JP2023093040A - Soldering device and soldering method - Google Patents

Abstract

To provide a soldering device and a soldering method that can respond to a variety of soldering targets and can improve productivity.SOLUTION: A soldering device 1 includes a head part 3, which is an upper unit for supplying solder, a thread solder cutting mechanism part 40 (described below), which is a cut unit for cutting a thread solder 2, which is solder, to make a solder piece 2b below the head unit, a nozzle 60 located on the lower portion of the thread solder cutting mechanism part 40, and a heater 51 that heats the nozzle 60. The nozzle 60 is provided with a first solder piece supply passage 61a that extends to a predetermined lower end position and a second solder piece supply passage 61b whose lower end position is different from that of the first solder piece supply passage 61a. The nozzle 60 has a first passage forming part 63a that forms the first solder piece supply passage 61a and a second passage forming part 63b that forms the second solder piece supply passage 61b.SELECTED DRAWING: Figure 9

Description

The present invention relates to a soldering apparatus and a soldering method for soldering conductors (terminals, lands, lead wires, etc.) as soldering objects in suitable electrical products such as printed circuit boards and motors.

2. Description of the Related Art Conventionally, a soldering apparatus for mechanically soldering a conductor to a printed circuit board has been provided. The applicant has developed a soldering device that uses a cylindrical nozzle as a soldering iron, inserts pins of electronic components that are inserted through through holes in a printed circuit board into the nozzle, and melts the solder inside for soldering. has been developed and provided (see Patent Document 1).

In addition, a soldering apparatus equipped with a nozzle having a plurality of solder piece supply passages has been developed and provided so that soldering can be simultaneously performed at a plurality of locations on various soldering objects (Patent Document 2). reference).

However, in the conventional nozzle having a plurality of solder piece supply passages, since the lower end positions of the solder piece supply passages are positioned on the same plane, it can only handle conductors to be soldered that are arranged in a plane, which reduces productivity. There is room for improvement in terms of

JP 2013-120869 A JP 2020-167246 A

SUMMARY OF THE INVENTION In view of the above problems, the present invention provides a soldering apparatus and a soldering method capable of simultaneously soldering various objects to be soldered and improving productivity. The purpose is to improve satisfaction.

The present invention relates to a soldering apparatus for soldering a soldering target conductor of a soldering target article, comprising: a nozzle having a plurality of solder strip supply passages through which solder strips pass; and the soldering target conductor and the nozzle. relative position changing means for causing the article to be soldered and the nozzle to approach within a predetermined distance at the nozzle proximity position by changing the relative position of the solder piece, and the solder piece for supplying the solder piece to the solder piece supply passage of the nozzle. supply means; and heating means for heating and melting the solder pieces in the solder piece supply passage by heating the nozzle. The facing surface has a first facing surface and a second facing surface arranged at a position different from the first facing surface in the approaching/separating direction between the conductor to be soldered and the nozzle. and the plurality of solder piece supply passages have at least one first solder piece supply passage communicating with the first facing surface and at least one second solder piece supply passage communicating with the second facing surface. A soldering apparatus and a soldering method are provided.

According to the present invention, it is possible to provide a soldering apparatus and a soldering method capable of simultaneously soldering various objects to be soldered and improving productivity.

The right view of a soldering apparatus. The front view of a soldering apparatus. FIG. 3 is a perspective view for explaining the configuration around the head portion; The front view explaining the structure of the head part periphery. FIG. 2 is a block diagram showing the configuration of the drive system and control system of the soldering device; Explanatory drawing explaining the structure of a thread solder cutting mechanism part. FIG. 4 is an explanatory diagram of the operation of cutting a solder piece; FIG. 4 is an explanatory diagram of the supply operation of the cut solder piece to the nozzle; The front view explaining the structure of a nozzle. FIG. 4 is a vertical cross-sectional view of the nozzle after supplying the solder pieces; FIG. 4 is an enlarged vertical cross-sectional view of the nozzle after supplying the solder pieces; The perspective view explaining the structure of the nozzle of a modification. The side view explaining the structure of the nozzle of a modification.

An embodiment of the present invention will be described below with reference to the drawings. 1 and 2 are explanatory diagrams of the external configuration of the soldering apparatus 1, wherein FIG. 1 is a right side view and FIG. 2 is a front view. 3 is a perspective view around the head portion 3 (upper unit) of the soldering device 1, and FIG. 4 is a front view around the head portion 3 of the soldering device 1. FIG.

As shown in FIGS. 1 and 2, a soldering apparatus 1 is an apparatus for soldering an object P to be soldered such as a printed circuit board. A head portion 3 in which a nozzle 60 (soldering iron) for performing soldering is arranged below, and a proximity/separation for moving the head portion 3 and the nozzle 60 in a direction (vertical direction in FIG. 1) in which the head portion 3 and the nozzle 60 approach/separate from the soldering target article P. Transport that moves the direction moving unit 6 (relative distance changing means), the approaching/separating direction moving unit 6, and the nozzle 60 in the transport direction in which the article P to be soldered is transported (the depth direction in FIG. 1 and the horizontal direction in FIG. 2). It has a directional movement unit 7 and a conveyance width direction movement unit 8 that moves the conveyance direction movement unit 7 and the nozzle 60 in the conveyance width direction of the conveyance direction movement unit 7 (horizontal direction in FIG. 1, depth direction in FIG. 2). are doing.

Hereinafter, the direction in which the head portion 3 and the nozzle 60 are brought closer to/separate from the article P to be soldered is simply referred to as the "approaching/separating direction", and the direction in which the article P is conveyed is simply referred to as the "conveying direction". The transport width direction of the transport direction moving unit 7 may be simply referred to as "transport width direction".

A linear wire solder 2 wound on a reel is provided on the upper portion of the head portion 3 . The wire solder 2 can be of φ0.3 to φ2.0 mm, preferably φ0.6 to φ1.6 mm.

The soldering apparatus 1 includes a head portion 3 that supplies solder, a wire solder cutting mechanism portion 40 (cutting unit, solder piece supply means) that cuts the wire solder 2 to form solder pieces 2b below the head portion 3, and a wire solder cutting mechanism. It has a nozzle 60 below the mechanism section 40 and a heater 51 for heating the nozzle 60 . The wire solder cutting mechanism 40 is movable between a position above the nozzle 60 and a retracted position beside it.

As shown in FIGS. 3 and 4, a support plate 90 is provided below the head portion 3 . A suspension unit 4 (support means) is provided on the support plate 90 so as to protrude downward, and the nozzle unit 5 is supported by the suspension unit 4 . The support plate 90 also functions as a partition plate that separates the upper region of the head portion 3 from the lower region of the head portion 3 where the nozzle units 5 are provided. Further, the support plate 90 is composed of a plate-like member perpendicular to the approaching/separating direction (parallel to the upper portion 50a). ) is provided.

The suspension units 4 are provided on each diagonal line of the upper portion 50 a of the nozzle unit 5 . The upper part 50a is composed of a plate-shaped member perpendicular to the approaching/separating direction. As a result, the nozzle unit 5 is stably attached to the support plate 90 below the head section 3 by the suspension unit 4 so as to be suspended in a well-balanced manner. is supported so as to be movable parallel to the movement of The suspension units 4 may be provided at the four corners of the upper portion 50 a of the nozzle unit 5 .

Further, the suspension unit 4 has a slide shaft that allows sliding movement in the approaching/separating direction (vertical direction in the drawing) and a cylindrical body around the slide shaft. is fixed to the lower surface of the nozzle unit 5, and the other end of the nozzle unit 5 is fixed to the upper surface of the nozzle unit 5. As shown in FIG. One end of a helical spring is fixed to the slide shaft and the tubular body, and the other end of the helical spring is fixed to the tubular body. With this suspension unit 4, the nozzle unit 5 is attached to the support plate 90 so as to be suspended, and is configured to be movable toward and away from the head unit 3 by the elastic force (expansion and contraction) of the helical spring. ing. Therefore, even if the nozzle 60 of the nozzle unit 5 descends and contacts the article P to be soldered, and the head portion 3 descends further, the shock is absorbed by the elastic force of the spring (helical spring) of the suspension unit 4. , the pressure on the article P to be soldered by the nozzle 60 is reduced. The suspension unit 4 also functions as a buffer unit that reduces the load of the nozzle 60 on the article P to be soldered in the approaching/separating direction.

With this suspension unit 4, even if the nozzle 60 comes into contact with the article P to be soldered, the weight (load) of the nozzle unit 5 (including the nozzle 60) relative to the article P to be soldered is reduced. The degree of lightness can be set appropriately, for example, the weight of the nozzle unit 5 is 10% or less when the normal weight is 100%.

A fan 80 that blows air to the area below the support plate 90 , especially the area above the nozzle unit 5 , is provided in the lower portion of the back side of the head portion 3 (below the rear end of the support plate 90 ). The fan 80 is provided to blow air to the upper position of the nozzle 60 when the wire solder cutting mechanism 40 is at least at the retracted position. As shown in FIGS. 3 and 4, the fan 80 is fixed to the head unit 3 in this embodiment, and includes a substantially rectangular parallelepiped housing 81 and an interior of the housing 81. and a fin 82 rotatably arranged in the . In addition to the housing 81 and the fins 82, the fins 82 have, of course, a drive source for rotating the fins 82, a mechanism for supplying power to the drive source, a mechanism for controlling the rotation of the fins 82, and the like. However, since various existing configurations can be appropriately used for these configurations and mechanisms, detailed description thereof will be omitted in this embodiment.

The nozzle unit 5 is mainly composed of a nozzle 60, a heater 51 (see FIGS. 1 and 2) for heating the nozzle 60, and an intermediate body 70 provided above the nozzle 60 and functioning as a partition. The heaters 51 provided on both sides of the nozzle 60 are surrounded by heater covers 50 (see FIGS. 3 and 4). 1 and 2 omit the heater cover 50, and the heater 51 is covered and hidden in FIGS. 3 and 4. As shown in FIG.

The movable range of the head section 3 is a standby position (position P1 shown in FIG. 1) positioned above the transfer width direction moving unit 8, and a soldering position for soldering to soldering target conductors of the soldering target article P. It is a range between the attachment areas E1 and E2 (area defined by E1 in FIG. 1 and E2 in FIG. 2). The head section 3 can be moved by the approach/separation direction moving unit 6 to any position from the standby position P1 to the soldering area.

With this configuration, the soldering apparatus 1 keeps the nozzle 60 on standby at the standby position P1 during standby, and when executing the soldering process, the nozzle 60 is positioned lower than the standby position P1 within the soldering areas E1 and E2 (the object to be soldered). Soldering can be performed at the height of the soldering position (soldering position) P2 (closer to the article P). However, the upper surface of the transport width direction moving unit 8 is configured to have substantially the same height (substantially the same plane) as the upper surface of the transport path 9 for transporting the article P to be soldered. Therefore, the soldering position P2 is within the soldering areas E1 and E2 and is located on the upper surface of the transport path 9 at approximately the same height as the upper surface of the transport width direction moving unit 8 .

FIG. 5 is a block diagram showing the configuration of the drive system and control system of the soldering apparatus 1. As shown in FIG. The soldering apparatus 1 is fixed to a transport width direction moving unit 8 (see FIG. 1) and extends straight toward a transport path 9 (see FIG. 1). 7f and an X-direction (conveyance direction, left and right direction in FIG. 2) transport guide 7c that moves along the Y-direction transport guide 7f by a driving mechanism 7e such as a stepping motor. The driving mechanism 7e and the Y-direction transport guide 7f are accommodated in the transport width direction moving unit 8 (see FIG. 1). The X-direction transport guide 7 c extends straight in the transport direction (X direction) of the transport path 9 .

Above the X-direction transport guide 7c, a moving body 7a that moves in the X direction along the X-direction transport guide 7c, and a stepping device that moves the moving body 7a in the X direction along the X-direction transport guide 7c. A driving mechanism portion 7b configured by a motor or the like is provided. The moving body 7a, the driving mechanism 7b, and the X-direction transport guide 7c are housed in the transport direction moving unit 7 (see FIG. 1). The moving body 7a, the drive mechanism portion 7b, the X-direction transport guide 7c, the drive mechanism portion 7e, and the Y-direction transport guide 7f function as a nozzle position moving means for moving the nozzle 60 to an arbitrary position to be operated. .

The moving body 7a is provided with a Z-direction (height direction) conveying guide 5c extending in a direction in which the nozzle 60 approaches/separates from the through hole. The transport guide 5c is provided with a head fixing portion 5a that moves in the Z direction, and a drive mechanism portion 5b that includes a stepping motor or the like. The head portion 3 is fixed to the head fixing portion 5a. The head fixing portion 5a, the driving mechanism portion 5b, and the transport guide 5c function as an approaching/separating direction moving means for moving the nozzle 60 in the direction of approaching/separating from the article P to be soldered. 1).

The Y-direction conveying guide 7f, the X-direction conveying guide 7c, and the driving mechanism portions 7b and 7e configured in this way function as nozzle position moving means, thereby moving the position of the nozzle 60 in the X direction (conveying direction). and the Y direction (conveyance width direction) and the Z direction (approaching/separating direction) to an arbitrary position. Further, since the Z-direction conveying guide 5c and the driving mechanism 5b function as moving means in the approaching and separating directions, the nozzle 60 is moved in the approaching direction at the moved position, and the hole of the nozzle 60 (a solder piece supply passage to be described later) is moved. 61), the tip of the nozzle 60 is brought close to the soldering target article P at a soldering position (nozzle proximity position) such as bringing the tip of the nozzle 60 close to the soldering target article P, and separated after soldering. can be made In addition, the nozzle 60 and the heater 51 are replaceable, and are moved in a direction close to the replacement nozzle 60 or the heater 51 at the nozzle station (not shown) by the Z-direction conveying guide 5c and the driving mechanism 5b. It can be separated after replacing 60 or heater 51 .

As described above, in the soldering apparatus 1, the relative position between the soldering target article P and the nozzle 60 is changed by the nozzle position moving means and the approaching/separating direction moving means, and the soldering target article P and the soldering target article P are moved at the nozzle proximity position. The nozzle 60 can be brought closer.

A floating unit 15 is provided in the head fixing portion 5a. The floating unit 15 is provided in the air suspension unit, lifts the nozzle unit 5 by supplied air, and makes the weight of the nozzle unit 5 (including the nozzle 60) lighter relative to the article P to be soldered. It is. The floating unit 15 also functions as a cushioning unit that reduces the load of the nozzle 60 on the article P to be soldered in the approaching/separating direction.

The head portion 3 includes a floating unit 15, a wire solder supply guide 16 fixed to the floating unit 15 and through which the wire solder 2 (see FIG. 1) is inserted, and rollers pinching and feeding the wire solder in the wire solder supply guide 16. and a thread solder delivery mechanism section 17 . A wire solder cutting mechanism 40 is provided at the bottom of the head portion 3 . The thread solder cutting mechanism 40 moves the solder pieces in the direction of supply (approaching and separating) from the upper position of the nozzle unit 5 to the retracted position on the side of the nozzle unit 5 by means of a rotating mechanism 19 (moving means) composed of a stepping motor or the like. direction), and cuts (cuts) the wire solder 2 (see FIG. 1) supplied to the wire solder supply guide 16 under the control of the rotation mechanism 19 .

An intermediate body 70 (heat transfer preventing body) is provided below the wire solder cutting mechanism 40 with a slight gap therebetween, and a nozzle 60 is provided below the intermediate body 70 with a small gap therebetween. In this way, the wire solder cutting mechanism 40, the intermediate body 70, and the nozzle 60 are arranged in this order downward in the supply direction of the solder piece 2b, and the wire solder cutting mechanism 40 cuts the wire solder 2. The solder pieces with the cut ends pass through the intermediate body 70 and are supplied to the nozzle 60 .

Further, each element is controlled by the control section 21 to drive these constituent elements. The control section 21 includes a drive mechanism section 5b, a drive mechanism section 7b, a drive mechanism section 7e, a floating unit 15, a wire solder delivery mechanism section 17, a rotation mechanism section 19, a heater unit contact confirmation sensor 22, a temperature sensor 23, an attachment/detachment An air cylinder 24, a camera 25, and a storage unit 26 are connected.

The camera 25 is used to confirm and position the through holes and pins of the printed circuit board, which are conductors to be soldered, and to detect soldering errors such as soldering red eyes. .

The storage unit 26 stores an image of a soldering target article P such as a printed circuit board, tool data for each soldering target work that associates a tool (nozzle 60 or heater 51) to be used for this soldering target article P, and currently mounted work. It stores data such as the type of tool worn, the number of times the tool is currently worn, and the usage time.

The wire solder cutting mechanism 40 includes a wire solder supply guide 16 having a passage through which the wire solder 2a fed downward passes, a solder piece storage body 44 for storing a plurality of cut solder pieces 2b, and a solder piece storage body. 44 is configured by a rotating mechanism portion 19 (see FIG. 5).

6A is an exploded perspective view showing the configuration of the wire solder cutting mechanism 40, and FIG. 6B is a longitudinal sectional view showing the configuration of the wire solder cutting mechanism 40. FIG. As shown in FIGS. 6(A) and 6(B), the solder piece storage 44 includes a shutter 36 for controlling storage/discharge of the stored solder pieces 2b and an urging member for urging the shutter 36. 35 (biasing means) are provided. Further, the wire solder cutting mechanism 40 is provided with a shutter operating section 49 (shutter movement restricting body) that operates to release the shutter 36 separately (independently) from the solder piece storage body 44 . The solder piece container 44, the rotation mechanism 19, the shutter 36, and the shutter operation unit 49 serve as solder piece supply means for supplying the solder pieces 2b to the holes of the nozzle 60 (solder piece supply passages 61, which will be described later). also works.

The wire solder supply guide 16 is formed of a metal member in a cylindrical shape, and allows the solder wire 2a to pass through an inner hole (passage) in the longitudinal direction. Also, the solder wire supply guide 16 is fixed so as not to move in a direction perpendicular to the passing direction of the solder wire 2a (radial direction of the solder wire 2a). The urging body 35 can be made of an appropriate spring, and is made of a metal helical spring in this embodiment.

The shutter 36 is composed of a metal plate bent in an L shape, and the bottom of the L shape is a storage/release control plate portion 38 in a horizontal state (perpendicular to the approaching/separating direction). A pressing operation portion 37 is pressed by the biasing body 35 on the vertical surface. The storage/release control plate portion 38 is provided with a plurality of release holes 38a (through holes or through grooves) arranged side by side. A portion adjacent to the release hole 38a (including a portion between the release holes 38a and 38a) functions as a closing portion that prevents the solder piece 2b from falling. Although the shutter 36 is provided with a plurality of release holes 38a, the configuration is not limited to this, and a plurality of release grooves may be provided so that the storage/release control plate portion 38 of the shutter 36 looks like a comb when viewed from above. . The same function can be ensured in this case as well.

The solder piece container 44 is formed by integrally forming a guide portion 48 wider than the width of the block portion 43 in the lateral direction and having the same length in the longitudinal direction on the lower surface of the oblong cubic block portion 43 . The guide portion 48 is provided with a shutter insertion hole 47 that penetrates in the longitudinal direction. The height and width of the shutter insertion hole 47 are slightly larger than the height and width of the retention/release control plate portion 38 of the shutter 36 so that the shutter 36 can slide smoothly in the longitudinal direction without blurring. there is A plurality of solder piece storage portions 45 are provided through the block portion 43 and the guide portion 48 in the vertical direction (approaching/separating direction). The solder piece storage portions 45 are the same size as the release holes 38a of the shutter 36 and are provided at the same intervals.

The release hole 38 a of the shutter 36 may be formed larger than the solder piece storage portion 45 . As a result, the solder piece 2b can be reliably dropped in the open state. Moreover, although the solder piece storage part 45 is formed of a hole, it is not limited to this. It can be of any suitable shape to accommodate it.

One end of the guide plate 42 that is elongated in the longitudinal direction of the solder piece container 44 is connected to the upper end of the solder piece container 44 in the longitudinal direction. A hole 41 for screwing is provided at the other end of the guide plate 42 , and the locking plate 32 is screwed into the hole 41 with a screw 31 .

The locking plate 32 has a screw hole 33 through which the screw 31 is inserted. A pressing counter surface 34 that faces the pressing operation portion 37 of the shutter 36 is provided in a portion of the locking plate 32 below the screw hole 33 . One end of the urging body 35 abuts against the pressing surface 34 , and the other end of the urging body 35 abuts against the pressing operation portion 37 of the shutter 36 . The biasing body 35, whose normal state is the extended state, biases the pressing counter surface 34 and the pressing operation portion 37 in the direction of separation. As a result, the shutter 36 is maintained in a state in which the pressing operation portion 37 is in contact with one end surface of the solder piece container 44 . At this time, as shown in FIG. 6B, the solder piece storage portion 45 of the solder piece storage body 44 and the release hole 38a of the shutter 36 are misaligned, and the solder piece storage portion 45 of the solder piece storage body 44 is displaced. It is in a closed state by the storage/release control plate portion 38 (closing portion) of the shutter 36 . Accordingly, the solder pieces 2b existing in the solder piece storage portion 45 are stored inside the solder piece storage portion 45 by the storage/release control plate portion 38 of the shutter 36 so as not to fall downward.

The shutter operation portion 49 is arranged to face the end surface of the storage/release control plate portion 38 of the shutter 36 on the side opposite to the pressing operation portion 37 . Therefore, when the solder piece container 44 is moved toward the shutter operation portion 49 together with the shutter 36 by the rotational driving of the rotation mechanism portion 19 (see FIG. 5), the end face of the shutter 36 contacts the shutter operation portion 49 . When the solder piece container 44 is further moved by the rotational drive of the rotation mechanism 19 (see FIG. 5), the shutter operation unit 49 does not move the shutter 36 any further. The relative positions are changed, the positions of the solder piece storage portion 45 of the solder piece storage body 44 and the release hole 38a of the shutter 36 become the same and the release state is established, and the solder piece 2b drops downward.

The solder piece container 44 and the solder wire supply guide 16 are arranged so that their facing surfaces are in contact with each other or close to each other so that they can move relative to each other in the radial direction of the solder wire 2a to be supplied. In this embodiment, the solder wire supply guide 16 is fixed, and the solder piece container 44 can slide in the radial direction of the solder wire 2a. Therefore, while part of the solder wire 2a drawn out from the solder wire supply guide 16 is being supplied to the solder piece storage portion 45 of the solder piece storage body 44, the solder piece storage body 44 is moved in the radial direction of the solder wire 2a. When moved, the solder wire 2a is cut (sheared) at the contact surfaces of the solder piece storage 44 and the solder wire supply guide 16 due to the relative movement of the solder storage 44 and the solder wire supply guide 16 . Accordingly, the solder piece container 44 and the solder wire supply guide 16 serve as solder piece cutting means for cutting the solder pieces 2b. The cut solder piece 2 b is stored in the solder piece storage portion 45 of the solder piece storage body 44 .

Further, the upper surface of the solder piece container 44, the lower surface of the solder wire supply guide 16, and the retention/release control plate portion 38 of the shutter 36 are all parallel to the moving direction of the solder piece container 44 (particularly, the horizontal direction in this embodiment). is configured to In addition, the longitudinal direction (solder piece passage direction) of the solder piece storage portion 45 and the longitudinal direction (solder piece passage direction) of the solder piece supply passage 61 (solder piece supply passage, see FIG. 8) of the nozzle 60 are all the same. It is configured perpendicular to the moving direction of the body 44 (particularly in the vertical direction in this embodiment).

7 and 8, the wire solder 2 is cut by the solder piece storage body 44 to store a plurality of solder pieces 2b, and then the shutter 36 is opened to drop the plurality of solder pieces 2b to drop the intermediate body 70. It is explanatory drawing explaining the operation|movement which passes and supplies to the nozzle 60 with sectional drawing. This operation is executed by controlling the driving of the wire solder delivery mechanism 17 and the rotation mechanism 19 by the controller 21 (see FIG. 5).

As shown in FIG. 7A, the rotation mechanism 19 (see FIG. 5) rotates the solder piece container 44 so that the solder piece container 45 closest to the shutter operation unit 49 is positioned on the wire solder supply guide 16. As shown in FIG. It stops at the lower position in a state in which the upper and lower parts are communicated with each other. In this state, the solder wire 2a, which is pulled out from the tip side of the wound solder wire 2 (see FIG. 1) and formed into a rod shape, is sent out by the wire solder delivery mechanism 17 (see FIG. 5), and as shown in FIG. As shown in B), the tip of the wire solder 2a is accommodated in the solder piece accommodating portion 45. As shown in FIG. Then, when the wire solder 2a is drawn out until the length from the facing surface portion (contact surface portion) of the solder piece storage body 44 and the wire solder supply guide 16 to the tip of the wire solder 2a reaches the required length of the solder piece 2b, the wire The solder delivery mechanism 17 (see FIG. 5) stops the supply (delivery) of the wire solder 2a.

In this state, when the solder piece container 44 is slid by rotating the rotating mechanism 19 (see FIG. 5), the solder piece container 44 and the solder wire supply guide 16 are moved by the facing surfaces (contact surfaces) of the solder wire 2a. is cut to form a solder piece 2b, and the solder piece 2b is accommodated (stored) in the solder piece storage portion 45 as shown in FIG. 7(C). FIG. 7(C) shows a state in which this cutting is repeated by the number of solder piece storage portions 45 (as many as required) and the cutting is completed.

When the solder piece container 44 is slidably moved by rotating the rotating mechanism 19 (see FIG. 5), the tip of the shutter 36 is pressed against the shutter operating portion 49 as shown in FIG. are compressed, the solder piece storage portion 45 of the solder piece storage body 44 and the release hole 38a of the shutter 36 are all communicated with each other, and the plurality of solder pieces 2b fall all at once and pass through the through hole 73 of the intermediate member 70 below. , and is further supplied to the solder piece supply passage 61 of the lower nozzle 60 . When dropping the solder pieces 2b, the push-in rods 18 (see FIG. 3) are inserted into all the solder piece storage portions 45 from above downward to push the solder pieces 2b downward, thereby pushing the solder pieces 2b downward. A configuration in which the liquid is forcibly supplied to the nozzle 60 (see FIG. 5) may be employed.

The intermediate body 70 is arranged between the solder piece container 44 and the nozzle 60 of the wire solder cutting mechanism 40, as shown in the longitudinal sectional view of FIG. A gap S1 is formed between the intermediate body 70 and the solder piece storage body 44, and a gap S2 is formed between the intermediate body 70 and the nozzle 60. As shown in FIG. This intermediate body 70 is integrally molded from aluminum. The material of the intermediate body 70 is not limited to this, and other materials such as stainless steel and heat-insulating ceramics can also be used.

The intermediate body 70 is formed with a plurality of through holes 73 through which the solder pieces 2b pass, which are the same number as the solder piece supply passages 61 of the nozzle 60 and which are opposed to the solder piece supply passages 61 at the same intervals. The plurality of through-holes 73 are also arranged in the solder piece storage body 44 in the same number as the solder piece storage portions 45 at the same intervals and at positions corresponding to the solder piece storage portions 45 .

9 is a front view for explaining the configuration of the nozzle 60, FIG. 10 is a longitudinal sectional view of the nozzle 60 after the solder piece 2b is supplied, and FIG. 11 is an enlarged longitudinal sectional view of the nozzle 60 after the solder piece 2b is supplied. be.

As shown in FIG. 9, the nozzle 60 has a plate-like or block-like shape and is made of a material such as ceramic. The nozzle 60 of this embodiment is integrally formed of ceramic.

The heater 51 has a plate-shaped heating member, is provided in contact with the front surface and the back surface of the nozzle 60, and is configured to sandwich the nozzle 60 between the heating members from the front and rear. The heater 51 (heating member) is provided at the center in the conveying direction of the front and back surfaces of the nozzles 60 and over the center in the vertical direction (approaching and separating direction) from the upper end.

The nozzle 60 is formed with a solder piece supply passage 61 that guides the solder piece 2b supplied through (via) the intermediate body 70 to a position where the terminal T is brought into contact with the solder piece 2b. The solder piece supply passages 61 are formed so as to extend in the vertical direction (the approaching and separating directions), and a plurality of (six in this embodiment) are arranged. Also, the plurality of solder piece supply passages 61 are formed linearly and arranged parallel to each other. In addition, the plurality of solder piece supply passages 61 are arranged so as to be regularly arranged at equal intervals in the width direction of the passage (in the conveying direction in this embodiment). The plurality of solder piece supply passages 61 may be arranged so as to line up in the transport width direction, or may be arranged irregularly (randomly).

In the present embodiment, each of the plurality of solder piece supply passages 61 is a straight hole having the same thickness (inner diameter) and a circular cross section. In addition, the solder piece supply passage 61 is not limited to a circular cross section, and may have an appropriate shape such as a polygonal cross section, an elliptical cross section, or a square cross section. For example, if the wire solder 2 has a circular cross section, it is preferable that the solder piece supply passage 61 also has a circular cross section.

Further, the solder piece supply passages 61 are formed at approximately the same size and at the same intervals as the solder piece storage portions 45 of the solder piece storage body 44 (see FIG. 8) and the through holes 73 of the intermediate member 70 . That is, each solder piece supply passage 61 is arranged at a position corresponding to each solder piece storage portion 45 of the solder piece storage body 44 (see FIG. 8) and each through hole 73 of the intermediate body 70 .

Therefore, as shown in FIG. 8, the solder pieces 2b that fall all at once (almost at the same time) are arranged such that the solder piece storage portion 45, the through hole 73, and the solder piece supply passage 61 communicate with each other in a straight line in the vertical direction. , they pass through the through-holes 73 of the intermediate body 70 and are supplied all at once (almost simultaneously) to the solder piece supply passages 61 of the nozzle 60 .

Although not shown, a hole is provided at an arbitrary position on the outer surface of the nozzle 60, and a thermocouple is inserted into this hole. The thermocouple functions as part of temperature sensor 23 (see FIG. 5) and measures the temperature of nozzle 60 .

Further, of the outer surface of the nozzle 60 , the surface facing the object P to be soldered becomes the facing surface 62 . In this embodiment, the soldering target conductor in the soldering target article P is the printed circuit board P or the land R of the printed circuit board P, which is arranged below the nozzle 60 . Therefore, the facing surface 62 is the bottom surface of the nozzle 60 .

Further, as shown in FIGS. 9 to 11, the plurality of solder piece supply passages 61 includes at least one first solder piece extending to a predetermined lower end position (the end position on the side facing the printed circuit board P in the approaching/separating direction). It has a solder piece supply passage 61a and at least one second solder piece supply passage 61b whose lower end position is different from that of the first solder piece supply passage 61a. The upper end positions of the first solder piece supply passage 61a and the second solder piece supply passage 61b are the same (located on the same horizontal plane).

That is, the plurality of solder piece supply passages 61 have first solder piece supply passages 61a and second solder piece supply passages 61b having mutually different lengths. The lower end position of the first solder piece supply passage 61a is called the first lower end position L1, and the lower end position of the second solder piece supply passage 61b is called the second lower end position L2. In this embodiment, the first lower end position L1 is located above the second lower end position L2 (in the direction away from the printed circuit board P). That is, the second lower end position L2 is located below the first lower end position L1, and the second solder piece supply passage 61b extends below the first solder piece supply passage 61a.

In this embodiment, the nozzle 60 is formed with a plurality of first solder piece supply passages 61a and a plurality of second solder piece supply passages 61b. Specifically, four first solder piece supply passages 61a and two second solder piece supply passages 61b are formed.

The nozzle 60 also has a passage forming portion 63 that forms the solder piece supply passage 61 . The passage forming portion 63 has a first passage forming portion 63a forming the first solder piece supply passage 61a and a second passage forming portion 63b forming the second solder piece supply passage 61b. In this embodiment, the first passage forming portion 63a and the second passage forming portion 63b are integrally formed. That is, the passage forming portion 63 is integrally formed as a whole.

Furthermore, the opposing surface 62 has a first opposing surface 62a that is the opposing surface of the first passage forming portion 63a and a second opposing surface 62b that is the opposing surface of the second passage forming portion 63b. The positions of the first facing surface 62a and the second facing surface 62b in the approaching and separating direction are the lower end positions of the first passage forming portion 63a and the second passage forming portion 63b, so the first facing surface 62a and the second facing surface 62b. exist at different positions in the approaching/separating direction. That is, the nozzle 60 has a first opposing surface 62a and a second opposing surface 62b arranged at a position different from the first opposing surface 62a in the approaching/separating direction. Therefore, the facing surface 62 (the lower surface of the nozzle 60) is provided with a step due to the height difference between the first facing surface 62a and the second facing surface 62b. Also, the first solder piece supply passage 61a communicates with the first facing surface 62a, and the second solder piece supply passage 61b communicates with the second facing surface 62b.

Also, the first lower end position L1 (the position of the first facing surface 62a) of the first solder piece supply passage 61a (the first passage forming portion 63a) and the position of the second solder piece supply passage 61b (the second passage forming portion 63b) Each of the second lower end positions L2 (the positions of the second opposing surface 62b) is set according to the soldering target positions (the positions of the lands R and the terminals T) on the printed circuit board P, which is the article P to be soldered. Although the details will be described later, the soldering target positions on the printed circuit board P of the present embodiment include two types of soldering target positions having different positions in the approaching/separating direction. The height difference between the first facing surface 62a and the second facing surface 62b is set according to the height difference of the soldering target position on the printed circuit board P. As shown in FIG.

Next, the soldering operation will be described in detail. First, as shown in FIGS. 10 and 11, as a base material for soldering, a printed circuit board P on which lands R are formed is provided with through holes of the printed circuit board P from the front side to the back side (FIG. 10). Then, the one in which the terminal T of the electronic component C is inserted from the lower surface side to the upper surface side is prepared.
<Positioning process>

The control unit 21 moves the positions of the plurality of solder piece supply passages 61 of the nozzle 60 on the XY plane by using the Y-direction conveying guide 7f, the X-direction conveying guide 7c, and the driving mechanism units 7b and 7e for soldering. facing a plurality of lands R. At this time, the center of the land R on the back side of the printed circuit board P and the center of the solder piece supply passage 61 are approximately aligned, or the center of the tip of the terminal T and the center of the solder piece supply passage 61 are approximately aligned. Match position. That is, in the alignment step, the nozzles 60 are aligned with the lands R and the terminals T in the transport direction and the transport width direction.
<Solder piece cutting and storage process>

The control unit 21 supplies the wire solder 2 a to the required length to one solder piece storage portion 45 in the solder piece storage body 44 by the wire solder feeding mechanism 17 , and drives the rotation mechanism portion 19 to move the solder piece storage body 44 . is moved in the radial direction (thickness direction) of the wire solder 2a, and the wire solder 2 is cut by the wire solder cutting mechanism 40 (wire solder cutting means) to obtain the solder piece 2b, which is stored in the solder piece storage unit 45. . At this time, since the shutter 36 is in the closed state, the solder piece 2b does not immediately drop from the solder piece storage portion 45. As shown in FIG. By repeating this operation, the solder pieces 2b of the required length are stored in all the solder piece storage portions 45 one by one. This solder piece cutting and storing process is executed before the positioning process, or is executed in parallel with the positioning process. The timing can be set appropriately so that a large time difference does not occur between them.
<Nozzle proximity process>

The control unit 21 causes the drive mechanism unit 5b to move the head unit 3 in the floating state along the transport guide 5c in the direction of approaching the land R, so that the opposing surface 62 of the nozzle 60 is aligned with the land R on the back side of the printed circuit board P. close to the surface of That is, the nozzle 60 is moved to the nozzle proximity position so as to approach the printed circuit board P. FIG. In this embodiment, the printed board P has a first board Pa and a second board Pb, and there is a height difference between the first board Pa and the second board Pb. . That is, the article P to be soldered according to this embodiment has a first substrate Pa and a second substrate Pb on which a plurality of lands R are arranged three-dimensionally. Specifically, the first substrate Pa is located above the second substrate Pb (in the direction toward the nozzle 60).

Here, the first lower end position L1 (the position of the first opposing surface 62a) of the first solder piece supply passage 61a (the first passage forming portion 63a) is the height (position) of the first substrate Pa in the approaching/separating direction. , and the second lower end position L2 (the position of the second facing surface 62b) of the second solder piece supply passage 61b (the second passage forming portion 63b) is located on the second substrate Pb in the approaching and separating direction. It is set according to the height (position).

At the nozzle proximity position, the first opposing surface 62a is separated from the first substrate Pa itself or the land R provided on the first substrate Pa by a predetermined separation distance (first separation distance) D1 in the proximity/separation direction. The second opposing surface 62b is separated from the second substrate Pb itself or the land R provided on the second substrate Pb by a predetermined separation distance (second separation distance) D2 in the direction of proximity and separation. ing. That is, at the nozzle proximity position, the land R and the nozzle 60 are kept in a non-contact and separated state. The first separation distance D1 and the second separation distance D2 may be the same distance or different distances. For example, if a member susceptible to heat damage exists nearby, the first separation distance D1 or the second separation distance D2 may be set longer, or the first opposing surface 62a or the second opposing surface 62a may be set longer. If it is necessary to transfer heat efficiently, such as when 62b is distant from the heater 51, the first separation distance D1 or the second separation distance D2 may be set short.

Also, each of the first separation distance D1 and the second separation distance D2 is at least a distance shorter than the projecting height TL of the terminal T from the land R on the corresponding substrates Pa and Pb. As a result, the tip of the terminal T is inserted inside the solder piece supply passage 61 of the nozzle 60 .

Furthermore, in order to achieve both efficient heat transfer for melting the solder piece 2b and reduction of damage to the printed circuit board P, the upper limit of the first separation distance D1 and the second separation distance D2 is , the projection height TL or less, preferably 0.3 mm or less. The lower limit of the first separation distance D1 and the second separation distance D2 is 0 mm (state where the nozzle 60 and the land R are in contact).

At the nozzle proximity position, the terminal T is equidistant from the inner wall of the solder piece supply passage 61 of the nozzle 60 (in the conveying direction or the conveying width direction). kept. This prevents direct heat transfer from the nozzle 60 to the terminal T, and the terminal T is gradually heated by radiant heat transfer and convective heat transfer. Also, the land R that does not contact the nozzle 60 is gradually heated by radiant heat transfer and convective heat transfer.
<Solder piece supply process>

The control section 21 drives the rotation mechanism section 19 to further move the solder piece container 44 until the shutter 36 comes into contact with the shutter operating section 49 and is pressed. As a result, the plurality of release holes 38a of the shutter 36 communicate with the plurality of solder piece storage portions 45, respectively, and the plurality of solder pieces 2b fall all at once, pass through the through holes 73 of the intermediate body 70, and furthermore, the nozzle 60 , the solder pieces 2b are supplied one by one to the plurality of solder piece supply passages 61 of . At this time, the solder piece container 44 with the shutter 36 open substantially fills the space between the support plate 90 and the nozzle 60 and the intermediate member 70 . Also, at this time, by pushing the solder piece 2b from above with the push rod 18 (see FIG. 3), even if there is a solder piece 2b that does not fall freely, the solder piece 2b can be reliably lowered until it contacts the tip of the terminal T. do.

The solder piece 2b supplied to drop from above is preheated while passing through the solder piece supply passage 61, and the end contacts the terminal T and stops at the contact position, thereby restricting its position and dropping. Specifically, the solder pieces 2b are most convex with respect to the tip of the terminal T of the electronic component C on the printed circuit board P (or the solder piece guide direction of the solder piece supply passage 61 (downward in FIGS. 10 and 11). 10 and 11)) to stop. In the illustrated example, the solder piece 2b is placed on the terminal T and stopped. At this time, the inner wall of the solder piece supply passage 61 also functions as a drop regulating portion that prevents the solder piece 2b from falling vertically or obliquely on the tip of the terminal T. FIG.
<Melting process>

The solder piece 2b before melting guided to the contact position does not drop from that position, and at least a portion thereof, such as the end opposite to the terminal T, contacts the inner wall of the solder piece supply passage 61. FIG. For this reason, the heat of the nozzle 60 heated by the heater 51 is transmitted to the solder pieces 2b, and the plurality of solder pieces 2b at the abutting position before being melted are in contact with the inner wall of the solder piece supply passage 61. are simultaneously melted by heat conduction through one end, both ends and/or sides of the . When the solder piece 2b is melted, in addition to the direct heat conduction in contact with the nozzle 60, indirect heat conduction such as radiant heat transfer from the nozzle 60 and convective heat transfer by hot air convecting in the nozzle 60 is also performed. done.

When the plurality of solder pieces 2b are melted, they tend to curl into a substantially spherical shape due to surface tension. It deforms into a thick and short shape in a state of being in contact with the tip of T (a state of being placed on the terminal T). This shape is a shape in which both ends of a short cylinder are spherical.

When melted in this manner, heat is transferred from the nozzle 60 to the plurality of solder pieces 2b, and further heat is transferred from the plurality of solder pieces 2b to the plurality of terminals T, thereby heating the plurality of terminals T more rapidly than before. be done. During this heating, the melted solder piece 2b is in contact with the terminal T, that is, is placed on the terminal T and is stopped without moving in the solder piece supply direction (downward). It should be noted that the solder piece 2b melts at a temperature of 217° C. or higher.

When the terminals T are heated to an appropriate temperature through the melted solder pieces 2b, the plurality of melted solder pieces 2b begin to get wet and flow downward from the tips of the terminals T along the side surfaces of the terminals T all at once. Here, the solder piece 2b may continue to change its shape due to the influence of heat or the like while remaining in position after it has started to melt and before it flows out. In addition, since solder has the property of flowing in the direction of higher temperature, when the solder piece 2b begins to melt and flow downward, a part of the solder piece 2b will be in contact with the facing surface 62 of the nozzle 60 or the facing surface 62 and the land R. It will be in a state of turning around. At this time, the solder piece 2b receives direct heat (transferred heat) also from the facing surface 62 of the nozzle 60, and is further heated.

The melted solder piece 2b flowing along the side surface of the terminal T spreads to the land R on the back side, and further flows into the gap between the side surface of the terminal T and the land R facing the through hole due to capillary action. do. Then, it spreads to the land R on the surface side as well.
<Nozzle separation process>

After that, the control unit 21 moves the head unit 3 in the floating state along the transport guide 5c in the direction away from the land R (printed circuit board P) by the drive mechanism unit 5b, and moves the tip surface of the nozzle 60 to the printed circuit board P. It is separated from the surface of the land R on the back side. As a result, the land R, the terminal T, and the melted solder piece 2b are rapidly cooled, the melted solder piece 2b is solidified, and the soldering operation is completed.

By such movement of the melted solder piece 2b, the plurality of terminals T are reliably soldered to the plurality of lands R and electrically connected. The finished appearance of the solders of the plurality of locations simultaneously (almost simultaneously) soldered is beautiful, and the back fillet shape is also formed neatly.

With the above configuration and operation, various soldering objects can be handled, and productivity can be improved. Specifically, the nozzle 60 of the present invention has a first facing surface 62a and a second facing surface 62b arranged at mutually different positions in the approaching/separating direction, and a first solder piece communicating with the first facing surface 62a. It has a supply passage 61a and a second solder piece supply passage 61b communicating with the second facing surface 62b. Therefore, soldering can be performed all at once (substantially simultaneously) on the article P to be soldered on which a plurality of lands R are arranged three-dimensionally.

Further, in the present embodiment, the first passage forming portion 63a forming the first solder piece supply passage 61a and the second passage forming portion 63b forming the second facing surface 62b are integrally formed. The amount of heat (thermal mass) accumulated in the nozzle 60 is increased, and the temperature drop of the nozzle 60 during soldering of the nozzle 60 can be suppressed.

Furthermore, in this embodiment, since the suspension unit 4 or the floating unit 15 as a cushioning unit for reducing the load of the nozzle 60 on the article P to be soldered in the approaching and separating directions is provided, the nozzle 60 and the article P to be soldered are separated from each other. Even if contact occurs, the damage to the soldering target article P can be reduced.

The present invention is not limited to this embodiment, and various other embodiments are possible. Also, the specific configurations and the like given in the above-described embodiments are examples, and can be changed as appropriate according to actual products.

For example, the conductors to be soldered are not limited to the terminals T and lands R of the printed circuit board P. For example, the terminals and lead wires of a motor may be used, or the terminals laid on the wiring of the printed circuit board and the relevant wiring may be used. , etc., can be used as appropriate soldering targets. In these cases as well, soldering can be performed while the nozzle is brought close to the object to be soldered. Further, in the above-described embodiment, the solder piece supply step and the solder piece melting step are performed at the nozzle proximate position. You may make it The position of the nozzle 60 in this case can be called a nozzle contact position.

Further, in the soldering target article P, when the nozzle 60 is positioned at the nozzle proximate position, the portion facing the facing surface 62 of the nozzle 60 may be a part of the soldering target conductor, or may be a part of the soldering target conductor. It may also be a portion, such as an insulator plate.

Further, the facing surface 62 (the first facing surface 62a and the second facing surface 62b) of the nozzle 60 may be provided with a protruding portion that protrudes toward the soldering target article P (downward). That is, the facing surface 62 has a surface (protruding surface) of the outer surface that protrudes toward the article P to be soldered, and a base surface located above the protruding surface. In this way, even if the nozzle 60 abuts (contacts) the article P to be soldered, only the projecting surface of the outer surface of the nozzle 60 contacts the article P to be soldered. Also, the heat directly transferred from the nozzle 60 to the article P to be soldered when the solder is melted can be reduced, and the physical damage to the article P to be soldered can be reduced. As a result, damage to the article P to be soldered can be reduced.

Furthermore, as shown in FIG. 12, the plurality of solder piece supply passages 61 is a third solder piece supply passage whose lower end positions are different from the first solder piece supply passage 61a and the second solder piece supply passage 61b. 61c. In this case, the passage forming portion 63 has a first passage forming portion 63a and a second passage forming portion 63b, and a third passage forming portion 63c forming a third solder piece supply passage 61c. In addition to the first opposing surface 62a and the second opposing surface 62b, the opposing surface 62 has a third opposing surface 62c that is the opposing surface at the third passage forming portion 63c. As a result, soldering can be performed all at once (almost simultaneously) on the article to be soldered P having a plurality of lands R arranged at three different heights. Further, the nozzles 60 having four or more stages can be formed by a similar method.

Further, as shown in FIG. 13, the heater 51 may have a first heater 51a that heats the first passage forming portion 63a and a second heater 51b that heats the second passage forming portion 63b. The heater 51 is provided with a heating portion 52 which is a portion that actually heats, the first heater 51a has a first heating portion 52a, and the second heater 51b has a second heating portion 52b. In this case, the second heating section 52b is arranged below the first heating section 52a. Therefore, the distance D3 from the first opposing surface 62a to the first heating portion 52a and the distance D4 from the second opposing surface 62b to the second heating portion 52b are the distances between the first opposing surface 62a and the second opposing surface 62b. The difference can be smaller than the height difference, and preferably about the same. That is, each of the first heater 51a and the second heater 51b is arranged so that heat is evenly transmitted to each of the first opposing surface 62a and the second opposing surface 62b. As a result, heat can be evenly transferred (uniformly heated) to each of the first opposing surface 62a and the second opposing surface 62b, which are arranged at different positions in the approaching/separating direction. The temperature is homogenized. Therefore, the heating conditions in the solder piece supply passages 61 can be made uniform, and a plurality of conductors to be soldered can be stably soldered.

Furthermore, in the above-described embodiment, the case where the first passage forming portion 63a and the second passage forming portion 63b are integrally formed has been described as an example, but the first passage forming portion 63a and the second passage forming portion 63b may be formed independently of each other (as separate members). In this case, the heaters 51 may be individually provided in the first passage forming portion 63a and the second passage forming portion 63b. Alternatively, the first passage forming portion 63a and the second passage forming portion 63b may be supported by separate suspension units 4. FIG. In this way, the temperature and position of each of the first passage forming portion 63a and the second passage forming portion 63b can be independently controlled, and soldering can be performed under optimum conditions at each of the plurality of locations. can.

The invention can be used in industries where soldering is performed in production facilities.

Reference Signs List 1... Soldering device 2b... Solder piece 3... Upper unit (head part)
4 Suspension unit 5 Nozzle unit 15 Floating unit 17 Solder thread delivery mechanism 40 Cutting unit (solder thread cutting mechanism)
51 Heater 60 Nozzle 61 Solder piece supply passage 61a First solder piece supply passage 61b Second solder piece supply passage 62 Opposed surface 62a First opposed surface 62b Second opposed surface 63 Passage forming portion 63a ... First passage forming portion 63b ... Second passage forming portion

Claims (5)

A soldering device for soldering a conductor to be soldered in an article to be soldered,
a nozzle having a plurality of solder strip supply passages through which the solder strips pass;
relative position changing means for changing the relative position between the soldering target conductor and the nozzle to bring the soldering target article and the nozzle closer to each other within a predetermined distance at a nozzle proximity position;
solder piece supply means for supplying the solder piece to the solder piece supply passage of the nozzle;
heating means for heating and melting the solder piece in the solder piece supply passage by heating the nozzle;
The nozzle has a facing surface facing the soldering target conductor at the nozzle proximate position,
The plurality of solder piece supply passages have a first solder piece supply passage extending to a predetermined lower end position and at least one second solder piece supply passage whose lower end position is different from that of the first solder piece supply passage. ,
The soldering apparatus, wherein the nozzle has a first passage forming portion forming the first solder piece supply passage and a second passage forming portion forming the second solder piece supply passage. 2. The soldering apparatus according to claim 1, wherein said first passage forming portion and said second passage forming portion are integrally formed. 3. The soldering apparatus according to claim 1, further comprising a buffer unit for reducing the load of said nozzle on said conductor to be soldered in the approaching and separating directions. The second solder piece supply passage extends below the first solder piece supply passage,
The heating means has a first heater contacting the first passage forming portion and a second heater contacting the second passage forming portion,
4. The soldering apparatus according to claim 1, wherein said second heater is arranged below said first heater. A nozzle having a plurality of solder piece supply passages through which solder pieces pass, relative position changing means for changing a relative position between a conductor to be soldered and said nozzle, and supplying said solder piece to said solder piece supply passage of said nozzle. and a heating means for heating and melting the solder pieces in the solder piece supply passage by heating the nozzle, wherein the plurality of solder piece supply passages extend to a predetermined lower end position. It has a first solder piece supply passage and at least one second solder piece supply passage whose lower end position is different from that of the first solder piece supply passage, and the nozzle forms the first solder piece supply passage. Soldering is performed by a soldering apparatus that has a first passage forming portion and a second passage forming portion that forms the second solder piece supply passage, and performs soldering to the soldering object conductor in the soldering object article. A method of attachment,
changing the relative distance between the conductor to be soldered and the nozzle in the approaching/separating direction; moving the nozzle to a position shorter than the protrusion height of the soldering target conductor in
supplying the solder piece to the solder piece supply passage of the nozzle;
A soldering method in which the solder pieces in the solder piece supply passage are heated and melted by heating the nozzle.

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