SG10201905158TA - Semiconductor package - Google Patents
Semiconductor packageInfo
- Publication number
- SG10201905158TA SG10201905158TA SG10201905158TA SG10201905158TA SG10201905158TA SG 10201905158T A SG10201905158T A SG 10201905158TA SG 10201905158T A SG10201905158T A SG 10201905158TA SG 10201905158T A SG10201905158T A SG 10201905158TA SG 10201905158T A SG10201905158T A SG 10201905158TA
- Authority
- SG
- Singapore
- Prior art keywords
- semiconductor package
- package
- semiconductor
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L25/0652—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next and on each other, i.e. mixed assemblies
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3135—Double encapsulation or coating and encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
- H01L23/3128—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation the substrate having spherical bumps for external connection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3142—Sealing arrangements between parts, e.g. adhesion promotors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/315—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the encapsulation having a cavity
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3157—Partial encapsulation or coating
- H01L23/3185—Partial encapsulation or coating the coating covering also the sidewalls of the semiconductor body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020180080463A KR102566974B1 (en) | 2018-07-11 | 2018-07-11 | Semiconductor package and method of fabricating the same |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201905158TA true SG10201905158TA (en) | 2020-02-27 |
Family
ID=66041299
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201905158TA SG10201905158TA (en) | 2018-07-11 | 2019-06-06 | Semiconductor package |
Country Status (7)
Country | Link |
---|---|
US (2) | US11114364B2 (en) |
EP (1) | EP3594994A1 (en) |
JP (1) | JP7385378B2 (en) |
KR (1) | KR102566974B1 (en) |
CN (1) | CN110718513A (en) |
SG (1) | SG10201905158TA (en) |
TW (1) | TWI823925B (en) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102566974B1 (en) * | 2018-07-11 | 2023-08-16 | 삼성전자주식회사 | Semiconductor package and method of fabricating the same |
JP7125547B2 (en) * | 2018-12-29 | 2022-08-24 | 深南電路股▲ふん▼有限公司 | Printed circuit board that can be assembled in various ways and its manufacturing method |
US11450588B2 (en) * | 2019-10-16 | 2022-09-20 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method for forming chip package structure with heat conductive layer |
US11450580B2 (en) * | 2019-12-24 | 2022-09-20 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor structure and method of fabricating the same |
JP7262626B2 (en) * | 2020-01-22 | 2023-04-21 | 日立Astemo株式会社 | Imaging device |
US11282825B2 (en) | 2020-05-19 | 2022-03-22 | Taiwan Semiconductor Manufacturing Company, Ltd. | Package structure |
KR20210150658A (en) | 2020-06-03 | 2021-12-13 | 삼성전자주식회사 | Semiconductor package |
KR20210158257A (en) | 2020-06-23 | 2021-12-30 | 삼성전자주식회사 | chip stacking semiconductor package for improving a package reliability |
KR20210158587A (en) | 2020-06-24 | 2021-12-31 | 삼성전자주식회사 | Semiconductor packages and method of manufacturing semiconductor packages |
US20220093561A1 (en) * | 2020-09-18 | 2022-03-24 | Intel Corporation | Direct bonding in microelectronic assemblies |
US20220359339A1 (en) * | 2021-05-05 | 2022-11-10 | Taiwan Semiconductor Manufacturing Co., Ltd. | Multi-TIM Packages and Method Forming Same |
US11742218B2 (en) | 2021-05-07 | 2023-08-29 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor device package having metal thermal interface material and method for forming the same |
US20220367413A1 (en) * | 2021-05-13 | 2022-11-17 | Taiwan Semiconductor Manufacturing Co., Ltd. | Packages With Multiple Types of Underfill and Method Forming The Same |
US11817436B2 (en) * | 2021-06-28 | 2023-11-14 | Advanced Micro Devices, Inc. | Common cooling solution for multiple packages |
US20230163041A1 (en) * | 2021-11-23 | 2023-05-25 | Bae Systems Information And Electronic Systems Integration Inc. | Selective heat sink |
Family Cites Families (34)
Publication number | Priority date | Publication date | Assignee | Title |
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US5001548A (en) | 1989-03-13 | 1991-03-19 | Coriolis Corporation | Multi-chip module cooling |
US5789810A (en) | 1995-12-21 | 1998-08-04 | International Business Machines Corporation | Semiconductor cap |
US6275381B1 (en) * | 1998-12-10 | 2001-08-14 | International Business Machines Corporation | Thermal paste preforms as a heat transfer media between a chip and a heat sink and method thereof |
US6496373B1 (en) * | 1999-11-04 | 2002-12-17 | Amerasia International Technology, Inc. | Compressible thermally-conductive interface |
JP2002080617A (en) | 2000-09-06 | 2002-03-19 | Polymatech Co Ltd | Thermoconductive sheet |
JP4079604B2 (en) * | 2001-05-30 | 2008-04-23 | 株式会社ルネサステクノロジ | Manufacturing method of semiconductor device |
TW578282B (en) * | 2002-12-30 | 2004-03-01 | Advanced Semiconductor Eng | Thermal- enhance MCM package |
US20070164424A1 (en) | 2003-04-02 | 2007-07-19 | Nancy Dean | Thermal interconnect and interface systems, methods of production and uses thereof |
US7031162B2 (en) | 2003-09-26 | 2006-04-18 | International Business Machines Corporation | Method and structure for cooling a dual chip module with one high power chip |
JP4674850B2 (en) * | 2005-02-25 | 2011-04-20 | ルネサスエレクトロニクス株式会社 | Semiconductor device |
JP4332567B2 (en) | 2007-03-27 | 2009-09-16 | Okiセミコンダクタ株式会社 | Manufacturing method and mounting method of semiconductor device |
JP2008305838A (en) | 2007-06-05 | 2008-12-18 | Renesas Technology Corp | Semiconductor device and mounting structure thereof |
US8269340B2 (en) | 2007-09-19 | 2012-09-18 | International Business Machines Corporation | Curvilinear heat spreader/lid with improved heat dissipation |
US20090127700A1 (en) * | 2007-11-20 | 2009-05-21 | Matthew Romig | Thermal conductor lids for area array packaged multi-chip modules and methods to dissipate heat from multi-chip modules |
US8093722B2 (en) * | 2008-05-27 | 2012-01-10 | Mediatek Inc. | System-in-package with fan-out WLCSP |
KR20120053332A (en) | 2010-11-17 | 2012-05-25 | 삼성전자주식회사 | Semiconductor package and method of forming the same |
KR20120060665A (en) * | 2010-12-02 | 2012-06-12 | 삼성전자주식회사 | Semiconductor package |
KR20130024523A (en) * | 2011-08-31 | 2013-03-08 | 삼성전자주식회사 | Semiconductor package |
KR101332866B1 (en) * | 2012-02-16 | 2013-11-22 | 앰코 테크놀로지 코리아 주식회사 | Semiconductor package and method for manufacturing the same |
US8780561B2 (en) | 2012-03-30 | 2014-07-15 | Raytheon Company | Conduction cooling of multi-channel flip chip based panel array circuits |
US9496199B2 (en) | 2012-12-04 | 2016-11-15 | General Electric Company | Heat spreader with flexible tolerance mechanism |
US20140368992A1 (en) * | 2013-06-14 | 2014-12-18 | Laird Technologies, Inc. | Methods For Establishing Thermal Joints Between Heat Spreaders and Heat Generating Components Using Thermoplastic and/or Self-Healing Thermal Interface Materials |
US9892990B1 (en) | 2014-07-24 | 2018-02-13 | Amkor Technology, Inc. | Semiconductor package lid thermal interface material standoffs |
KR102254104B1 (en) * | 2014-09-29 | 2021-05-20 | 삼성전자주식회사 | Semiconductor package |
KR102286337B1 (en) | 2014-10-17 | 2021-08-04 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | Emi shielding structure and thermal pad, and electronic circuit board assembly including the same |
KR20160090706A (en) * | 2015-01-22 | 2016-08-01 | 에스케이하이닉스 주식회사 | Semiconductor package with narrow width interposer |
US9911716B2 (en) * | 2015-01-29 | 2018-03-06 | International Business Machines Corporation | Polygon die packaging |
US20160276308A1 (en) * | 2015-03-17 | 2016-09-22 | Samsung Electronics Co., Ltd. | Thermally enhanced package-on-package structure |
US9437536B1 (en) | 2015-05-08 | 2016-09-06 | Invensas Corporation | Reversed build-up substrate for 2.5D |
US9418909B1 (en) | 2015-08-06 | 2016-08-16 | Xilinx, Inc. | Stacked silicon package assembly having enhanced lid adhesion |
US10290561B2 (en) | 2016-09-28 | 2019-05-14 | Intel Corporation | Thermal interfaces for integrated circuit packages |
US10770405B2 (en) * | 2017-05-31 | 2020-09-08 | Taiwan Semiconductor Manufacturing Company, Ltd. | Thermal interface material having different thicknesses in packages |
US10580738B2 (en) * | 2018-03-20 | 2020-03-03 | International Business Machines Corporation | Direct bonded heterogeneous integration packaging structures |
KR102566974B1 (en) * | 2018-07-11 | 2023-08-16 | 삼성전자주식회사 | Semiconductor package and method of fabricating the same |
-
2018
- 2018-07-11 KR KR1020180080463A patent/KR102566974B1/en active IP Right Grant
- 2018-12-18 US US16/223,642 patent/US11114364B2/en active Active
-
2019
- 2019-03-29 EP EP19166309.5A patent/EP3594994A1/en active Pending
- 2019-04-16 TW TW108113264A patent/TWI823925B/en active
- 2019-06-03 JP JP2019103826A patent/JP7385378B2/en active Active
- 2019-06-06 SG SG10201905158TA patent/SG10201905158TA/en unknown
- 2019-07-05 CN CN201910605600.3A patent/CN110718513A/en active Pending
-
2021
- 2021-08-23 US US17/408,988 patent/US11735494B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
TW202006906A (en) | 2020-02-01 |
JP2020010021A (en) | 2020-01-16 |
KR20200006734A (en) | 2020-01-21 |
US20210384101A1 (en) | 2021-12-09 |
TWI823925B (en) | 2023-12-01 |
US11735494B2 (en) | 2023-08-22 |
KR102566974B1 (en) | 2023-08-16 |
EP3594994A1 (en) | 2020-01-15 |
US20200020606A1 (en) | 2020-01-16 |
US11114364B2 (en) | 2021-09-07 |
JP7385378B2 (en) | 2023-11-22 |
CN110718513A (en) | 2020-01-21 |
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SG10201906230PA (en) | Semiconductor Package | |
SG10201902032WA (en) | Semiconductor Package | |
SG10201905606YA (en) | Semiconductor device | |
SG10201906019QA (en) | Semiconductor Device | |
CA194973S (en) | Package | |
SI3216722T1 (en) | Sink package | |
GB201814693D0 (en) | Semiconductor devices | |
EP4084064A4 (en) | Semiconductor device | |
SG10202007931RA (en) | Semiconductor device | |
KR102304963B9 (en) | Semiconductor package | |
SG10202003704XA (en) | Semiconductor Devices | |
SG10202003905SA (en) | Semiconductor device | |
SG10201805356XA (en) | Package structure |