SG10201907327RA - Redistribution substrate, method of fabricating the same, and semiconductor package including the same - Google Patents

Redistribution substrate, method of fabricating the same, and semiconductor package including the same

Info

Publication number
SG10201907327RA
SG10201907327RA SG10201907327RA SG10201907327RA SG10201907327RA SG 10201907327R A SG10201907327R A SG 10201907327RA SG 10201907327R A SG10201907327R A SG 10201907327RA SG 10201907327R A SG10201907327R A SG 10201907327RA SG 10201907327R A SG10201907327R A SG 10201907327RA
Authority
SG
Singapore
Prior art keywords
same
fabricating
semiconductor package
package including
redistribution substrate
Prior art date
Application number
SG10201907327RA
Inventor
Kim Jongyoun
Lee Seokhyun
Bae Minjun
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of SG10201907327RA publication Critical patent/SG10201907327RA/en

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    • H01L2924/1517—Multilayer substrate
    • H01L2924/15172—Fan-out arrangement of the internal vias
    • H01L2924/15174—Fan-out arrangement of the internal vias in different layers of the multilayer substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
SG10201907327RA 2018-09-13 2019-08-07 Redistribution substrate, method of fabricating the same, and semiconductor package including the same SG10201907327RA (en)

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US20210183766A1 (en) 2021-06-17
KR20200031202A (en) 2020-03-24
US20230187345A1 (en) 2023-06-15
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CN110896062A (en) 2020-03-20
KR102542573B1 (en) 2023-06-13

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