SG10201408302QA - COATED COPPER (Cu) WIRE FOR BONDING APPLICATIONS - Google Patents

COATED COPPER (Cu) WIRE FOR BONDING APPLICATIONS

Info

Publication number
SG10201408302QA
SG10201408302QA SG10201408302QA SG10201408302QA SG10201408302QA SG 10201408302Q A SG10201408302Q A SG 10201408302QA SG 10201408302Q A SG10201408302Q A SG 10201408302QA SG 10201408302Q A SG10201408302Q A SG 10201408302QA SG 10201408302Q A SG10201408302Q A SG 10201408302QA
Authority
SG
Singapore
Prior art keywords
wire
coated copper
bonding applications
bonding
applications
Prior art date
Application number
SG10201408302QA
Inventor
Zhi Liao Jin
Sarangapani Murali
Ha Yeung Ping
Original Assignee
Heraeus Materials Singapore Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Heraeus Materials Singapore Pte Ltd filed Critical Heraeus Materials Singapore Pte Ltd
Priority to SG10201408302QA priority Critical patent/SG10201408302QA/en
Priority to TW104140498A priority patent/TWI744220B/en
Priority to PCT/SG2015/000143 priority patent/WO2016093769A1/en
Publication of SG10201408302QA publication Critical patent/SG10201408302QA/en

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    • H01L2224/854—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
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    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
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    • H01L2924/14—Integrated circuits
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
SG10201408302QA 2014-12-11 2014-12-11 COATED COPPER (Cu) WIRE FOR BONDING APPLICATIONS SG10201408302QA (en)

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SG10201408302QA SG10201408302QA (en) 2014-12-11 2014-12-11 COATED COPPER (Cu) WIRE FOR BONDING APPLICATIONS
TW104140498A TWI744220B (en) 2014-12-11 2015-12-03 COATED COPPER (Cu) WIRE FOR BONDING APPLICATIONS
PCT/SG2015/000143 WO2016093769A1 (en) 2014-12-11 2015-12-11 Coated copper (cu) wire for bonding applications

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EP3228720B1 (en) * 2014-12-05 2019-09-25 Furukawa Electric Co. Ltd. Aluminum alloy wire rod, aluminum alloy stranded wire, covered wire and wire harness, and method of manufacturing aluminum alloy wire rod
WO2020101566A1 (en) * 2018-11-16 2020-05-22 Heraeus Deutschland GmbH & Co. KG Coated wire
SG10202010234VA (en) 2020-10-15 2021-10-28 Heraeus Materials Singapore Pte Ltd Coated wire
TWI818531B (en) * 2021-05-05 2023-10-11 新加坡商新加坡賀利氏材料私人有限公司 Coated round wire and process for manufacturing the same
WO2024058211A1 (en) * 2022-09-16 2024-03-21 田中電子工業株式会社 Copper bonding wire, method for manufacturing copper bonding wire, and semiconductor device

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WO2011013527A1 (en) * 2009-07-30 2011-02-03 新日鉄マテリアルズ株式会社 Bonding wire for semiconductor
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TW201430977A (en) * 2013-01-23 2014-08-01 Heraeus Materials Tech Gmbh Coated wire for bonding applications
EP2927955A1 (en) * 2013-02-15 2015-10-07 Heraeus Materials Singapore Pte. Ltd. Copper bond wire and method of manufacturing the same
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