SG11202004295WA - Gold-Coated Silver Bonding Wire And Manufacturing Method Thereof, And Semiconductor Device And Manufacturing Method Thereof - Google Patents

Gold-Coated Silver Bonding Wire And Manufacturing Method Thereof, And Semiconductor Device And Manufacturing Method Thereof

Info

Publication number
SG11202004295WA
SG11202004295WA SG11202004295WA SG11202004295WA SG11202004295WA SG 11202004295W A SG11202004295W A SG 11202004295WA SG 11202004295W A SG11202004295W A SG 11202004295WA SG 11202004295W A SG11202004295W A SG 11202004295WA SG 11202004295W A SG11202004295W A SG 11202004295WA
Authority
SG
Singapore
Prior art keywords
manufacturing
gold
semiconductor device
bonding wire
coated silver
Prior art date
Application number
SG11202004295WA
Inventor
Yuki ANTOKU
Shota KAWANO
Yusuke Sakita
Original Assignee
Tanaka Electronics Ind
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Electronics Ind filed Critical Tanaka Electronics Ind
Publication of SG11202004295WA publication Critical patent/SG11202004295WA/en

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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Wire Bonding (AREA)
SG11202004295WA 2019-04-12 2019-08-01 Gold-Coated Silver Bonding Wire And Manufacturing Method Thereof, And Semiconductor Device And Manufacturing Method Thereof SG11202004295WA (en)

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JP2019076471A JP6807426B2 (en) 2019-04-12 2019-04-12 Gold-coated silver bonding wire and its manufacturing method, and semiconductor device and its manufacturing method
PCT/JP2019/030377 WO2020208839A1 (en) 2019-04-12 2019-08-01 Gold-coated silver bonding wire, method for producing same, semiconductor apparatus, and method for producing same

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KR20230069202A (en) * 2020-10-20 2023-05-18 닛데쓰마이크로메탈가부시키가이샤 Ag alloy bonding wire for semiconductor devices
CN115803856B (en) 2021-06-25 2023-08-18 日铁新材料股份有限公司 Bonding wire for semiconductor device
WO2022270050A1 (en) * 2021-06-25 2022-12-29 日鉄マイクロメタル株式会社 Bonding wire for semiconductor devices
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US9740442B2 (en) 2010-12-21 2017-08-22 Sato Holdings Kabushiki Kaisha Virtual input/output device for printers
WO2013129253A1 (en) 2012-02-27 2013-09-06 日鉄住金マイクロメタル株式会社 Power semiconductor device, method for manufacturing same, and bonding wire
CN103474408B (en) 2013-09-26 2016-04-20 辽宁凯立尔电子科技有限公司 A kind of surface electrum bonding wire having Gold plated Layer and preparation method thereof
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US10658326B2 (en) * 2016-07-20 2020-05-19 Samsung Electronics Co., Ltd. Bonding wire having a silver alloy core, wire bonding method using the bonding wire, and electrical connection part of semiconductor device using the bonding wire

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