CN111448651A - Bonding wire manufacturing method and manufacturing device thereof - Google Patents

Bonding wire manufacturing method and manufacturing device thereof Download PDF

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Publication number
CN111448651A
CN111448651A CN201880079621.XA CN201880079621A CN111448651A CN 111448651 A CN111448651 A CN 111448651A CN 201880079621 A CN201880079621 A CN 201880079621A CN 111448651 A CN111448651 A CN 111448651A
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metal
core
bonding wire
crucible
wire
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宋文燮
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Priority claimed from KR1020170169272A external-priority patent/KR101943223B1/en
Priority claimed from KR1020180068043A external-priority patent/KR101912565B1/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
    • B22D11/00—Continuous casting of metals, i.e. casting in indefinite lengths
    • B22D11/005—Continuous casting of metals, i.e. casting in indefinite lengths of wire
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
    • B22D11/00—Continuous casting of metals, i.e. casting in indefinite lengths
    • B22D11/12—Accessories for subsequent treating or working cast stock in situ
    • B22D11/124—Accessories for subsequent treating or working cast stock in situ for cooling
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
    • B22D11/00—Continuous casting of metals, i.e. casting in indefinite lengths
    • B22D11/14—Plants for continuous casting
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Abstract

The present invention relates to a method of manufacturing a bonding wire having an intermetallic phase interlayer by injecting molten gold into a surface of a silver or copper core. The manufacturing method comprises the following steps: a step of melting the skin layer metal of the bonding wire after placing the skin layer metal in a crucible provided with a mold cooler at the lower part; a step of placing a metal core of a main component of a bonding wire in a core guide located in an upper portion of a mold cooler of the crucible, and then heating the core guide to a temperature below a melting point of the metal core; a step of transferring the metal core to the mold cooler side, injecting the molten skin layer metal into the skin of the metal core, and then casting a bonding wire precursor in which an interlayer between the metal phases of the skin layer metal material and the core metal material is formed on the surface of the core metal; and a step of manufacturing the cast metal wire precursor into a bonding wire of 50 to 350 μm with the die wire drawing machine.

Description

Bonding wire manufacturing method and manufacturing device thereof
Technical Field
The present invention relates to a method and an apparatus for manufacturing a bonding wire, and more particularly, to a method and an apparatus for manufacturing a bonding wire, in which a core metal made of one or more alloys selected from the group consisting of silver (Ag), copper (Cu), and aluminum (Al) is fusion-bonded to a surface skin of a core metal, and a surface skin metal made of one or more alloys selected from the group consisting of gold (Au), palladium (Pd), platinum (Pt), silver alloys (alloys of silver and platinum, palladium, rhodium, and iridium) is fusion-bonded to the core metal, and a bus bar (motherwire) having an intermediate layer of an intermetallic phase (intermetallic phase) is formed between the core metal and the surface skin metal, and the core metal and the surface skin metal are drawn at least once by a die drawing machine.
Background
The bonding wire must be used in a manufacturing process of a semiconductor device to electrically connect an integrated circuit and a printed circuit board when the semiconductor device is manufactured. In addition, bond wires are used in power electronics applications to connect transistors, diodes, etc. to pads or pins in the housing. Originally, bonding wires were made of gold, but nowadays inexpensive metal materials are used, such as silver, copper, aluminum, etc.
In the present invention, the term bonding wire includes all cross-sectional shapes and all general wire diameters, but it is preferable to use a bonding wire having a circular cross section and a small diameter.
Although silver wires provide very good electrical and thermal conductivity, the bonding of silver wires is inherently problematic. Some recent studies have developed bonding wires for core metals having silver as a main component because silver is cheaper than gold. As a prior art, korean patent laid-open No. 10-2014-0031111(2014.3.12 publication: patent document 1) discloses a "silver alloy wire for bonding applications". However, there is still a need to further improve the bonding wire technology in the bonding wire itself and in the bonding process.
Many studies have been made to replace gold bonding wires, for example, bonding wires mainly composed of copper. However, since the single-layer copper bonding wire is easily oxidized in air, a problem may occur in bondability to a bonding pad or a wire. In order to improve this, a multilayer copper bonding wire in which the surface of a single-layer copper bonding wire is coated with another metal is proposed in Japanese laid-open patent publication No. 2006-190763 (2006-20 days; patent document 2).
The "bonding wire for a semiconductor device" described in patent document 2 is a bonding wire including a core material mainly composed of copper and a skin layer of a conductive metal having a composition different from that of the core material. The main component of the skin layer is two or more selected from gold, palladium, platinum, rhodium, silver, and nickel, and a portion having a concentration gradient of one or both of the main component metal and copper in a wire diameter direction is present in the skin layer.
In order to manufacture the multilayer copper bonding wire described in patent document 2, a plurality of wire drawing processes are performed while forming a dissimilar metal on a copper core material and then performing a heat treatment, and in this case, there is a problem that the dissimilar metal is peeled off and the copper core material is exposed in some cases. As described above, when the copper core material is exposed, the same problem as that of the single-layer copper bonding wire may occur, and therefore, when applied to a semiconductor device, the copper core material may cause a failure.
Further, there is a case where a multilayer copper bonding wire is required to improve the bondability to a pad or a wire, and since the purity of copper selected as a core material is very high, a phenomenon occurs in which metal wires are bent after bonding and adjacent metal wires are in contact with each other to cause a short circuit, and therefore, it is necessary to improve the flatness.
The bonding wire as described above is formed of a core material and a skin layer, which are main components of the metal wire, and methods for forming the skin layer on the core material include a deposition method and a melting method.
The deposition method may be a physical vapor deposition method such as sputtering, ion plating, or vacuum deposition, or a chemical vapor deposition method such as plasma-enhanced chemical vapor deposition. When the deposition method is used, since cleaning is not required after film formation, a problem of contamination due to cleaning does not occur.
The melting method is a method of melting one of the skin layer and the core material and injecting the molten metal into the unmelted metal, and may be prepared by injecting the molten skin layer metal around a previously prepared core material to form a skin layer, or conversely, may be prepared by injecting the core material into the center of a hollow cylinder of a previously prepared skin layer.
However, since the deposition method is a method of depositing the skin layer metal on the surface of the bus bar (for example, a precursor of a step before manufacturing the bonding wire), there is a problem that the skin layer metal is cut or peeled off when the bus bar is manufactured into the bonding wire having a diameter of 50 μm to 350 μm by using a die stretcher.
In addition, the melting method according to the related art injects molten metal around a core material prepared in advance, and thus, causes many difficulties in manufacturing. For example, when a skin metal such as melted gold is injected onto the surface of a core material made of silver or the like, the melted skin metal cannot sufficiently penetrate into the skin of the core material due to a large temperature difference between the melted skin metal and the core material, resulting in a decrease in the bonding force between the core material and the skin metal. In this state, when the bus bar is manufactured as a bonding wire having a diameter of 50 μm to 350 μm by a die stretcher, there is a problem that the skin layer metal is cut or peeled off.
Disclosure of Invention
Accordingly, the present invention has been made to solve the above-described problems, and an object of the present invention is to provide a bonding wire manufacturing method and a bonding wire manufacturing apparatus which can prevent a core metal, which is a main component of a metal wire, from being exposed and reduce wafer damage even when a multi-pass wire drawing process is performed, and which have excellent bonding properties on a second surface side where stitch bonding (stitch bonding) is performed.
Another object of the present invention is to provide a method of manufacturing a bonding wire by melting a skin layer metal to be fusion bonded to a skin of a core metal in a crucible, heating the core metal constituting a main component of a wire to fusion bond the melted skin layer metal to a surface of the core, continuously casting a precursor of an intermediate layer of an Intermetallic phase (Intermetallic phases) in which the skin layer metal material and the core metal material are mixed on the surface of the core metal constituting the main component of the wire by a predetermined length, and performing die drawing on the continuously cast precursor, and a manufacturing apparatus thereof.
To achieve the above object, a bonding wire manufacturing method according to the present invention includes: a step of melting the skin layer metal of the bonding wire after placing the skin layer metal in a crucible provided with a mold cooler at the lower part; a step of putting a core metal of a main component of a metal wire in a core guide located at an upper portion of a mold cooler in the crucible, and then heating the core guide to a temperature lower than a melting point of the core metal and then softening the core metal; a step of transferring the core metal to the mold cooler side, melt-bonding the melted skin metal to the skin of the core metal, and then casting a bonding wire precursor in which an interlayer between the metal phases of the skin metal material and the core metal material is formed on the surface of the core metal; and a step of manufacturing the manufactured bonding wire precursor into a bonding wire of a preset diameter by using the die wire drawing machine.
The skin layer metal is one or an alloy of one or more selected from the group consisting of gold, palladium, platinum, silver alloy (an alloy of silver and platinum, palladium, rhodium, iridium), and the core metal is a metal wire made of one or an alloy of one or more selected from silver, copper, and aluminum.
The bonding wire manufacturing method according to the present invention is a bonding wire manufacturing method that can be easily manufactured by using a bonding wire manufacturing apparatus configured as follows, the bonding wire manufacturing apparatus including: a casting housing having a die assembly formed at a lower portion thereof, and heating a heating furnace disposed inside thereof by induction heating coils disposed therearound; a crucible having a discharge port formed at a lower portion thereof, inserted into the heating furnace of the casting case, and heated by the induction heating coil to dissolve the skin layer metal charged therein; a core guide spaced apart from the inner lower surface of the crucible and provided toward the discharge port, for guiding the hollow core wire inserted therein to be transferred to the lower discharge port side of the crucible; a gate coupled to an outer peripheral surface of the core guide so as to be movable up and down, and having a lower end portion in contact with an upper surface of a discharge port of the crucible to cut off a flow of the molten material in the crucible to the discharge port side, wherein the gate is raised to form a flow path from an inside of the crucible to the discharge port side during casting; a mold cooler which is protrudingly coupled to an upper portion of an inner surface of the crucible through a mold coupling of the casting shell, bonds a skin layer metal melted in the crucible to a skin of the core wire transferred to the lower discharge port side through the core guide by an elevation of a gate, and cools a wire precursor having an inter-layer metal phase intermediate layer formed by mixing the skin layer metal material and the core metal material by casting on a surface of the core wire; and a die drawing machine drawing the metal wire precursor into a metal wire having a diameter of 50 to 350 μm in the die cooler.
The core guide is made of the same material as the crucible, and an induction heating coil is installed inside the core guide to heat the core metal below a melting point of the core metal.
The skin layer metal is one or an alloy of one or more selected from the group consisting of gold, palladium, platinum, silver alloy (an alloy of silver and platinum, palladium, rhodium, iridium), and the core metal is a metal wire made of one or an alloy of one or more selected from silver, copper, and aluminum.
The term "intermediate layer" in the present invention is the region of the metal wire between the core metal and the skin metal. In this region, not only the substances in the skin metal but also the substances in the core metal are present in combination, for example, in the form of at least one intermetallic phase.
In the context of the present invention, the term "intermetallic phase" is a phase of more than 2 metals, wherein different elements are different sites in the structure, which are sites with different local environments and usually well-defined fixed stoichiometry, defining regularly arranged phases. This is a distinction over alloys in which the different elements are randomly dispersed.
Effects of the invention
According to the bonding wire manufacturing method of the embodiment of the present invention, the precursor of the intermediate layer of the Intermetallic phase (Intermetallic phases) in which the skin layer metal substance and the core metal substance are mixed is cast on the surface of the core metal, and then the core metal is drawn by the die drawing process, so that the skin layer is not peeled off or cut, and the bondability on the second surface side where the stitch bonding is performed can be improved. Furthermore, the material cost of the bonding wire can be saved.
Drawings
FIG. 1 is a cross-sectional view of a bond wire made in accordance with a preferred embodiment of the present invention.
Fig. 2 is a longitudinal sectional view of a bonding wire manufactured according to a preferred embodiment of the present invention.
Fig. 3 is a sectional view of a bonding wire manufacturing apparatus according to a preferred embodiment of the present invention, fig. 3A is a view showing a state before casting a bonding wire precursor, and fig. 3B is a view showing a state of casting a bonding wire precursor.
1: bonding wire, 2: core metal, 3: skin layer metal, 4: intermediate layer, 5: core guide, 10: bonding wire manufacturing apparatus, 12: induction heating coil, 13: hollow, 15: mold binder, 20: casting shell, 21: a heating furnace, 22: crucible, 23: induction heating coil, 24: flow path, 25: discharge port, 30: cover, 40: mold cooler, 42: die extrusion orifice, 50: discharge roller, 51: gate, 60: cylinder
Detailed Description
Preferred embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Further, it is to be understood that the present invention may be embodied in various forms and is not limited to the illustrated embodiments. It should be noted that the embodiments of the present invention described below are provided to fully provide the idea of the present invention to those skilled in the art to which the present invention pertains.
Fig. 1 and 2 are cross-sectional and longitudinal-sectional views illustrating a metal wire 1 manufactured according to a preferred embodiment of the present invention. In the sectional view, the core metal 2 is in the center. The core metal 2 is surrounded by the skin metal 3, and an intermediate layer 4 is formed between the core metal 2 and the skin metal 3.
In this case, the intermediate layer 4 is a surface metal material obtained by fusion-bonding one or an alloy of one or more selected from the group consisting of silver (Ag), copper (Cu), and aluminum (Al) having a purity of 99.99% to the surface of a metal wire, and the surface metal material is injected into the core metal 2 from the surface metal 3, wherein the one or an alloy of one or more selected from the group consisting of gold (Au), palladium (Pd), platinum (Pt), and silver alloys (alloys of silver and platinum, palladium, rhodium, and iridium) having a purity of 99.99%. That is, the skin layer metal 3 is melted and bonded to the surface of the core metal 2, for example, in a welded form.
As described above, the intermediate layer 4 in which the skin layer metal 3 is fusion bonded to the skin of the core metal 2 is an alloy of the core metal 2 and the skin layer metal 3, and therefore the flatness of the wire 1 is improved. That is, the elasticity of the bonding wire 1 is improved by forming the intermediate layer 4, and thereby, a phenomenon in which adjacent metal wires contact each other at the time of the stitch welding is greatly reduced.
In this case, in the bonding wire 1, the total diameter r1 including the skin layer is 30 to 350 μm, and the diameter r2 of the core metal 2 is 70 to 80% of the total diameter r 1.
The bonding wire 1 shown in fig. 1 and 2 can be manufactured by the manufacturing apparatus of fig. 3.
The manufacturing process of the bonding wire 1 according to the present invention is explained with reference to fig. 3A and 3B.
Referring to fig. 3A and 3B, the bonding wire manufacturing apparatus 10 is provided with a die bonding tool 15 formed at a lower portion thereof, and a Casting Housing (Casting Housing)20 for heating a heating furnace 21 provided inside thereof by induction heating coils (induction heating coils) 23 provided around the die bonding tool.
A crucible 22 having a discharge port 25 formed in a lower portion thereof is attached to the heating furnace 21 of the casting housing 20. The crucible 22 melts the skin layer metal 3 introduced into the inside by heat conduction of the heating furnace 21 heated by heating the induction heating coil 23, and is, for example, a skin layer metal made of one or an alloy selected from the group consisting of gold (Au), palladium (Pd), platinum (Pt), and silver alloy (silver and an alloy of platinum, palladium, rhodium, and iridium). At this time, the internal temperature of the crucible 22 is maintained at about 1100 to 2000 ℃ depending on the melting point of the skin layer metal 3 charged into the interior.
A core guide 5 having a hollow 13 is provided inside the crucible 22. A gate 51 is coupled to the outer peripheral surface of the core guide 5 so as to be movable up and down. The lower end of the gate 51 is normally in contact with the upper surface of the drain 25 of the crucible 22 to prevent the melt in the crucible 22 from flowing to the drain 25, and the gate is raised during casting to form the flow path 24 from the inside of the crucible 22 to the drain 25.
At this time, the core guide 5 and the gate 51 are preferably made of the same material as the crucible 22, for example, carbon. In addition, an induction heating coil 12 for heating the core metal 2 inserted into the hollow 13 may be provided inside the core guide 5.
The core guide 5 is provided spaced apart from a discharge port 25 formed at a lower portion of the crucible 22. That is, the core guide 5 is provided to be spaced apart from the lower surface of the crucible toward the outlet 25, and the gate 51 opens the flow path 24 in a direction from the lower portion of the crucible 22 toward the core guide 5 by being moved up and down.
The core guide 5 having the above-described structure guides the wire of the core metal 2, which is the main component of the bonding wire inserted into the hollow 13, to be transferred to the lower discharge port 25 side of the crucible 22.
The induction heating coil 12 provided inside the core guide 5 is heated to an appropriate temperature according to the material of the core metal 2.
For example, when the core metal 2 is silver (Ag), the core metal is heated to a temperature of 750 to 900 ℃, when the core metal 2 is aluminum, the core metal is heated to 450 to 600 ℃, and when the core metal is copper (Cu), the core metal is heated to 900 to 800 ℃, thereby softening the structure of the core metal 2 which is fed into the hollow portion 14 and then transferred downward.
As described above, the reason why the induction heating coil 12 is selectively controlled depending on the material of the core metal 2 is that since the melting point of the skin layer metal 3 formed of one or an alloy of gold (Au), palladium (Pd), platinum (Pt), a silver alloy (an alloy of silver and palladium, platinum, rhodium, iridium) melted in the crucible 22 is 1063 to 1773 ℃, when copper (Cu) is used as the core metal 2, the temperature of the core guide 5 is heated to 800 to 1000 ℃ to soften the metal structure of the wire of the copper (Cu) core metal 2 transferred inside thereof, and further to melt-bond gold (Au) as the skin layer metal 3.
A mold cooler 40 is inserted into the mold coupler 15 formed at the lower portion of the casting shell 20, and the extrusion port 42 of the mold is closely attached to the discharge port 25 formed at the lower portion of the crucible 22.
A cover 30 is hinged to an upper portion of the cast housing 20. After the cover 30 is closed, the crucible 22 inside the casting case 20 may be formed in a vacuum state, and an ambient gas, for example, nitrogen gas, may be filled in order to prevent the core metal 23 wire fed into the hollow portion 23 of the core guide 5 and transferred from being oxidized.
An ejection roller 50 is provided on an ejection path of the mold cooler 40, and the ejection roller 50 adjusts its interval by a cylinder 60 so that a Start Rod (SR) or a wire precursor P is fixed and ejected.
Although not shown, one or more die stretchers are provided at the rear end of the discharge roller 50. The die drawing machine draws the metal wire precursor P manufactured in the bonding wire manufacturing apparatus 10 and manufactures a bonding wire of 30 to 350 μm.
When the skin layer metal 3 made of one or an alloy selected from gold (Au), palladium (Pd), platinum (Pt), and silver alloys (silver and an alloy of platinum, palladium, rhodium, and iridium) is put into the crucible 22 of the bonding wire manufacturing apparatus 10 configured as described above, the skin layer metal 3 put into the crucible 22 is melted by heating of the induction heating coil 23.
As described above, when the core metal 2 made of one or an alloy of silver (Ag), copper (Cu), and aluminum (Al) is inserted into the hollow 13 of the core guide 5 and is moved to the lower portion thereof in a state where the skin metal 3 put into the crucible 22 is melted, the skin metal 3 melted through the gap 24 between the core guide 5 and the crucible 22 is melt-bonded to the surface of the core metal 2, and the substance of the skin metal 3 is injected into the skin of the core metal 2, thereby forming the intermediate layer 4 shown in fig. 1. The intermediate layer 4 is a region of metal wires between a core metal made of silver and a skin metal. In this region, not only the substances in the skin metal but also the substances in the core are present in a combined form, for example, in at least one intermetallic phase.
Examples
In order to manufacture the wire precursor P for manufacturing the bonding wire 1 shown in fig. 1 and 2 by using the bonding wire manufacturing apparatus 10 shown in fig. 3, it is necessary to move the gate 51, which is coupled to the outer peripheral edge of the core guide 5 so as to be slidable up and down, downward to close the flow path 24, and then to insert the start rod SR into the extrusion port 42 of the die cooler 40, as shown in fig. 3A.
Then, the lid 30 of the casting case 20 is opened, the skin layer metal 3 made of one or an alloy selected from gold (Au), palladium (Pd), platinum (Pt), and silver alloy (silver and an alloy of platinum, palladium, rhodium, and iridium) is put into the crucible 22, and then the lid 30 is closed.
Then, the metal wire of the core metal 2 is inserted into the hollow of the core guide 5 provided at the lower portion thereof through the sealing hole 5 formed at the upper portion of the cover 30. At this time, a core metal in which a surface of a metal wire of the core metal 2 is coated with borax (borax) may be used.
After the cover 30 is closed, the inside of the casting case 20 is formed in a vacuum state, and in order to prevent the metal wires of the core metal 2 from being oxidized, an ambient gas, for example, nitrogen gas, is filled.
Then, the induction heating coil 23 provided in the casting housing 20 is driven to heat the crucible 22 to 1100 to 2000 ℃ to melt the skin metal put into the interior thereof. Then, the induction heating coil 12 disposed inside the core guide 5 is heated to a preset temperature.
For example, assuming that the skin metal is gold (Au) and the metal wire of the core metal 2 is silver (Ag), the temperature of the core lead 5 is heated to a temperature of 750 to 900 ℃. The structure of the metal wire of the hollow and conveyed core metal 2 placed in the core guide 5 is softened by the heating as described above.
As described above, when the structure of the core metal 2 is softened in a state where the skin metal put into the crucible 22 is melted, the gate 51 is raised to open a part of the inner bottom surface of the crucible 22 to form the flow path 24. In this state, when the core metal 2 is put into the hollow 13 of the core guide 5 and then transferred to the lower portion thereof, the skin layer metal 3 melted through the flow path 24 between the core guide 5 and the crucible 22 is fused and adhered to the surface of the core metal 2. At this time, the melt-bonding is firmly melt-bonded by the borax applied to the wire surface of the core metal 2.
In a state where the core guide 5 is heated, if the wire of the core metal 2 is transferred through the core guide 5de hollow 13, the structure of the core metal 2 passing through the core guide 5 is softened by the heating of the induction heating coil 12, and thus, when the core metal 2 passes through the gap 24 between the core guide 5 and the crucible 22, the skin layer metal 3 of the crucible 22 being melted is easily melt-bonded to the surface of the core metal 2, and thus, the skin layer metal 3 is injected to the skin of the wire of the core metal 2 to form the intermediate layer 4.
The core metal 2 formed with the intermediate layer 4 is adhered to the end of the actuating lever SR.
In the above state, when the ejection roller 50 rotates to pull out the trigger lever SR, the skin layer metal 3 melt-bonded to the skin of the wire of the core metal 2 is continuously cast by the die cooler 40, and thereby, as shown in fig. 3B, is ejected to manufacture the wire precursor P. At this time, the transfer speed of the wire of the hollow core metal 2 transferred to the core guide 5 is the same as the transfer speed of the precursor P discharged by the discharge roller 50. Therefore, in the configuration shown in fig. 3A, the starter lever SR is drawn out, and as shown in fig. 3B, the precursor P is continuously cast while being drawn out by the discharge roll 50.
At this time, the metal wire precursor P forms the intermediate layer 4 as shown in fig. 1. The intermediate layer 4 is a metal wire region between a core metal and a skin metal made of silver. In this region, not only the substances within the skin metal but also the substances within the core are present in combination, for example, in the form of at least one intermetallic phase.
The mold cooler 40 cools the cast precursor P. The precursor P cast and cooled by the mold cooler 40 is supplied to a mold stretcher (not shown) through a discharge roll 50. The die stretcher is one or more, and finally produces a bonding wire stretched to a diameter of 30 to 350 μm.

Claims (5)

1. A bonding wire manufacturing method characterized by comprising:
a step of melting the skin layer metal of the bonding wire after placing the skin layer metal in a crucible provided with a mold cooler at the lower part;
a step of placing a core metal of a main component of a metal wire in a hollow of a core guide located above a mold cooler in the crucible, and then heating the core guide to a temperature lower than a melting point of the core metal and then softening a structure of the core metal;
a step of transferring the softened core metal to the mold cooler side, melt-bonding the molten skin layer metal to the skin of the softened core metal, and then casting a bonding wire precursor having an intermetallic phase interlayer in which the skin layer metal substance and the core metal substance are mixed on the surface of the softened core metal; and
a step of cooling the manufactured bonding wire precursor by the mold cooler, and then drawing the cooled bonding wire precursor at least once by the mold drawing machine to manufacture a bonding wire of a predetermined diameter.
2. The bonding wire manufacturing method according to claim 1, wherein the skin layer metal is one or an alloy of one or more selected from gold, palladium, platinum, and a silver alloy, and the metal core is one or more selected from silver and copper.
3. A bonding wire manufacturing apparatus, characterized by comprising:
a casting housing having a die assembly formed at a lower portion thereof, and heating a heating furnace disposed inside thereof by induction heating coils disposed therearound;
a crucible having a discharge port formed in a lower portion thereof, inserted into a heating furnace of a casting housing, and heated by the induction heating coil to dissolve a skin layer metal introduced therein;
a core guide spaced apart from a lower surface of the crucible and provided toward the discharge port, the core guide guiding the core wire inserted into the hollow portion to be transferred to a lower discharge port side of the crucible;
a gate coupled to an outer peripheral surface of the core guide so as to be movable up and down, and having a lower end portion in contact with an upper surface of a discharge port of the crucible to cut off a flow of the molten material in the crucible to the discharge port side, wherein the gate is raised to form a flow path from an inside of the crucible to the discharge port side during casting;
a mold cooler which is protrudingly coupled to an upper portion of an inner surface of the crucible through a mold coupling of the casting shell, bonds a skin layer metal melted in the crucible to a skin of the core wire transferred to the lower discharge port side through the core guide by an elevation of a gate, and cools a wire precursor having an inter-layer metal phase intermediate layer formed by mixing the skin layer metal material and the core metal material by casting on a surface of the core wire; and
a die drawing machine in which a metal wire precursor is drawn into a metal wire having a diameter of 50 to 350 μm.
4. The bonding wire manufacturing apparatus according to claim 3, wherein the core guide is made of the same material as the crucible, and an induction heating coil is installed inside the core guide to heat the core metal below a melting point of the core metal.
5. The bonding wire manufacturing apparatus according to claim 3 or 4, wherein the skin layer metal is one or an alloy of these selected from gold, palladium, platinum, and a silver alloy, and the metal core is one selected from silver, copper, and aluminum.
CN201880079621.XA 2017-12-11 2018-12-10 Bonding wire manufacturing method and manufacturing device thereof Pending CN111448651A (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
KR10-2017-0169272 2017-12-11
KR1020170169272A KR101943223B1 (en) 2017-12-11 2017-12-11 Method for manufacturing of bonding wire
KR10-2018-0068043 2017-12-11
KR1020180068043A KR101912565B1 (en) 2018-06-14 2018-06-14 Device for manufacturing of bonding wire
PCT/KR2018/015609 WO2019117562A1 (en) 2017-12-11 2018-12-10 Method for bonding wire manufacturing and manufacturing apparatus therefor

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113390462A (en) * 2021-06-11 2021-09-14 马鞍山钢铁股份有限公司 Device for finding blockage and abnormity of foreign matter in skirt cover of stepping furnace
TWI800345B (en) * 2021-04-07 2023-04-21 南韓商艾爾迪愛有限公司 Bonding wire for semiconductor package

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JP2005105326A (en) * 2003-09-29 2005-04-21 Fujikura Ltd Method and apparatus for manufacturing coated metal wire
KR20090085787A (en) * 2008-02-05 2009-08-10 이원근 Wire manufacturing method and wire manufacture system of semiconductor material
CN104217784A (en) * 2013-05-28 2014-12-17 尼克桑斯公司 Electrically conductive wire and method of its production

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Publication number Priority date Publication date Assignee Title
US3470939A (en) * 1965-11-08 1969-10-07 Texas Instruments Inc Continuous chill casting of cladding on a continuous support
JP2005105326A (en) * 2003-09-29 2005-04-21 Fujikura Ltd Method and apparatus for manufacturing coated metal wire
KR20090085787A (en) * 2008-02-05 2009-08-10 이원근 Wire manufacturing method and wire manufacture system of semiconductor material
CN104217784A (en) * 2013-05-28 2014-12-17 尼克桑斯公司 Electrically conductive wire and method of its production

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Publication number Priority date Publication date Assignee Title
TWI800345B (en) * 2021-04-07 2023-04-21 南韓商艾爾迪愛有限公司 Bonding wire for semiconductor package
CN113390462A (en) * 2021-06-11 2021-09-14 马鞍山钢铁股份有限公司 Device for finding blockage and abnormity of foreign matter in skirt cover of stepping furnace
CN113390462B (en) * 2021-06-11 2022-03-22 马鞍山钢铁股份有限公司 Device for finding blockage and abnormity of foreign matter in skirt cover of stepping furnace

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Application publication date: 20200724