SG11202013224RA - Wire bonding device - Google Patents

Wire bonding device

Info

Publication number
SG11202013224RA
SG11202013224RA SG11202013224RA SG11202013224RA SG11202013224RA SG 11202013224R A SG11202013224R A SG 11202013224RA SG 11202013224R A SG11202013224R A SG 11202013224RA SG 11202013224R A SG11202013224R A SG 11202013224RA SG 11202013224R A SG11202013224R A SG 11202013224RA
Authority
SG
Singapore
Prior art keywords
wire bonding
bonding device
wire
bonding
Prior art date
Application number
SG11202013224RA
Inventor
Nobuyuki Aoyagi
Shigeru Amemiya
Original Assignee
Shinkawa Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Kk filed Critical Shinkawa Kk
Publication of SG11202013224RA publication Critical patent/SG11202013224RA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/0207—Driving circuits
    • B06B1/0223—Driving circuits for generating signals continuous in time
    • B06B1/0269—Driving circuits for generating signals continuous in time for generating multiple frequencies
    • B06B1/0276—Driving circuits for generating signals continuous in time for generating multiple frequencies with simultaneous generation, e.g. with modulation, harmonics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
    • B06B1/0611—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements in a pile
    • B06B1/0614—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements in a pile for generating several frequencies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
    • B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
SG11202013224RA 2018-07-11 2019-07-11 Wire bonding device SG11202013224RA (en)

Applications Claiming Priority (2)

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JP2018131165 2018-07-11
PCT/JP2019/027437 WO2020013257A1 (en) 2018-07-11 2019-07-11 Wire bonding device

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EP3603826B1 (en) * 2018-07-31 2023-05-10 Infineon Technologies AG Method for calibrating an ultrasonic bonding machine
KR102622020B1 (en) * 2021-02-22 2024-01-08 가부시키가이샤 신가와 wire bonding device
WO2023091429A1 (en) * 2021-11-16 2023-05-25 Kulicke And Soffa Industries, Inc. Methods of calibrating an ultrasonic characteristic on a wire bonding system

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JPH11135543A (en) * 1997-10-29 1999-05-21 Sony Corp Semiconductor manufacturing apparatus
JP2008060210A (en) 2006-08-30 2008-03-13 Fujitsu Ltd Wire bonding method and wire bonding apparatus
JP4314313B1 (en) * 2008-06-30 2009-08-12 株式会社新川 Bonding equipment
JP4275724B1 (en) * 2008-07-16 2009-06-10 株式会社新川 Bonding quality determination method, bonding quality determination device, and bonding apparatus
CN102386236B (en) 2008-10-24 2016-02-10 株式会社半导体能源研究所 Semiconductor device and the method for the manufacture of this semiconductor device
CN102473658B (en) 2009-08-12 2014-11-26 库利克和索夫工业公司 Ultrasonic transducers for wire bonding and methods for forming wire bonds using ultrasonic transducers
JP2013003821A (en) 2011-06-16 2013-01-07 Shinkawa Ltd Pattern position detection method
WO2017094558A1 (en) 2015-12-04 2017-06-08 株式会社新川 Ultrasonic horn
US10381321B2 (en) * 2017-02-18 2019-08-13 Kulicke And Soffa Industries, Inc Ultrasonic transducer systems including tuned resonators, equipment including such systems, and methods of providing the same

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US20210272927A1 (en) 2021-09-02
CN112385026A (en) 2021-02-19
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KR20210011979A (en) 2021-02-02
JP7008370B2 (en) 2022-02-14
US11824038B2 (en) 2023-11-21
JPWO2020013257A1 (en) 2021-06-24
WO2020013257A1 (en) 2020-01-16
TW202006847A (en) 2020-02-01

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