixed amount molten by heating to an optimum temp. to a work. CONSTITUTION:A linear solder 24 is fed to a cutting part 26 by driving a feeding roller and the solder piece 24 cut in a regular size is flopped on the iron 72 of a closed state by working a cutter. The solder piece 24 is dropped on the solder melting part formed by the guide groove 74 of the iron 72, melted and held thereat temporarily. Owing to the holding time being constant the molten solder is melted by heating to a constant optimum temp. at all times. A soldering iron 72 is then opened by separating iron factors 68a, b, and the molten solder is dripped on a work 86. The closed iron 72 is pushed down by a diaphragm 60 and brought into contact with the solder of the above of the work. The soldering part of the work 86 and solder are instantaneously heated and the remelted solder and the work 86 become conformable. The soldering is completed by returning the iron 72 to the upper part immediately thereafter.

Description

Detailed Description of the Invention 3. Detailed Description of the Invention (Field of Industrial Application) The present invention relates to a soldering method and a soldering apparatus for performing soldering by dropping solder in a molten state onto a workpiece.

(Prior Art) As a device for automatically applying solder only to specific locations on a work such as a printed wiring board, a method using a mortar-shaped soldering iron has been proposed (Japanese Patent Publication No. 34209/1983). In this method, a wire solder having a constant value of 1 to 1 is supplied to this cone-shaped soldering iron, melted, and dripped onto the workpiece through a hole provided at the bottom of the soldering iron. However, in this case, the holding time of the solder in the soldering iron becomes uneven, so the thread solder may fall onto the workpiece before it melts, resulting in incomplete soldering, and the reliability of the soldering is poor. There was a problem.

In addition, a needle valve is provided at the bottom of the crucible-shaped soldering iron, and solder is melted in this crucible-shaped soldering iron in advance.
A device that drips a predetermined amount of solder onto a workpiece by opening and closing a needle valve has also been proposed (Utility Model Publication No. 50-77427).
issue). However, in this case, it was impossible to control the minute amount of solder dripping due to the surface tension of the molten solder itself.

On the other hand, since soldering irons become dirty due to the adhesion of tar and the like, the tip of the soldering iron needs to be cleaned periodically, but there is also the problem that when the device is stopped for this cleaning, the work efficiency is significantly reduced.

Furthermore, in the method of dripping molten solder onto the workpiece, if the workpiece is only preheated and the temperature is low, there is a problem in that the solder and the workpiece are not compatible with each other, and a so-called "potting" condition is likely to occur.

(Object 1 of the invention) The present invention was made in view of the above circumstances, and it is possible to improve the reliability of soldering by dropping a certain amount of solder heated and melted at an appropriate temperature onto a workpiece. The first object of the present invention is to provide an easy-to-use soldering method that enables management of a minute amount of solder, eliminates the need for cleaning the tip of the soldering iron, and improves work efficiency.

Further, the present invention provides a soldering method that improves the compatibility between the workpiece and the solder, prevents the occurrence of incomplete soldering such as a soldering condition, and further improves the reliability of soldering. This is the second purpose.

A third object of the present invention is to provide a soldering device that can be used directly to implement the first invention.

(Structure of the Invention) According to the present invention, the first object is to assemble a plurality of soldering iron elements whose surfaces at least in the solder contact area are formed of a solder repellent material to form a solder melting part, and to form a solder melting part in the solder melting part. After supplying a certain amount of solder pieces, melting the solder pieces in the solder melting part and temporarily holding them, soldering is performed by separating the plurality of solder elements from each other and dripping the molten solder onto the workpiece. This is achieved by a soldering method characterized by:

The second object is achieved in the first aspect by adding a step of reheating the solder on the workpiece by bringing a hot iron tip relatively close to the workpiece after dropping the molten solder.

Furthermore, the third purpose is 1. A soldering device that performs soldering by melting solder and dropping it onto a workpiece, at least the surface of the solder contact area is formed of a solder-repellent material, and is equipped with a plurality of soldering iron elements that can be assembled and separated from each other, and these soldering iron recessed elements This is achieved by a soldering device characterized in that the aggregated state forms a solder molten part.

(Example) Fig. 1 is a perspective view of an embodiment of a soldering device used in an uninvented soldering method, Fig. 2 is a front view thereof, Fig. 3 is a sectional view taken along the line ■-■ in Fig. 2, FIG. 4 is an explanatory diagram of the operation of the solder cutting section, and FIG. 5 is a conceptual diagram of the soldering method.

In these figures, reference numeral 10 is a base, and this base 1
0, a solder supply/cutting section 12, a soldering section 14,
A workpiece fixing table 16 is attached.

The solder supply/cutting section 12 is connected to a moving table 18 and this moving table 1.
A hanging wall 20 erected at 8, a thread hang reel 22, 22 rotatably attached to the side surface of the hanging wall 20, and a thread solder 24 supplied from the thread solder reel 22 to a thread solder cutting section. A pair of feed rollers 28 and 28 are provided.

The moving table 18 has guide rails 3 passing through the vicinity of its left and right ends.
solder supply cutting section 12.
The whole can be moved forward and backward by an air cylinder 32. The feed rollers 28, 28 have guide grooves 28a for guiding the solder thread 24.

28a, and is driven by a motor 33. Furthermore, 34
．． Reference numeral 36 denotes a bracket provided with guide holes for guiding the solder thread 24 before and after the feed rollers 28 and 28.

The solder cutting section 26 includes a cylindrical cutter 38 and a cylindrical holder 40 that slidably holds the cutter 38. The rear portion of the cutter 38 (on the left side in FIG. 3.4) has a reduced diameter, and a piston 42 is attached to the end thereof. This piston 42 slides in an air cylinder 44 attached to the rear of the holder 40 in an airtight manner.

When the cutter 38 is in the retracted position (FIG. 4(A)), the solder thread 24 is inserted into the through hole 48.48 of the cutter 38 that communicates with the hole 46.46 of the holder 40, and the air cylinder 4
When the cutter 38 is moved to the forward position (FIG. 4(B)) by 4, the thread solder 24 in the hole 48, 48 is cut.

The cut solder pieces are then supplied to the soldering section 14 through another guide hole 50,50 of the holder 40. When the naori vine 38 moves from the retracted position to the forward position, the piston 42 collides with the rear surface of the holder 40, and the solder pieces in the holes 48 and 48 fall due to the impact, so the solder pieces are covered with resin and become stuck in the holes. There is no possibility that it will stick to 48 and not come off. Further, the guide hole 50 below the hole 48 regulates the falling direction of the solder piece that falls due to the impact. 52
．． Reference numeral 54 denotes a pin and a guide groove that restrict the rotation of the cutter 38.

The solder cutting section 26 configured as described above is attached to the holder 40.
It is attached to the stay 56 of the hanging wall 20 via.

Reference numeral 58 denotes a stand for the soldering part 14, which holds the bracket 62 vertically movably via a diaphragm 60 attached to a part thereof. A left arm 64 is fixed to the bracket 62 so as to extend diagonally downward to the left, and a right arm 66 is rotatably attached to the bracket 62 so as to extend diagonally downward to the right. A plate-shaped trowel element 68a is attached to the lower end of the left arm 64.
is attached so as to extend obliquely downward to the right, and a soldering iron element 68b is attached to the lower end of the right arm via a stay 70 so as to extend obliquely downwardly to the left. Therefore, both trowel elements 68a
, b face each other so as to gather at their lower ends to form a V-shaped soldering iron 72 when viewed from the front. Both soldering iron elements 68a and 68b have nichrome heaters inside, and the surfaces thereof are coated with a solder repellent material such as ceramic, fluorine resin, or stainless steel.

The solder cutting section 26 faces the space surrounded by the left and right arms 64, 66 and the soldering iron elements 68a and 68b.
6 is advanced by the air cylinder 32 to the iron 72 only when supplying solder pieces (see FIG. 4). Two guide grooves 7 are formed in each soldering iron element 68a, b so as to be located directly below the guide hole 50, 50 of the solder cutting part 26 when moving forward.
4 are provided, and these guide grooves 74 form a solder melting part when the irons 72 are assembled.

Note that the opposing portions of both soldering iron elements 68a and 68b have a small gap that prevents molten solder from falling even when they are assembled. Therefore, when gathering, both irons trade 68a.

The opposing parts of b will not collide and be damaged.

76 is an air cylinder attached to the bracket 62, which pulls the iron element 68b together with the right arm 66 to open the iron 72. 78 is a stopper that adjusts the opening amount of the iron 72. The center of rotation of the right arm 66 is the iron element 68.
Since it is deviated to the left side from the opposing parts of a and b, the iron 7
When the iron element 68b is opened, the iron element 68b moves upward and does not hit the workpiece 86.

The workpiece fixing table 16 has a base 80 fixed to the base 10.
, a slider 82 removably placed on this base 80h, and a pair of leaf springs 84, 84.A workpiece 86 is placed on the top surface of the slider 82 and is held between the leaf springs 84 from the left and right. be done.

Next, a soldering method using this soldering device will be explained based on FIG. 5.

After fixing the workpiece 86 to the workpiece fixing table 26, the feed roller is driven to send the thread solder 24 to the νJ cutting section 26, and the cutter 38 is moved to collect the solder pieces 24 cut to a fixed size into the iron 72 in the closed state. drop it on top. This solder piece 24 is attached to the soldering iron 7.
It falls into the solder melting part formed by the guide groove 74 of No. 2, is melted there, and is temporarily held. Since the holding period is constant, the melted solder 24A is always heated and melted to a constant, appropriate temperature. Furthermore, since the soldering iron elements 68a and 68b are made of a solder-repellent material, the molten solder does not adhere to the soldering iron elements 68a and 68b, but remains in the solder melting part in a spherical state due to surface tension (see Fig. 5). A)).

Next, the iron elements 68a and 68b are separated, the iron 72 is opened, and the molten solder 24A is dripped onto the workpiece 86 ((B) in the same figure).
. At this time, since the inner surface of the iron 72 is made of a solder-repellent material, the molten solder 24A does not remain on the iron 72 and moves onto the workpiece, allowing the amount of solder dripping to be controlled at a constant level ((C) in the same figure). .

Next, the closed iron 72 is pushed down by the diaphragm 60 to approach or contact the solder 24A on the workpiece (
Same figure (D)). The soldering part of the solder 24A and the workpiece 86 is instantly heated by the iron 72, which has a large amount of heat, and the remelted solder 24A and the heated workpiece 8 are heated instantly.
6 becomes familiar. Immediately thereafter, the soldering process can be completed by returning the iron 72 upward (see (E) in the same figure). Note that instead of lowering the iron 72, the workpiece 86
The soldering iron 72 and the solder 24A may be brought closer together or in contact with each other by moving the soldering iron 72 upward.

Note that the resin adhering to the inner surface of the soldering iron 72 is burned and removed by the heat of the soldering iron 72 after the solder is dropped. Therefore, the soldering iron 72 that has been pulled upward upon completion of soldering can be immediately used for the next soldering operation without having to be cleaned.

In the above embodiment, two sets of guide grooves 74 were provided on the iron 72 in order to provide two solder melting parts; however, in the case of one point attachment, it is of course possible to use only one set, and as long as the molten solder can be held. There may be no guide groove.

Furthermore, the opening and closing of the soldering iron 72 is not limited to the case where only one iron element is moved, and it goes without saying that the opening and closing of the iron 72 may be configured to move both iron elements. Furthermore, three or more soldering iron elements forming a soldering iron may be assembled to form a solder melting part, and the present invention also includes such a soldering part.

In this embodiment, the entire outer surface of the soldering iron element is made of ceramic, but if at least the solder melting part and the part that comes into contact with the solder during reheating (Fig. 5 (D)) are covered with a solder repellent material, - minutes.

Note that the solder supplied to the iron is not limited to thread solder cut to a fixed size, but ball solder, grain solder, etc. may be used as long as quantitative properties can be maintained. Also, although it is preferable to use solder solder, you may also use solder that does not contain resin or use a spray set of resin.

(Effects of the Invention) As described above, the first invention aggregates a plurality of soldering iron elements made of a solder repellent material to form a solder melting part, and a certain amount of solder pieces supplied to the solder melting part is transferred to the solder melting part. After melting and holding it for a while, it was dripped onto the workpiece. Therefore, the solder can be heated and melted at an appropriate temperature at all times, improving the reliability of soldering and making it easier to manage small amounts of soldering. Furthermore, there is no need to clean the tip of the soldering iron, which improves work efficiency.

Furthermore, in the second aspect of the invention, since the iron is brought close to the solder dripped onto the workpiece to reheat it, the reliability of soldering can be further improved.

Further, the third invention is such that the solder melting part is formed by assembling a plurality of soldering iron elements that are made of a solder repellent material and can be assembled and separated from each other on at least the surface of the solder contact area, so that the solder melting part can be carried out in accordance with the first invention. Can be used directly.

[Brief explanation of drawings]

Fig. 1 is a perspective view of an embodiment of a soldering device used in the soldering method of the present invention, Fig. 2 is a front view thereof, Fig. 3 is a sectional view taken along the line m-■ in Fig. 2, and Fig. 4 is a FIG. 5 is an explanatory diagram of the operation of the soldering cutting section, and FIG. 5 is a conceptual explanatory diagram of the soldering method. 12... Solder gino cutting/supply section, 14... Soldering section, 16... Work fixing stand, 24.24A... Solder, 26... Solder cutting section, 60... Diaphragm, 68a, 88b.-=+te element, 74... Guide groove. 76...Air cylinder, 86...Work.

Claims (3)

[Claims] (1) A plurality of soldering iron elements whose surfaces at least in the solder contact area are made of a solder repellent material are assembled to form a solder melting area, a certain amount of solder pieces are supplied to the solder melting area, and the solder pieces are A soldering method characterized in that after melting and temporarily holding the solder in the solder melting portion, soldering is performed by separating the plurality of soldering iron elements from each other and dripping the molten solder onto the workpiece. (2) Gather a plurality of soldering iron elements whose surfaces at least in the solder contact area are formed of a solder-repellent material to form a solder melting area, supply a certain amount of solder pieces to the solder melting area, and remove the solder pieces. After melting and temporarily holding the solder in the solder melting part, the plurality of solder elements are separated from each other to drip the molten solder onto the workpiece, and then the soldering iron elements are brought relatively close to the workpiece to melt the solder on the workpiece. A soldering method characterized by reheating the solder. (3) A soldering device that performs soldering by melting solder and dripping it onto a workpiece, which includes a plurality of soldering iron elements in which at least the surface of the solder contact area is formed of a solder repellent material, and which can be separated from each other. A soldering device characterized in that the soldering iron elements form a solder melting part in their assembled state.