SG10201609063VA - Noble metal-coated copper wire for ball bonding - Google Patents

Noble metal-coated copper wire for ball bonding

Info

Publication number
SG10201609063VA
SG10201609063VA SG10201609063VA SG10201609063VA SG10201609063VA SG 10201609063V A SG10201609063V A SG 10201609063VA SG 10201609063V A SG10201609063V A SG 10201609063VA SG 10201609063V A SG10201609063V A SG 10201609063VA SG 10201609063V A SG10201609063V A SG 10201609063VA
Authority
SG
Singapore
Prior art keywords
noble metal
copper wire
coated copper
ball bonding
bonding
Prior art date
Application number
SG10201609063VA
Inventor
Hiroyuki Amano
Somei Yarita
Yusuke Sakita
Yuki ANTOKU
Wei Chen
Original Assignee
Tanaka Electronics Ind
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Electronics Ind filed Critical Tanaka Electronics Ind
Publication of SG10201609063VA publication Critical patent/SG10201609063VA/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Electroplating Methods And Accessories (AREA)
SG10201609063VA 2015-11-02 2016-10-31 Noble metal-coated copper wire for ball bonding SG10201609063VA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015215919A JP6047214B1 (en) 2015-11-02 2015-11-02 Precious metal coated copper wire for ball bonding

Publications (1)

Publication Number Publication Date
SG10201609063VA true SG10201609063VA (en) 2017-06-29

Family

ID=57572415

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201609063VA SG10201609063VA (en) 2015-11-02 2016-10-31 Noble metal-coated copper wire for ball bonding

Country Status (6)

Country Link
US (1) US20170125135A1 (en)
JP (1) JP6047214B1 (en)
CN (1) CN107039295B (en)
PH (1) PH12016000370A1 (en)
SG (1) SG10201609063VA (en)
TW (1) TWI612156B (en)

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