SG10201905745XA - Bonding wire, semiconductor package including the same, and wire bonding method - Google Patents

Bonding wire, semiconductor package including the same, and wire bonding method

Info

Publication number
SG10201905745XA
SG10201905745XA SG10201905745XA SG10201905745XA SG10201905745XA SG 10201905745X A SG10201905745X A SG 10201905745XA SG 10201905745X A SG10201905745X A SG 10201905745XA SG 10201905745X A SG10201905745X A SG 10201905745XA SG 10201905745X A SG10201905745X A SG 10201905745XA
Authority
SG
Singapore
Prior art keywords
wire
bonding
same
semiconductor package
package including
Prior art date
Application number
SG10201905745XA
Inventor
choi Keun-ho
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of SG10201905745XA publication Critical patent/SG10201905745XA/en

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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06555—Geometry of the stack, e.g. form of the devices, geometry to facilitate stacking
    • H01L2225/06565—Geometry of the stack, e.g. form of the devices, geometry to facilitate stacking the devices having the same size and there being no auxiliary carrier between the devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06575—Auxiliary carrier between devices, the carrier having no electrical connection structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
SG10201905745XA 2018-09-28 2019-06-21 Bonding wire, semiconductor package including the same, and wire bonding method SG10201905745XA (en)

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Publication number Priority date Publication date Assignee Title
JPH0951011A (en) 1995-08-10 1997-02-18 Tanaka Denshi Kogyo Kk Wire bonding method of semiconductor chip
JP3349886B2 (en) * 1996-04-18 2002-11-25 松下電器産業株式会社 Method for forming two-stage protrusion-shaped bump of semiconductor device
JP2004172477A (en) 2002-11-21 2004-06-17 Kaijo Corp Wire loop form, semiconductor device having the same, wire bonding method, and semiconductor manufacturing apparatus
JP2004247674A (en) 2003-02-17 2004-09-02 Shinkawa Ltd Method for wire bonding
KR20040086064A (en) 2003-04-02 2004-10-08 삼성테크윈 주식회사 Wire Bonding Method of Semiconductor Package and Semiconductor Package Manufactured thereby
JP2005167178A (en) 2003-11-10 2005-06-23 Shinkawa Ltd Semiconductor device and wire bonding method
US7464854B2 (en) * 2005-01-25 2008-12-16 Kulicke And Soffa Industries, Inc. Method and apparatus for forming a low profile wire loop
US7780064B2 (en) * 2006-06-02 2010-08-24 Asm Technology Singapore Pte Ltd Wire bonding method for forming low-loop profiles
JP4344002B1 (en) 2008-10-27 2009-10-14 株式会社新川 Wire bonding method
EP2444999A4 (en) * 2009-06-18 2012-11-14 Rohm Co Ltd Semiconductor device
JP2011054727A (en) 2009-09-01 2011-03-17 Oki Semiconductor Co Ltd Semiconductor device, method of manufacturing the same, and wire bonding method
KR101610827B1 (en) * 2009-12-03 2016-04-08 삼성전자주식회사 Method of forming bonding structure
JP2012004464A (en) 2010-06-18 2012-01-05 Toshiba Corp Semiconductor device, method of manufacturing the semiconductor device, and apparatus for manufacturing the semiconductor device
KR20140011687A (en) * 2012-07-18 2014-01-29 삼성전자주식회사 Semiconductor package and method for fabricating the same
US20140070235A1 (en) * 2012-09-07 2014-03-13 Peter Scott Andrews Wire bonds and light emitter devices and related methods
US9888579B2 (en) 2015-03-05 2018-02-06 Invensas Corporation Pressing of wire bond wire tips to provide bent-over tips
US20160379953A1 (en) * 2015-06-24 2016-12-29 Texas Instruments Incorporated Semiconductor wire bonding and method
KR102443487B1 (en) * 2015-12-17 2022-09-16 삼성전자주식회사 Advancedly strengthened electrical interconnections for semiconductor devices and methods for forming the same

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KR20200036660A (en) 2020-04-07
CN110970373A (en) 2020-04-07
US11094666B2 (en) 2021-08-17
KR102621753B1 (en) 2024-01-05
US20210351153A1 (en) 2021-11-11

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