SG11201911669SA - Defect detection device, defect detection method, wafer, semiconductor chip, die bonder, semiconductor manufacturing method, and semiconductor device manufacturing method - Google Patents
Defect detection device, defect detection method, wafer, semiconductor chip, die bonder, semiconductor manufacturing method, and semiconductor device manufacturing methodInfo
- Publication number
- SG11201911669SA SG11201911669SA SG11201911669SA SG11201911669SA SG11201911669SA SG 11201911669S A SG11201911669S A SG 11201911669SA SG 11201911669S A SG11201911669S A SG 11201911669SA SG 11201911669S A SG11201911669S A SG 11201911669SA SG 11201911669S A SG11201911669S A SG 11201911669SA
- Authority
- SG
- Singapore
- Prior art keywords
- semiconductor
- defect detection
- manufacturing
- wafer
- die bonder
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017112870 | 2017-06-07 | ||
| PCT/JP2018/021298 WO2018225664A1 (en) | 2017-06-07 | 2018-06-01 | Defect detection device, defect detection method, wafer, semiconductor chip, die bonder, semiconductor manufacturing method, and semiconductor device manufacturing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201911669SA true SG11201911669SA (en) | 2020-01-30 |
Family
ID=64566693
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201911669SA SG11201911669SA (en) | 2017-06-07 | 2018-06-01 | Defect detection device, defect detection method, wafer, semiconductor chip, die bonder, semiconductor manufacturing method, and semiconductor device manufacturing method |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6595130B2 (en) |
| CN (1) | CN110741464B (en) |
| SG (1) | SG11201911669SA (en) |
| WO (1) | WO2018225664A1 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110534462A (en) * | 2019-09-06 | 2019-12-03 | 武汉新芯集成电路制造有限公司 | The air blister defect detection method and system of wafer bonding technique |
| CN112711230B (en) * | 2020-12-08 | 2022-12-13 | 占朗智能科技(上海)有限公司 | Inspection process of automatic inspection equipment for workpiece production quality |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3898401B2 (en) * | 1999-11-29 | 2007-03-28 | 株式会社日立ハイテクインスツルメンツ | Parts supply device |
| JP2007107945A (en) * | 2005-10-12 | 2007-04-26 | Olympus Corp | Inspection device of substrate |
| JP2007115870A (en) * | 2005-10-20 | 2007-05-10 | Shin Etsu Handotai Co Ltd | Wafer crack inspecting apparatus, crack inspecting method and wafer manufacturing method |
| JP4631002B2 (en) * | 2006-06-29 | 2011-02-16 | 独立行政法人産業技術総合研究所 | Method for detecting defects and apparatus therefor |
| TWI428686B (en) * | 2006-12-05 | 2014-03-01 | Hoya Corp | Photomask inspecting apparatus, photomask inspecting method, method of producing a photomask for use in manufacturing a liquid crystal device and pattern transferring method |
| JP4389982B2 (en) * | 2007-08-09 | 2009-12-24 | オムロン株式会社 | Substrate visual inspection device |
| JP2009074825A (en) * | 2007-09-19 | 2009-04-09 | Seiko Epson Corp | Defect inspection method and defect inspection device |
| JP5943742B2 (en) * | 2012-07-04 | 2016-07-05 | 三菱電機株式会社 | Semiconductor test jig and semiconductor test method using the same |
-
2018
- 2018-06-01 CN CN201880037126.2A patent/CN110741464B/en active Active
- 2018-06-01 SG SG11201911669SA patent/SG11201911669SA/en unknown
- 2018-06-01 WO PCT/JP2018/021298 patent/WO2018225664A1/en active Application Filing
- 2018-06-01 JP JP2018563639A patent/JP6595130B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN110741464A (en) | 2020-01-31 |
| JPWO2018225664A1 (en) | 2019-06-27 |
| WO2018225664A1 (en) | 2018-12-13 |
| JP6595130B2 (en) | 2019-10-23 |
| CN110741464B (en) | 2021-03-19 |
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