CN111525361A - Tin dipping method and tin dipping device - Google Patents
Tin dipping method and tin dipping device Download PDFInfo
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- CN111525361A CN111525361A CN201910118873.5A CN201910118873A CN111525361A CN 111525361 A CN111525361 A CN 111525361A CN 201910118873 A CN201910118873 A CN 201910118873A CN 111525361 A CN111525361 A CN 111525361A
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- tin
- wetting
- comb teeth
- areas
- comb
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- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title claims abstract description 215
- 238000007598 dipping method Methods 0.000 title claims abstract description 52
- 238000009736 wetting Methods 0.000 claims abstract description 176
- 239000000463 material Substances 0.000 claims abstract description 64
- 238000009960 carding Methods 0.000 claims abstract description 19
- 244000126211 Hericium coralloides Species 0.000 claims description 18
- 239000004020 conductor Substances 0.000 claims description 18
- 238000010438 heat treatment Methods 0.000 claims description 7
- 238000005476 soldering Methods 0.000 claims description 7
- 230000004907 flux Effects 0.000 claims description 6
- 229910000679 solder Inorganic materials 0.000 description 24
- 238000000034 method Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
- H01R43/0235—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for applying solder
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a tin dipping method and a tin dipping device, which comprises the steps of (1) providing a containing part with a containing cavity, and loading tin materials into the containing cavity; (2) providing two tin-wetting pieces, wherein each tin-wetting piece is provided with a tin-wetting area; (3) providing a comb member having comb teeth; (4) moving the two tin-wetting parts towards the cavity, enabling the two tin-wetting areas to enter the cavity, enabling the tin material to be attached to the tin-wetting areas, defining the tin material between the two adjacent tin-wetting areas as a connecting part, and adhering the two tin-wetting areas to the connecting part; (5) moving the two tin-wetting parts or the carding part to enable the comb teeth to be positioned between the two tin-wetting parts, so that the comb teeth cut the connecting part, and the two tin-wetting areas are separated; (6) the tin-dipping pieces finish tin dipping, and are not electrically conducted through the adhesion of tin materials, so that the short circuit of the two tin-dipping pieces is avoided.
Description
[ technical field ] A method for producing a semiconductor device
The present disclosure relates to a tin-wetting method and a tin-wetting apparatus, and more particularly, to a tin-wetting method and a tin-wetting apparatus for reducing a defective rate of tin-wetting.
[ background of the invention ]
In a conventional method for wetting a cable, a conductor at one end of the cable is immersed in a solder material in a solder furnace, and then the cable is lifted up so that the conductor is separated from the solder material, thereby completing the wetting. For a single cable, the tinning effect is uniform, the quality is stable, and with the development of the technology, in order to improve the production efficiency, a plurality of cables are densely arranged side by side, and conductors of the plurality of cables are immersed into a tin material together to finish tin dipping.
Because the tin material has viscosity and tension, the tin material can be adhered on the conductor of each cable, and can also adhere the conductors of a plurality of cables together, so that the conductors of the plurality of cables form a whole, and the tin connection phenomenon occurs, when the plurality of cables need to be simultaneously welded on an external electronic element, a part of cables are contacted with a power terminal in the external electronic element and are used for transmitting power signals, a part of cables are contacted with a grounding terminal in the external electronic element and are used for transmitting grounding signals, and a part of cables are contacted with a signal terminal in the external electronic element and are used for correspondingly transmitting signals such as video or audio, and the transmission functions of the cables are different, and because the conductors of the plurality of cables have the problem of tin connection, the cables for transmitting the power signals, the grounding signals and the audio and video signals can be completely conducted, there is a short circuit hazard.
Therefore, there is a need for a new electrical connector to overcome the above problems.
[ summary of the invention ]
The invention aims to provide a tin pick-up method and a tin pick-up device, wherein tin materials of two tin pick-up areas are cut off by comb teeth with a carding piece, so that the tin pick-up reject ratio is reduced.
In order to achieve the purpose, the invention adopts the following technical scheme:
a method of tin dipping comprising the steps of:
(1) providing a containing piece, wherein the containing piece is provided with a containing cavity, and tin materials are filled into the containing cavity;
(2) providing at least two tin-wetting pieces which are arranged at intervals, wherein each tin-wetting piece is provided with a tin-wetting area;
(3) providing a carding element, wherein the carding element is provided with at least one comb tooth;
(4) moving at least two tin-wetting pieces towards the direction of the cavity, enabling the tin-wetting areas of the two tin-wetting pieces to enter the cavity, enabling the tin material to be attached to the tin-wetting areas, defining the tin material between every two adjacent tin-wetting areas as a connecting part, and adhering the two tin-wetting areas to the connecting part;
(5) moving the two tin-wetting parts or the carding part to enable the comb teeth to be positioned between the two tin-wetting parts attached with the tin material, so that the comb teeth cut the connecting part, and the two tin-wetting areas are separated;
(6) and the tin dipping piece finishes tin dipping.
Further, in the step (3), the comb teeth are fixed above the tin material, in the step (5), the tin-wetting member is moved toward the comb teeth, so that the comb teeth enter between two adjacent tin-wetting members, and the comb teeth are higher than the tin-wetting regions, and then the tin-wetting members are moved upward, and the tin-wetting regions are moved from the lower side of the comb teeth to the upper side of the comb teeth, so that the comb teeth cut the connecting portions, and thus the two tin-wetting regions are separated from each other.
Further, in the step (3), the comb teeth are arranged above the tin material, in the step (5), the comb piece is moved towards the tin pick-up piece, so that the comb teeth enter between two adjacent tin pick-up pieces, the comb teeth are higher than the tin pick-up area, then the comb teeth are moved downwards, the comb teeth are moved from the upper part of the tin pick-up area to the lower part of the tin pick-up area, so that the comb teeth cut the connecting part, and the two tin pick-up areas are separated from each other.
Further, in the step (3), the comb teeth are arranged above the tin material, in the step (5), the carding element is moved towards the tin pick-up element, so that the comb teeth enter between two adjacent tin pick-up elements, the comb teeth are higher than the tin pick-up areas, then the tin pick-up element is moved upwards, the tin pick-up areas are moved to the positions above the comb teeth from the positions below the comb teeth, so that the comb teeth cut the connecting parts, and the two tin pick-up areas are separated from each other.
Further, in the step (5), at least part of the tin wetting area is immersed in the tin material, and then the comb teeth are positioned between the two tin wetting parts.
Further, in the step (2), the solder part is a cable, the cable has a conductor and an outer insulating layer covering the conductor, a part of the outer insulating layer is firstly stripped, and a part of the conductor is exposed to the outer insulating layer to form the solder area.
Further, in the step (4), before the tin-wetting area enters the cavity, a layer of soldering flux is coated on the tin-wetting area.
Further, in the step (1), the tin wetting device further has a heating element, and the heating element heats the tin material to a temperature equal to or greater than 295 ℃ before the tin wetting area enters the cavity.
Further, in the step (2), the plurality of tin-wetting members are arranged in rows at intervals, in the step (3), the plurality of comb teeth are arranged in rows at intervals, in the step (5), each comb tooth is located between every two adjacent tin-wetting members, and each connecting portion is cut by the corresponding comb tooth.
Further, in the step (2), a plurality of the tin pick-up parts are provided, in the step (3), the carding part is provided with at least two comb teeth, in the step (5), two tin pick-up areas are positioned between two adjacent comb teeth, and connecting parts between two adjacent comb teeth are not cut.
The invention adopts another technical proposal as follows:
a tin pick-up device is used for tin pick-up of tin pick-up areas of at least two tin pick-up parts and comprises a receiving part, a receiving cavity and a tin pick-up device, wherein a tin material is received in the receiving cavity, at least two tin pick-up areas are arranged at intervals, the two tin pick-up areas enter the receiving cavity, the tin material is additionally arranged on each tin pick-up area, and the tin material positioned between the two adjacent tin pick-up areas is defined as a connecting part; the combing part is provided with at least one comb tooth, the connecting part is connected with the two tin wetting areas before the comb tooth penetrates between the two adjacent tin wetting areas, and the two tin wetting areas are separated from each other with a gap after the comb tooth penetrates between the two adjacent tin wetting areas.
Further, the carding element is provided with a main body part, the comb teeth extend forwards from the main body part, and the thickness of one comb tooth is smaller than the distance between the two tin wetting areas.
Furthermore, the comb is provided with a plurality of tin dipping parts arranged in rows at intervals, a plurality of tin dipping areas arranged in rows at intervals, and a plurality of comb teeth correspondingly arranged in rows at intervals, wherein when the comb teeth penetrate between two adjacent tin dipping areas, each comb tooth is arranged between every two adjacent tin dipping areas.
Furthermore, the comb is further provided with a plurality of tin-wetting parts, the tin-wetting parts are respectively provided with a plurality of tin-wetting areas, the comb part is provided with at least two comb teeth, and when the comb teeth penetrate through the space between two adjacent tin-wetting areas, at least two tin-wetting areas are arranged between two adjacent comb teeth.
Furthermore, a layer of soldering flux is arranged between the tin adhering area and the tin material. .
Compared with the prior art, the tin pick-up method and the tin pick-up device have the advantages that the tin pick-up device is provided with the carding piece, the carding piece is provided with the comb teeth, the two tin pick-up areas are connected by the tin material before the comb teeth penetrate through the two adjacent tin pick-up areas, the two tin pick-up areas are separated from each other with a gap after the comb teeth pass through the two adjacent tin pick-up areas, so that the tin connecting phenomenon caused by the fact that the two adjacent tin pick-up areas are connected into a whole is avoided, the short circuit hidden danger in the background technology cannot exist when the two tin pick-up elements are welded with an external electronic element, the two tin pick-up elements cannot be electrically conducted through the adhesion of the tin material, and the short circuit between the two tin pick-up elements is avoided.
[ description of the drawings ]
FIG. 1 is a schematic perspective view of a solder-wetting member of the present invention positioned above a solder-wetting apparatus and not being wetted with solder material;
FIG. 2 is a schematic perspective view of the solder member of FIG. 1 moving downward with the solder region immersed in the solder material;
FIG. 3 is a schematic perspective view of the solder areas of FIG. 2 with solder material attached, with comb teeth positioned between two adjacent solder elements, but before cutting the connecting portion;
FIG. 4 is a schematic view of the tin-wetting member of FIG. 3 after being dipped with tin material and before the connecting portion between the tin-wetting areas is cut by the comb teeth;
FIG. 5 is a front view of the tin-wetting area of FIG. 4 after being wetted with tin material;
FIG. 6 is a schematic view of the connection between the wicking zones of FIG. 3 after being cut by the comb teeth;
FIG. 7 is a perspective view of the connecting portion between the wicking regions of the wicking member of FIG. 6 after being cut by the comb teeth;
FIG. 8 is a front view of the connection between the wicking zones of FIG. 7 after cutting;
FIG. 9 is a perspective view of the second embodiment of the comb teeth after the tin-wetting area of FIG. 2 is wetted with tin material and before the connecting portion is not cut;
FIG. 10 is a perspective view of the solder member being lifted upwardly after the connection portion of FIG. 9 is cut;
FIG. 11 is a schematic plan view of the comb teeth of the third embodiment positioned between two tin-wetting areas after the tin-wetting areas of FIG. 2 are dipped with tin material;
FIG. 12 is a perspective view of the solder member after the comb teeth of FIG. 11 cut the connection portion;
fig. 13 is a front view of the comb teeth of fig. 12 after cutting the connection part.
Detailed description of the embodiments reference is made to the accompanying drawings in which:
receiving member 10 of tin wetting device 1 and cavity 101
[ detailed description ] embodiments
For a better understanding of the objects, structure, features, and functions of the invention, reference should be made to the drawings and detailed description that follow.
For the sake of accuracy of description, the directions are referred to herein, wherein the extending direction of the X-axis is a front-back direction (wherein the X-axis positive direction is front), the extending direction of the Y-axis is a left-right direction (wherein the Y-axis positive direction is right), and the extending direction of the Z-axis is an up-down direction (wherein the Z-axis positive direction is up).
Referring to fig. 1, 2 and 4, which are schematic views of a tin dipping device 1 according to a first embodiment of the present invention, the tin dipping device 1 has a receiving member 10, the receiving member 10 is recessed from top to bottom to form a receiving cavity 101, the receiving cavity 101 is opened upward (not numbered, the same applies hereinafter), and receives a tin material 11 therein. The receiving member 10 is heated to 295 deg.c or more by a heating member (not shown, the same applies hereinafter) so that the solder 11 is in a liquid state.
Referring to fig. 1, 2 and 4, the tin wetting device 1 has a comb member 12, the comb member 12 has a main body portion 120, the main body portion 120 is fixed on the receiving member 10 (not shown, the same below), and a plurality of comb teeth 121 extending forward from the main body portion 120 and arranged in a row at regular intervals.
Referring to fig. 1, 2 and 4, each of the solder wetting members 2 has a solder wetting area 20 for wetting the solder 11. The tin pick-up members 2 are arranged in rows at intervals, after the tin pick-up regions 20 pick up the tin material 11, the tin material 11 is attached to the tin pick-up regions 20, the tin material 11 is arranged between every two adjacent tin pick-up regions 20, the tin material 11 between the two adjacent tin pick-up regions 20 is defined as a connecting part 111, and the connecting part 111 connects the two adjacent tin pick-up regions 20, so that the tin pick-up regions 20 are connected into a whole by the tin material 11. In this embodiment, the solder-wetting members 2 are cables, each of the solder-wetting members 2 has a conductor 21 and an outer insulating layer 22 covering the conductor 21, the conductor 21 is a core (not shown, the same below) for transmitting signals and a shielding layer (not shown, the same below) covering the core, and the outer insulating layer 22 is made of a material that is not solder-wetting. A portion of the conductor 21 extends out of the outer insulating layer 22 to form the tin wetting region 20. Of course, in other embodiments, the solder dipping member 2 may be a metal member or a terminal, and any object having a solder dipping requirement may be referred to as the solder dipping member 2, which depends on the actual production situation.
Referring to fig. 3, 6 and 7, the thickness of each comb tooth 121 is smaller than the distance between two adjacent tin-wetting areas 20, so that the comb tooth 121 can enter between two adjacent tin-wetting areas 20, cut the connecting portion 111, and divide the connecting portion 111 into two parts, so that two adjacent tin-wetting areas 20 can be separated. When the comb teeth 121 pass through two adjacent tin wetting areas 20, each tin wetting area 20 is arranged between every two adjacent comb teeth 121.
In the first embodiment, the steps of the method for wetting the tin-wetting member 2 are as follows:
(1) referring to fig. 1, providing the receiving member 10, loading the tin material 11 into the receiving cavity 101, heating the tin material 11 to a temperature equal to or greater than 295 ℃ by using the heating member, and melting the tin material 11 into a liquid;
(2) referring to fig. 1, a plurality of the tin-wetting members 2 are provided;
(3) referring to fig. 1 and 2, providing the carding element 12, and fixing a plurality of comb teeth 121 spaced in a row above the solder 11;
(4) the tin-wetting areas 20 of a row of tin-wetting members 2 are dipped with a layer of soldering flux (not shown, the same applies below), and then a row of tin-wetting members 2 are arranged above the tin material 11, with each tin-wetting area 20 facing downwards.
Referring to fig. 2, 4 and 5, the comb teeth 121 are fixed, and the row of tin-wetting members 2 is moved toward the cavity 101, so that the row of tin-wetting regions 20 enters the cavity 101 and is immersed in the tin material 11, the tin material 11 is attached to each tin-wetting region 20, and the connecting portion 111 connects the two tin-wetting regions 20.
(5) Referring to fig. 3, when a portion of the tin wetting area 20 is still submerged in the tin material 11, a row of the tin wetting members 2 is moved toward the comb teeth 121, such that each comb tooth 121 is located between every two adjacent tin wetting members 2, and the comb teeth 121 are higher than the tin wetting area 20.
Referring to fig. 6, 7 and 8, the tin wetting member 2 is then moved upward, and the tin wetting area 20 is moved from below the comb teeth 121 to above the comb teeth 121, so that the connecting portion 111 is cut by the comb teeth 121, and thus the two tin wetting areas 20 are separated from each other.
(6) The tin pick-up member 2 finishes tin pick-up. The tin-wetting member 2 after the tin-wetting is completed is soldered to an external electronic component (not shown, the same applies below).
Referring to fig. 9 and 10, which are a second embodiment of the present invention, the difference between the first embodiment and the second embodiment is that the main body 120 may be fixed to a moving mechanism (not shown, the same applies below) which drives the comb 12 to move toward the tin-wetting member 2.
Referring to fig. 9 and 10, the steps of the tin dipping method of the tin dipping member 2 in the second embodiment are different from those of the first embodiment in that other steps are the same as those of the first embodiment:
in the step (5), a part of the tin-wetting area 20 is still immersed in the tin material 11, the tin-wetting member 2 is not moved, the comb member 12 is moved toward the tin-wetting member 2, so that the comb teeth 121 enter between two adjacent tin-wetting members 2, and the comb teeth 121 are higher than the tin-wetting area 20, and then the tin-wetting member 2 is moved upward, the tin-wetting area 20 is moved from below the comb teeth 121 to above the comb teeth 121, so that the connecting portion 111 is cut by the comb teeth 121, and thus the two tin-wetting areas 20 are separated from each other.
Of course, the step (5) may also adopt another method: the row of tin pick-up members 2 is lifted up and away from the tin mass 11, then the tin pick-up members 2 are stationary, the comb member 12 is moved towards the tin pick-up members 2 so that the comb teeth 121 enter between two adjacent tin pick-up members 2 and the comb teeth 121 are higher than the tin pick-up area 20, and then the comb teeth 121 are moved downwards, the comb teeth 121 are moved from above the tin pick-up area 20 to below the tin pick-up area 20 so that the comb teeth 121 cut the connecting portion 111 in two parts, so that the two tin pick-up areas 20 are separated from each other.
Referring to fig. 11, 12 and 13, this is a third embodiment of the present invention, which is different from the first embodiment in that other structures and connection relations are the same as the first embodiment, at least a portion of the plurality of comb teeth 121 arranged in a row are unevenly arranged, when the comb teeth 121 pass through two adjacent tin-wetting regions 20, two tin-wetting regions 20 are provided between at least two adjacent comb teeth 121, the two tin-wetting regions 20 are arranged at intervals and have the connection portion 111 therebetween, or the two tin-wetting regions 20 are close to each other (not shown), and are adhered to each other through the connection portion 111. Of course, in other embodiments, there are two tin wetting areas 20 between all adjacent two comb teeth 121.
Referring to fig. 11, 12 and 13, the steps of the method for wetting the solder member 2 in the third embodiment are different from those of the first embodiment in that the other steps are the same as those of the first embodiment:
in the step (5), the two tin-wetting areas 20 located between two adjacent comb teeth 121 are not cut by the comb teeth 121, and the two tin-wetting areas 20 are adhered together.
Referring to fig. 11, 12 and 13, the steps of the method for wetting the solder member 2 in the third embodiment are different from those in the second embodiment in that the other steps are the same as those in the second embodiment:
in the step (5), the two tin-wetting areas 20 located between two adjacent comb teeth 121 are not cut by the comb teeth 121, and the two tin-wetting areas 20 are adhered together.
In summary, the tin dipping method and the tin dipping device of the invention have the following beneficial effects:
1. after the comb teeth 121 pass through the two adjacent tin-dipping areas 20, the two tin-dipping areas 20 are separated from each other with a gap, so that the tin-dipping phenomenon caused by the fact that the two adjacent tin-dipping areas 20 are connected into a whole is avoided, when the tin-dipping pieces 2 are welded with an external electronic element, each tin-dipping piece 2 cannot be electrically conducted through the tin material 11, and therefore short circuit between the two tin-dipping pieces 2 is avoided.
2. The thickness of the comb teeth 121 is smaller than the distance between two adjacent tin-wetting areas 20, so that the comb teeth 121 can enter between two adjacent tin-wetting areas 20, the connecting portion 111 is cut, the connecting portion 111 is divided into two parts, two adjacent tin-wetting areas 20 can be separated, the tin material 11 is retained on one side of each tin-wetting area 20 close to the comb teeth 121, and the yield of soldering is further ensured.
3. Before the tin-stained part 2 is stained with the tin material 11, the tin-stained area 20 is soaked with a layer of soldering flux, which is beneficial to the tin-stained area 20 to be adhered to the tin material 11.
4. When the comb teeth 121 pass through two adjacent tin-wetting areas 20, two tin-wetting areas 20 are arranged between the first comb teeth 121 and the second comb teeth 121, so that the connecting portion 111 between the two tin-wetting areas 20 is not cut, and the specific arrangement of the comb teeth 121 can be adjusted according to actual requirements.
The above detailed description is only for the purpose of illustrating the preferred embodiments of the present invention, and not for the purpose of limiting the scope of the present invention, therefore, all technical changes that can be made by applying the present specification and the drawings are included in the scope of the present invention.
Claims (15)
1. A tin dipping method, comprising the following steps:
(1) providing a containing piece, wherein the containing piece is provided with a containing cavity, and tin materials are filled into the containing cavity;
(2) providing at least two tin-wetting pieces which are arranged at intervals, wherein each tin-wetting piece is provided with a tin-wetting area;
(3) providing a carding element, wherein the carding element is provided with at least one comb tooth;
(4) moving at least two tin-wetting pieces towards the direction of the cavity, enabling the tin-wetting areas of the two tin-wetting pieces to enter the cavity, enabling the tin material to be attached to the tin-wetting areas, defining the tin material between every two adjacent tin-wetting areas as a connecting part, and adhering the two tin-wetting areas to the connecting part;
(5) moving the two tin-wetting parts or the carding part to enable the comb teeth to be positioned between the two tin-wetting parts attached with the tin material, so that the comb teeth cut the connecting part, and the two tin-wetting areas are separated;
(6) and the tin dipping piece finishes tin dipping.
2. The tin dipping method as recited in claim 1, wherein: in the step (3), the comb teeth are fixed above the tin material, in the step (5), the tin-wetting parts are moved towards the comb teeth, so that the comb teeth enter between two adjacent tin-wetting parts, the comb teeth are higher than the tin-wetting areas, then the tin-wetting parts are moved upwards, the tin-wetting areas are moved to the upper parts of the comb teeth from the lower parts of the comb teeth, and the comb teeth cut the connecting parts, so that the two tin-wetting areas are separated from each other.
3. The tin dipping method as recited in claim 1, wherein: in the step (3), the comb teeth are arranged above the tin material, in the step (5), the carding element is moved towards the tin wetting element, so that the comb teeth enter between two adjacent tin wetting elements, the comb teeth are higher than the tin wetting areas, then the comb teeth are moved downwards, the comb teeth are moved to the position below the tin wetting areas from the position above the tin wetting areas, the comb teeth cut the connecting parts, and therefore the two tin wetting areas are separated from each other.
4. The tin dipping method as recited in claim 1, wherein: in the step (3), the comb teeth are arranged above the tin material, in the step (5), the carding element is moved towards the tin pick-up element, so that the comb teeth enter between two adjacent tin pick-up elements, the comb teeth are higher than the tin pick-up areas, then the tin pick-up element is moved upwards, the tin pick-up areas are moved to the upper parts of the comb teeth from the lower parts of the comb teeth, so that the comb teeth cut the connecting parts, and the two tin pick-up areas are separated from each other.
5. The tin dipping method as recited in claim 1, wherein: in the step (5), at least part of the tin wetting area is immersed in the tin material, and then the comb teeth are positioned between the two tin wetting parts.
6. The tin dipping method as recited in claim 1, wherein: in the step (2), the tin-wetting member is a cable, the cable has a conductor and an outer insulating layer covering the conductor, a part of the outer insulating layer is firstly stripped, and a part of the conductor is exposed to the outer insulating layer so as to form the tin-wetting area.
7. The tin dipping method as recited in claim 1, wherein: in the step (4), before the tin-wetting area enters the cavity, a layer of soldering flux is coated on the tin-wetting area.
8. The tin dipping method as recited in claim 1, wherein: in the step (1), the tin wetting device is further provided with a heating element, and the heating element heats the tin material to be equal to or more than 295 ℃ before the tin wetting area enters the cavity.
9. The tin dipping method as recited in claim 1, wherein: in the step (2), the tin-wetting pieces are arranged in rows at intervals, in the step (3), the comb teeth are arranged in rows at intervals, in the step (5), each comb tooth is located between every two adjacent tin-wetting pieces, and each connecting part is cut by the corresponding comb tooth.
10. The tin dipping method as recited in claim 1, wherein: in the step (2), a plurality of the tin pick-up parts are provided, in the step (3), the carding part is provided with at least two comb teeth, in the step (5), two tin pick-up areas are positioned between two adjacent comb teeth, and connecting parts between two adjacent comb teeth are not cut.
11. A tin dipping device is used for tin dipping of tin dipping areas of at least two tin dipping pieces, and is characterized by comprising the following components:
the tin wetting area is arranged in the accommodating cavity at intervals, the two tin wetting areas enter the accommodating cavity, the tin material is additionally arranged on each tin wetting area, and the tin material positioned between the two adjacent tin wetting areas is defined as a connecting part;
the combing part is provided with at least one comb tooth, the connecting part is connected with the two tin wetting areas before the comb tooth penetrates between the two adjacent tin wetting areas, and the two tin wetting areas are separated from each other with a gap after the comb tooth penetrates between the two adjacent tin wetting areas.
12. The tin wetting apparatus of claim 11, wherein: the carding element is provided with a main body part, the comb teeth extend forwards from the main body part, and the thickness of one comb tooth is smaller than the distance between the two tin wetting areas.
13. The tin wetting apparatus of claim 11, wherein: the comb is characterized by further comprising a plurality of tin dipping pieces arranged in rows at intervals, a plurality of tin dipping areas arranged in rows at intervals, and a plurality of comb teeth correspondingly arranged in rows at intervals.
14. The tin wetting apparatus of claim 11, wherein: the comb is further provided with a plurality of tin-wetting parts, the tin-wetting parts are respectively provided with a plurality of tin-wetting areas, the comb part is provided with at least two comb teeth, and when the comb teeth penetrate through the space between two adjacent tin-wetting areas, at least two tin-wetting areas are arranged between two adjacent comb teeth.
15. The tin wetting apparatus of claim 11, wherein: and a layer of soldering flux is arranged between the tin adhering area and the tin material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910118873.5A CN111525361A (en) | 2019-02-01 | 2019-02-01 | Tin dipping method and tin dipping device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910118873.5A CN111525361A (en) | 2019-02-01 | 2019-02-01 | Tin dipping method and tin dipping device |
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|---|---|
| CN111525361A true CN111525361A (en) | 2020-08-11 |
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| CN201910118873.5A Pending CN111525361A (en) | 2019-02-01 | 2019-02-01 | Tin dipping method and tin dipping device |
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| CN (1) | CN111525361A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4766844A (en) * | 1987-05-28 | 1988-08-30 | Westinghouse Electric Corp. | Robotic tinning station for axial lead electronic components |
| CN102935536A (en) * | 2012-11-27 | 2013-02-20 | 常熟泓淋电子有限公司 | Clamp rotating and clamping device of automatic tin wetting machine |
| CN205967728U (en) * | 2016-08-15 | 2017-02-22 | 苏州昇讯电子科技有限公司 | In bank soldering device |
| JP2017092222A (en) * | 2015-11-09 | 2017-05-25 | 株式会社パラット | Soldering device and soldering method |
| CN207386764U (en) * | 2017-10-30 | 2018-05-22 | 孝感华工高理电子有限公司 | A kind of wicking tin scraping device |
-
2019
- 2019-02-01 CN CN201910118873.5A patent/CN111525361A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4766844A (en) * | 1987-05-28 | 1988-08-30 | Westinghouse Electric Corp. | Robotic tinning station for axial lead electronic components |
| CN102935536A (en) * | 2012-11-27 | 2013-02-20 | 常熟泓淋电子有限公司 | Clamp rotating and clamping device of automatic tin wetting machine |
| JP2017092222A (en) * | 2015-11-09 | 2017-05-25 | 株式会社パラット | Soldering device and soldering method |
| CN205967728U (en) * | 2016-08-15 | 2017-02-22 | 苏州昇讯电子科技有限公司 | In bank soldering device |
| CN207386764U (en) * | 2017-10-30 | 2018-05-22 | 孝感华工高理电子有限公司 | A kind of wicking tin scraping device |
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