SG11202009825RA - Noble metal-coated silver wire for ball bonding and method for producing the same, and semiconductor device using noble metal-coated silver wire for ball bonding and method for producing the same - Google Patents

Noble metal-coated silver wire for ball bonding and method for producing the same, and semiconductor device using noble metal-coated silver wire for ball bonding and method for producing the same

Info

Publication number
SG11202009825RA
SG11202009825RA SG11202009825RA SG11202009825RA SG11202009825RA SG 11202009825R A SG11202009825R A SG 11202009825RA SG 11202009825R A SG11202009825R A SG 11202009825RA SG 11202009825R A SG11202009825R A SG 11202009825RA SG 11202009825R A SG11202009825R A SG 11202009825RA
Authority
SG
Singapore
Prior art keywords
producing
same
noble metal
silver wire
ball bonding
Prior art date
Application number
SG11202009825RA
Inventor
Jun Chiba
Yuki ANTOKU
Shota KAWANO
Original Assignee
Tanaka Electronics Ind
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Electronics Ind filed Critical Tanaka Electronics Ind
Publication of SG11202009825RA publication Critical patent/SG11202009825RA/en

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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
SG11202009825RA 2018-04-02 2018-04-19 Noble metal-coated silver wire for ball bonding and method for producing the same, and semiconductor device using noble metal-coated silver wire for ball bonding and method for producing the same SG11202009825RA (en)

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JP2018070813A JP6869920B2 (en) 2018-04-02 2018-04-02 Precious metal-coated silver wire for ball bonding and its manufacturing method, and semiconductor device using precious metal-coated silver wire for ball bonding and its manufacturing method
PCT/JP2018/016201 WO2019193771A1 (en) 2018-04-02 2018-04-19 Precious metal coated silver wire for ball bonding and method for manufacturing said precious metal coated silver wire for ball bonding, and semiconductor device using precious metal coated silver wire for ball bonding and method for manufacturing said semiconductor device

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DE112020004723T5 (en) * 2019-10-01 2022-06-15 Tanaka Denshi Kogyo K.K. Wire bonding structure, bonding wire used therefor and semiconductor device
WO2021205674A1 (en) * 2020-04-10 2021-10-14 田中電子工業株式会社 Gold-coated bonding wire, manufacturing method therefor, semiconductor wire bonding structure, and semiconductor device
US11545457B2 (en) * 2020-08-30 2023-01-03 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor package, redistribution structure and method for forming the same
WO2023096567A1 (en) * 2021-11-23 2023-06-01 Heraeus Materials Singapore Pte. Ltd. Ball-bond arrangement

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KR100717667B1 (en) 2000-09-18 2007-05-11 신닛뽄세이테쯔 카부시키카이샤 Bonding wire for semiconductor and method of manufacturing the bonding wire
JP2004014884A (en) * 2002-06-07 2004-01-15 Sumitomo Electric Wintec Inc Bonding wire
JP2005167020A (en) * 2003-12-03 2005-06-23 Sumitomo Electric Ind Ltd Bonding wire and integrated circuit device using the same
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TW201336599A (en) * 2012-03-12 2013-09-16 Wire technology co ltd Composite wire of silver-palladium alloy coated with metal thin film and method thereof
CN104205315B (en) * 2012-03-23 2017-05-17 住友电木株式会社 Semiconductor device
JP5213146B1 (en) * 2012-10-03 2013-06-19 田中電子工業株式会社 Copper rhodium alloy wire for connecting semiconductor devices
TWI525726B (en) * 2013-11-25 2016-03-11 Preparation method of package wire with skin layer and its finished product
CN105393343A (en) * 2014-01-31 2016-03-09 大自达电线株式会社 Wire bonding and method for producing same
MY162021A (en) 2014-03-31 2017-05-31 Nippon Micrometal Corp Bonding wire for semiconductor device use and method of production of same
TWI555155B (en) * 2014-04-17 2016-10-21 光洋應用材料科技股份有限公司 Silver alloy wire
JP6516465B2 (en) 2014-12-17 2019-05-22 日鉄ケミカル＆マテリアル株式会社 Bonding wire for semiconductor device
JP6002300B1 (en) * 2015-09-02 2016-10-05 田中電子工業株式会社 Palladium (Pd) coated copper wire for ball bonding
JP6047214B1 (en) * 2015-11-02 2016-12-21 田中電子工業株式会社 Precious metal coated copper wire for ball bonding
JP6507329B1 (en) * 2019-02-08 2019-04-24 田中電子工業株式会社 Palladium-coated copper bonding wire, wire bonding structure, semiconductor device, and method of manufacturing semiconductor device

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WO2019193771A1 (en) 2019-10-10
TW201942989A (en) 2019-11-01
JP6869920B2 (en) 2021-05-12
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JP2019186248A (en) 2019-10-24
MY195984A (en) 2023-02-27

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