JP3800703B2 - Soldering equipment - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a soldering apparatus that performs soldering on a workpiece sent to a predetermined work position using a soldering iron.
[0002]
[Prior art]
The soldering iron placed on the production line where the printed wiring board incorporating the circuit components is continuously conveyed is lowered toward the printed wiring board that has been sent to the specified work position, and the heated soldering iron In the method of automatically performing soldering while automatically supplying solder to the tip of the soldering iron, if the oxidized solder accumulates on the tip of the soldering iron, the soldering performance is greatly reduced. The tip was cleaned once by air blowing.
[0003]
[Problems to be solved by the invention]
In the above, the equipment operation rate at which the operation is interrupted during the cleaning is low. In addition, since the temperature of the tip is reduced when air blow cleaning is performed, there is a problem that soldering defects frequently occur immediately after cleaning. In addition, if cleaning is performed once every several times, soldering is performed by supplying new solder to the tip with the old solder remaining. It was difficult to make the absolute amount of solder constant, and there was a possibility that uniform soldering could not be performed.
[0004]
The present invention has been made to solve the drawbacks with the prior art described above, and an object thereof is to provide a soldering only equipment that enables improved capacity utilization and good soldering.
[0005]
[Means for Solving the Problems]
In order to achieve the above object, in the soldering apparatus of the present invention, a pair of soldering irons arranged at a certain distance are integrally reciprocated by a certain distance in the direction perpendicular to the workpiece conveyance path, Soldering iron moving means for alternately sending the soldering iron to the work position on the conveying path, and solder that is provided at symmetrical positions sandwiching the conveying path and retreated from the workpiece conveying path by the soldering iron moving means. And a cleaning means for cleaning the iron . Further, the cleaning means performs air blow to the tip in order to remove the solder remaining on the tip .
[0006]
The soldering iron moving means sends one soldering iron from the working position to the cleaning means each time soldering to one work is completed, and the other soldering iron from the cleaning means. It is sent to the work position.
[0007]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, an embodiment of the present invention will be described with reference to FIG. On the conveyor belt 10, a work holder 11 holding a work 12 to be soldered is continuously installed at indefinite intervals. The conveyor belt 10 is intermittently moved in the direction of the arrow, and the workpiece 12 is sequentially conveyed to a predetermined position where a soldering operation is performed by a soldering apparatus. Alternatively, the work holders 11 may be continuously provided on the conveyor belt 10 at regular intervals and intermittently moved in a fixed cycle.
[0008]
A configuration of an example of the soldering apparatus used in the present invention will be described below. A base portion 17 is fixed to the support columns 15 and 16 arranged at symmetrical positions sandwiching the conveyance belt 10 in a direction orthogonal to the conveyance belt 10. A pair of soldering irons 23 and 24 are provided at a predetermined distance on a slide plate 20 provided on the base portion 17 so as to be slidable in the lateral direction. The soldering iron 23 is fixed to the movable part of the cylinder 39 that moves it up and down, and the soldering iron 24 is fixed to the moving part of the cylinder 40 that moves it up and down. The cylinders 39 and 40 are fixed to the slide plate 20.
[0009]
A movable portion of a cylinder 25 provided on the base portion 17 is fixed to one end portion of the slide plate 20. The cylinder 25 reciprocates the soldering irons 23 and 24 by a predetermined distance in a direction perpendicular to the conveying belt 10 and sends one of the soldering irons 23 and 24 to a work position on the conveying belt 10. It constitutes a moving means. The cylinder 25 causes the base portion 17 to move forward and backward every time soldering is performed, and the soldering irons 23 and 24 are alternately sent to the work position on the conveyor belt 10 every time soldering is performed.
[0010]
The supply ports of the tubes 27 and 28 are provided close to the tips of the soldering irons 23 and 24, respectively. Solder necessary for one soldering sent from a solder supply device (not shown) is automatically supplied from the supply ports of the tubes 27 and 28 to the tips of the soldering irons 23 and 24. The tubes 27 and 28 are fixed to one end portions of the holding members 29 and 30, respectively.
[0011]
The other ends of the holding members 29 and 30 are provided on linear guides 29a and 30a fixed to the slide plate 20 so as to be slidable up and down. The holding members 29 and 30 are fixed to the soldering irons 23 and 24, respectively, so that the soldering irons 23 and 24 and the tubes 27 and 28 are moved together. Therefore, the supply ports of the pipes 27 and 28 are always close to the soldering irons 23 and 24 so that the optimum solder is supplied.
[0012]
Nozzles 34 and 35 constituting cleaning means are arranged at symmetrical positions with the conveying belt 10 interposed therebetween. The nozzles 34 and 35 blow out air sent from an air compressor (not shown) from the blowout port while one of the soldering irons 23 and 24 is soldering, and the other is retreated from the conveyor belt 10. The remaining solder is blown off and the tip is cleaned. Under the nozzles 24 and 25, recovery containers 36 and 37 are provided, respectively, so that the blown solder is recovered.
[0013]
The operation of the soldering apparatus having the above configuration will be described. With the slide plate 20, the soldering iron 23 moves to a predetermined working position on the conveyor belt 10, and the soldering iron 24 moves away from the conveyor belt 10 and moves onto the collection container 37. When the workpiece 12 is sent to a predetermined position, the soldering iron 23 heated to a predetermined temperature is lowered by the cylinder 39, and the soldering iron 23 comes into contact with the workpiece 12 for soldering.
[0014]
At the same time, the soldering iron 24 is lowered into the collection container 37 by the cylinder 40. During the soldering by the soldering iron 23, air is blown from the nozzle 35 to the tip of the soldering iron 24 to perform cleaning. At this time, if solder remains on the tip of the soldering iron 24, the remaining solder is blown off by the air blow and collected in the collection container 37. Since this cleaning is performed in the collection container 37, scattering of solder due to air blow is prevented.
[0015]
When the soldering with the soldering iron 23 and the cleaning of the soldering iron 24 are completed, the cylinders 39 and 40 raise the respective soldering irons 23 and 24. When the soldering iron 23 is pulled away from the workpiece 12 and the soldering iron 24 is pulled out from the collection container 37, the slide plate 18 is moved to the left by the cylinder 25. The cleaned soldering iron 24 is sent to the work position on the conveyor belt 10, and the used soldering iron 23 is retracted from the conveyor belt 10 and moved onto the collection container 36.
[0016]
When the next workpiece 12 is sent to a predetermined position, the cylinder 40 lowers the soldering iron 24 toward the workpiece 12 and performs soldering. At the same time, the cylinder 39 lowers the soldering iron 23 into the collection container 36. While soldering by the soldering iron 24 is performed, air is blown from the nozzle 34 to the soldering iron 23, and the solder remaining on the tip is removed.
[0017]
When the soldering by the soldering iron 24 and the cleaning of the soldering iron 23 are completed, the soldering iron 23 is pulled away from the workpiece 12 by the cylinders 39 and 40, and the soldering iron 24 is pulled out from the collection container 36. Then, the slide plate 18 is moved to the right by the cylinder 25. The cleaned soldering iron 23 is sent to the work position on the conveyor belt 10, the used soldering iron 24 is retracted from the conveyor belt 10 and moved onto the collection container 36, and the above procedure is repeated.
[0018]
In the above-described case, when the used soldering iron is cleaned by air blowing, the temperature of the tip is lowered. Since the temperature rises to a predetermined temperature at which soldering is possible, poor soldering due to a decrease in the temperature of the tip due to cleaning by air blow is prevented. In addition, since the other soldering iron is cleaned during soldering with one soldering iron, there is no waiting time due to the cleaning of the soldering iron, and a high equipment operating rate can be achieved. In addition, since the soldering iron is cleaned every time soldering is performed, uniform soldering can be applied to the tip to enable uniform soldering, and appearance inspection can be improved.
[0019]
In the embodiment described above, the movable part of the cylinder is fixed to each soldering iron so that the soldering iron can be moved up and down individually. The movable part of the cylinder may be fixed to both ends of the slider, and the slide plate may be moved up and down together with the base part. In addition, the slide plate and the soldering iron are moved using a cylinder, but the present invention is not limited to this. For example, a gear train or a cam mechanism may be used. For cleaning the tip of the used soldering iron, not only air blow but also a method of wiping with a roller or a cleaning tape or a method of scraping off with a brush may be used.
[0020]
【The invention's effect】
As described above, according to the present invention, a pair of soldering irons arranged at a fixed distance are moved together, and a pair of soldering irons are alternately used for a workpiece sent to a predetermined position. Since soldering is performed and the other soldering iron is cleaned while soldering with one soldering iron, time loss due to cleaning is eliminated and a high equipment operation rate can be achieved. Since the soldering iron is cleaned every time soldering is performed, uniform soldering is possible with a constant amount of solder adhering to the soldering iron tip.
[Brief description of the drawings]
FIG. 1 is a perspective view showing an example of a soldering apparatus used for explaining the present invention.
[Explanation of symbols]
12 Workpiece 23, 24 Soldering iron 39, 40 Cylinder

Claims (3)

A pair of soldering irons arranged at a fixed distance are reciprocated by the predetermined distance in a direction perpendicular to the workpiece conveyance path, and the soldering irons are alternately sent to work positions on the conveyance path. A moving means and a cleaning means provided at symmetrical positions across the conveying path, and for cleaning the soldering iron retreated from the workpiece conveying path by the soldering iron moving means. Soldering device. 2. The soldering apparatus according to claim 1, wherein the cleaning means performs air blowing to the tip in order to remove the solder remaining on the tip. The soldering iron moving means sends one soldering iron from the working position to the cleaning means each time soldering to one work is completed, and sends the other soldering iron from the cleaning means to the working position. The soldering apparatus according to claim 1 or 2, wherein

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