TWI800345B - Bonding wire for semiconductor package - Google Patents

Bonding wire for semiconductor package Download PDF

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Publication number
TWI800345B
TWI800345B TW111113223A TW111113223A TWI800345B TW I800345 B TWI800345 B TW I800345B TW 111113223 A TW111113223 A TW 111113223A TW 111113223 A TW111113223 A TW 111113223A TW I800345 B TWI800345 B TW I800345B
Authority
TW
Taiwan
Prior art keywords
semiconductor package
bonding wire
bonding
wire
package
Prior art date
Application number
TW111113223A
Other languages
Chinese (zh)
Other versions
TW202240008A (en
Inventor
申雄澈
白敏�
Original Assignee
南韓商艾爾迪愛有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 南韓商艾爾迪愛有限公司 filed Critical 南韓商艾爾迪愛有限公司
Publication of TW202240008A publication Critical patent/TW202240008A/en
Application granted granted Critical
Publication of TWI800345B publication Critical patent/TWI800345B/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
TW111113223A 2021-04-07 2022-04-07 Bonding wire for semiconductor package TWI800345B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2021-0045227 2021-04-07
KR1020210045227A KR102385124B1 (en) 2021-04-07 2021-04-07 Bonding wire for semiconductor package

Publications (2)

Publication Number Publication Date
TW202240008A TW202240008A (en) 2022-10-16
TWI800345B true TWI800345B (en) 2023-04-21

Family

ID=81188004

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111113223A TWI800345B (en) 2021-04-07 2022-04-07 Bonding wire for semiconductor package

Country Status (3)

Country Link
KR (1) KR102385124B1 (en)
TW (1) TWI800345B (en)
WO (1) WO2022215951A1 (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010040944A (en) * 2008-08-07 2010-02-18 Sumitomo Metal Mining Co Ltd Copper insulation bonding wire, and manufacturing method thereof
CN103681595A (en) * 2008-12-03 2014-03-26 瑞萨电子株式会社 Semiconductor integrated circuit device
CN111448651A (en) * 2017-12-11 2020-07-24 宋文燮 Bonding wire manufacturing method and manufacturing device thereof
CN112447646A (en) * 2019-08-30 2021-03-05 台湾积体电路制造股份有限公司 Semiconductor device, package and method of forming the same

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2565892B2 (en) * 1987-01-31 1996-12-18 住友電気工業株式会社 Electrical wire
KR20070064841A (en) * 2005-12-19 2007-06-22 삼성전자주식회사 Capillary for coating insulated material and wire bonding method
KR101812943B1 (en) * 2016-10-20 2017-12-28 엠케이전자 주식회사 Bonding wire
KR101943223B1 (en) * 2017-12-11 2019-01-28 송문섭 Method for manufacturing of bonding wire

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010040944A (en) * 2008-08-07 2010-02-18 Sumitomo Metal Mining Co Ltd Copper insulation bonding wire, and manufacturing method thereof
CN103681595A (en) * 2008-12-03 2014-03-26 瑞萨电子株式会社 Semiconductor integrated circuit device
CN111448651A (en) * 2017-12-11 2020-07-24 宋文燮 Bonding wire manufacturing method and manufacturing device thereof
CN112447646A (en) * 2019-08-30 2021-03-05 台湾积体电路制造股份有限公司 Semiconductor device, package and method of forming the same

Also Published As

Publication number Publication date
TW202240008A (en) 2022-10-16
WO2022215951A1 (en) 2022-10-13
KR102385124B1 (en) 2022-04-12

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