EP3243217A4 - Semiconductor package and method of manufacturing the same - Google Patents

Semiconductor package and method of manufacturing the same Download PDF

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Publication number
EP3243217A4
EP3243217A4 EP16735133.7A EP16735133A EP3243217A4 EP 3243217 A4 EP3243217 A4 EP 3243217A4 EP 16735133 A EP16735133 A EP 16735133A EP 3243217 A4 EP3243217 A4 EP 3243217A4
Authority
EP
European Patent Office
Prior art keywords
manufacturing
same
semiconductor package
package
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP16735133.7A
Other languages
German (de)
French (fr)
Other versions
EP3243217A1 (en
Inventor
O-Hyun Beak
Keon Kuk
Young-Chul Ko
Woon-Bae Kim
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Priority claimed from PCT/KR2016/000013 external-priority patent/WO2016111512A1/en
Publication of EP3243217A1 publication Critical patent/EP3243217A1/en
Publication of EP3243217A4 publication Critical patent/EP3243217A4/en
Pending legal-status Critical Current

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    • H01L23/291—Oxides or nitrides or carbides, e.g. ceramics, glass
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    • H01L23/293—Organic, e.g. plastic
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L24/80 - H01L24/90
    • H01L24/92—Specific sequence of method steps
    • H—ELECTRICITY
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    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L25/0655—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next to each other
    • H—ELECTRICITY
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    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L25/0657—Stacked arrangements of devices
    • H—ELECTRICITY
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    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/105—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L27/00
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    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
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    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
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    • H01L2924/143—Digital devices
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    • H01L2924/14—Integrated circuits
    • H01L2924/143—Digital devices
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
    • H01L2924/1533—Connection portion the connection portion being formed on the die mounting surface of the substrate the connection portion being formed both on the die mounting surface of the substrate and outside the die mounting surface of the substrate
    • H01L2924/15331—Connection portion the connection portion being formed on the die mounting surface of the substrate the connection portion being formed both on the die mounting surface of the substrate and outside the die mounting surface of the substrate being a ball array, e.g. BGA

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Signal Processing (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
EP16735133.7A 2015-01-09 2016-01-04 Semiconductor package and method of manufacturing the same Pending EP3243217A4 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR20150003469 2015-01-09
KR1020150088717A KR102474242B1 (en) 2015-01-09 2015-06-22 Semiconductor Package and Manufacturing Method thereof
PCT/KR2016/000013 WO2016111512A1 (en) 2015-01-09 2016-01-04 Semiconductor package and method of manufacturing the same

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EP3243217A4 true EP3243217A4 (en) 2018-01-10

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KR102028027B1 (en) * 2017-03-14 2019-10-04 (주)잉크테크 EMI shielding apparatus and method for semiconductor chip
KR102609138B1 (en) 2019-04-29 2023-12-05 삼성전기주식회사 Printed circuit board assembly
CN110267431B (en) * 2019-06-18 2021-11-09 青岛歌尔微电子研究院有限公司 Circuit unit packaging structure
TWI744869B (en) * 2020-04-20 2021-11-01 力成科技股份有限公司 Package structure and manufacturing method thereof

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TWI691031B (en) 2020-04-11
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EP3243217A1 (en) 2017-11-15
KR102474242B1 (en) 2022-12-06
CN107112296A (en) 2017-08-29
CN107112296B (en) 2020-08-04

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