SG10201902032WA - Semiconductor Package - Google Patents
Semiconductor PackageInfo
- Publication number
- SG10201902032WA SG10201902032WA SG10201902032WA SG10201902032WA SG10201902032WA SG 10201902032W A SG10201902032W A SG 10201902032WA SG 10201902032W A SG10201902032W A SG 10201902032WA SG 10201902032W A SG10201902032W A SG 10201902032WA SG 10201902032W A SG10201902032W A SG 10201902032WA
- Authority
- SG
- Singapore
- Prior art keywords
- semiconductor package
- package
- semiconductor
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
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- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/49—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions wire-like arrangements or pins or rods
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- H01L2225/06503—Stacked arrangements of devices
- H01L2225/06555—Geometry of the stack, e.g. form of the devices, geometry to facilitate stacking
- H01L2225/06558—Geometry of the stack, e.g. form of the devices, geometry to facilitate stacking the devices having passive surfaces facing each other, i.e. in a back-to-back arrangement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
- H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
- H01L2225/1017—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement the lowermost container comprising a device support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
- H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
- H01L2225/1041—Special adaptations for top connections of the lowermost container, e.g. redistribution layer, integral interposer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
- H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
- H01L2225/1047—Details of electrical connections between containers
- H01L2225/1058—Bump or bump-like electrical connections, e.g. balls, pillars, posts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
- H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49838—Geometry or layout
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
- H01L2924/3511—Warping
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Control And Other Processes For Unpacking Of Materials (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020180079925A KR102448238B1 (en) | 2018-07-10 | 2018-07-10 | Semiconductor package |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201902032WA true SG10201902032WA (en) | 2020-02-27 |
Family
ID=69139621
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201902032WA SG10201902032WA (en) | 2018-07-10 | 2019-03-07 | Semiconductor Package |
Country Status (5)
Country | Link |
---|---|
US (1) | US10957629B2 (en) |
JP (1) | JP7269091B2 (en) |
KR (1) | KR102448238B1 (en) |
CN (1) | CN110707050A (en) |
SG (1) | SG10201902032WA (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20200007509A (en) * | 2018-07-13 | 2020-01-22 | 삼성전자주식회사 | Semiconductor package |
JP2020136425A (en) * | 2019-02-18 | 2020-08-31 | エイブリック株式会社 | Semiconductor device |
US11424212B2 (en) * | 2019-07-17 | 2022-08-23 | Advanced Semiconductor Engineering, Inc. | Semiconductor package structure and method for manufacturing the same |
KR20220025551A (en) | 2020-08-24 | 2022-03-03 | 삼성전자주식회사 | Semiconductor package |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6175158B1 (en) | 1998-09-08 | 2001-01-16 | Lucent Technologies Inc. | Interposer for recessed flip-chip package |
US7057269B2 (en) | 2002-10-08 | 2006-06-06 | Chippac, Inc. | Semiconductor multi-package module having inverted land grid array (LGA) package stacked over ball grid array (BGA) package |
TWI423401B (en) | 2005-03-31 | 2014-01-11 | Stats Chippac Ltd | Semiconductor stacked package assembly having exposed substrate surfaces on upper and lower sides |
JP4322844B2 (en) | 2005-06-10 | 2009-09-02 | シャープ株式会社 | Semiconductor device and stacked semiconductor device |
US7288835B2 (en) * | 2006-03-17 | 2007-10-30 | Stats Chippac Ltd. | Integrated circuit package-in-package system |
JP5098301B2 (en) | 2006-11-10 | 2012-12-12 | 三菱電機株式会社 | Power semiconductor device |
JP2008162016A (en) | 2006-12-26 | 2008-07-17 | Renesas Technology Corp | Method for producing semiconductor device |
US8080446B2 (en) * | 2009-05-27 | 2011-12-20 | Stats Chippac Ltd. | Integrated circuit packaging system with interposer interconnections and method of manufacture thereof |
KR101624973B1 (en) * | 2009-09-23 | 2016-05-30 | 삼성전자주식회사 | Package on package type semiconductor package and method for fabricating the same |
US8378476B2 (en) | 2010-03-25 | 2013-02-19 | Stats Chippac Ltd. | Integrated circuit packaging system with stacking option and method of manufacture thereof |
US8699232B2 (en) * | 2011-09-20 | 2014-04-15 | Stats Chippac Ltd. | Integrated circuit packaging system with interposer and method of manufacture thereof |
US9341671B2 (en) | 2013-03-14 | 2016-05-17 | Taiwan Semiconductor Manufacturing Company, Ltd. | Testing holders for chip unit and die package |
US9237647B2 (en) * | 2013-09-12 | 2016-01-12 | Taiwan Semiconductor Manufacturing Company, Ltd. | Package-on-package structure with through molding via |
KR20150070749A (en) | 2013-12-17 | 2015-06-25 | 삼성전자주식회사 | Semiconductor package and method of fabricating the same |
US9269647B2 (en) * | 2014-05-29 | 2016-02-23 | Samsung Electronics Co., Ltd. | Semiconductor package having heat dissipating member |
KR102351257B1 (en) * | 2014-07-07 | 2022-01-17 | 삼성전자주식회사 | Semiconducor packages having residual stress and methods for fabricating the same |
US10109588B2 (en) | 2015-05-15 | 2018-10-23 | Samsung Electro-Mechanics Co., Ltd. | Electronic component package and package-on-package structure including the same |
US10231338B2 (en) | 2015-06-24 | 2019-03-12 | Intel Corporation | Methods of forming trenches in packages structures and structures formed thereby |
TWI582917B (en) * | 2015-07-29 | 2017-05-11 | 力成科技股份有限公司 | Multi-chip package having encapsulation body to replace substrate core |
CN108257882A (en) | 2018-01-17 | 2018-07-06 | 中芯集成电路(宁波)有限公司 | The method of stress release in device encapsulation structure and encapsulation process |
-
2018
- 2018-07-10 KR KR1020180079925A patent/KR102448238B1/en active IP Right Grant
-
2019
- 2019-01-24 US US16/256,895 patent/US10957629B2/en active Active
- 2019-03-07 SG SG10201902032WA patent/SG10201902032WA/en unknown
- 2019-03-29 CN CN201910250031.5A patent/CN110707050A/en active Pending
- 2019-05-15 JP JP2019092131A patent/JP7269091B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
KR102448238B1 (en) | 2022-09-27 |
KR20200006327A (en) | 2020-01-20 |
US10957629B2 (en) | 2021-03-23 |
US20200020613A1 (en) | 2020-01-16 |
CN110707050A (en) | 2020-01-17 |
JP2020010016A (en) | 2020-01-16 |
JP7269091B2 (en) | 2023-05-08 |
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