SG10201508104TA - Alloyed silver wire - Google Patents

Alloyed silver wire

Info

Publication number
SG10201508104TA
SG10201508104TA SG10201508104TA SG10201508104TA SG10201508104TA SG 10201508104T A SG10201508104T A SG 10201508104TA SG 10201508104T A SG10201508104T A SG 10201508104TA SG 10201508104T A SG10201508104T A SG 10201508104TA SG 10201508104T A SG10201508104T A SG 10201508104TA
Authority
SG
Singapore
Prior art keywords
silver wire
alloyed silver
alloyed
wire
silver
Prior art date
Application number
SG10201508104TA
Inventor
Tark Yong-Deok
Tae Kang Il
Su Kim Jong
Seok Jung Hyun
Yeop Kim Tae
Zhang Xi
Sarangapani Murali
Original Assignee
Heraeus Materials Singapore Pte Ltd
Heraeus Oriental Hitec Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Heraeus Materials Singapore Pte Ltd, Heraeus Oriental Hitec Co Ltd filed Critical Heraeus Materials Singapore Pte Ltd
Priority to SG10201508104TA priority Critical patent/SG10201508104TA/en
Priority to TW105127123A priority patent/TWI649433B/en
Priority to CN201680032776.9A priority patent/CN107708919B/en
Priority to JP2017563255A priority patent/JP6509383B2/en
Priority to KR1020177035326A priority patent/KR102076898B1/en
Priority to PCT/SG2016/000016 priority patent/WO2017058104A1/en
Publication of SG10201508104TA publication Critical patent/SG10201508104TA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/3006—Ag as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0255—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in welding
    • B23K35/0261—Rods, electrodes, wires
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0255—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in welding
    • B23K35/0261—Rods, electrodes, wires
    • B23K35/0266—Rods, electrodes, wires flux-cored
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
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    • B23K35/0261—Rods, electrodes, wires
    • B23K35/0272—Rods, electrodes, wires with more than one layer of coating or sheathing material
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    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
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    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
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    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
SG10201508104TA 2015-09-29 2015-09-29 Alloyed silver wire SG10201508104TA (en)

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SG10201508104TA SG10201508104TA (en) 2015-09-29 2015-09-29 Alloyed silver wire
TW105127123A TWI649433B (en) 2015-09-29 2016-08-24 Alloyed silver wire
CN201680032776.9A CN107708919B (en) 2015-09-29 2016-09-16 Alloyed silver wire
JP2017563255A JP6509383B2 (en) 2015-09-29 2016-09-16 Alloyed silver wire
KR1020177035326A KR102076898B1 (en) 2015-09-29 2016-09-16 Silver alloy wire
PCT/SG2016/000016 WO2017058104A1 (en) 2015-09-29 2016-09-16 Alloyed silver wire

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TWI762342B (en) * 2021-06-03 2022-04-21 國立臺灣大學 Methods for forming bonding structures
TWI819339B (en) * 2021-07-20 2023-10-21 樂鑫材料科技股份有限公司 Methods for forming bonding structures

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KR100739378B1 (en) * 2000-09-18 2007-07-16 신닛뽄세이테쯔 카부시키카이샤 Bonding wire for semiconductor and method of manufacturing the bonding wire
US8389860B2 (en) * 2007-12-03 2013-03-05 Nippon Steel Materials Co., Ltd. Bonding wire for semiconductor devices
JP4771562B1 (en) * 2011-02-10 2011-09-14 田中電子工業株式会社 Ag-Au-Pd ternary alloy bonding wire
KR101323246B1 (en) * 2011-11-21 2013-10-30 헤레우스 머티어리얼즈 테크놀로지 게엠베하 운트 코 카게 Bonding wire for semiconductor devices, and the manufacturing method, and light emitting diode package including the bonding wire for semiconductor devices
WO2013076548A1 (en) * 2011-11-26 2013-05-30 Microbonds Inc. Bonding wire and process for manufacturing a bonding wire
US8940403B2 (en) * 2012-01-02 2015-01-27 Wire Technology Co., Ltd. Alloy wire and methods for manufacturing the same
EP2703116B1 (en) * 2012-09-04 2017-03-22 Heraeus Deutschland GmbH & Co. KG Method for manufacturing a silver alloy wire for bonding applications
KR101503462B1 (en) * 2012-09-05 2015-03-18 엠케이전자 주식회사 Bonding wire for semiconductor devices and method of manufacturing the same
KR101416778B1 (en) * 2013-01-04 2014-07-09 엠케이전자 주식회사 Silver alloy bonding wire
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KR101513493B1 (en) * 2013-02-19 2015-04-20 엠케이전자 주식회사 Silver alloy bonding wire
SG11201508519YA (en) * 2013-05-03 2015-11-27 Heraeus Materials Singapore Pte Ltd Copper bond wire and method of making the same
JP5399581B1 (en) * 2013-05-14 2014-01-29 田中電子工業株式会社 High speed signal bonding wire
KR101535412B1 (en) * 2013-09-04 2015-07-24 엠케이전자 주식회사 Silver alloy bonding wire and manufacturing method thereof
CN104372197A (en) * 2014-09-26 2015-02-25 四川威纳尔特种电子材料有限公司 Silver alloy wire for semiconductor packaging, and its making method

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KR20180039016A (en) 2018-04-17
JP2018530900A (en) 2018-10-18
TW201720937A (en) 2017-06-16
WO2017058104A1 (en) 2017-04-06
CN107708919A (en) 2018-02-16
TWI649433B (en) 2019-02-01
JP6509383B2 (en) 2019-05-08
CN107708919B (en) 2020-02-07
KR102076898B1 (en) 2020-02-12

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