JP2014041856A - Component mounting line and component mounting method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a component mounting line and a component mounting method capable of satisfying both of ensuring mounting quality and increase of the productivity.SOLUTION: A component mounting line 1 includes a component mounting unit M3 which has a component mounting section M3A that mounts electronic components onto an individual board 40 after solder printing; and a mounted component inspection section M3B that performs a predetermined inspection on the individual board 40 mounted with the components. When a defective item is found as the inspection result, the component mounting section M3A mounts a marking part 44 indicating that the individual board 40 is defective board to the individual board 40 and convey the same to a reflow unit. With this, in the inspection after the reflow, total inspection is not made but only the individual board 40 attached with the marking part 44 is subjected to an acceptability inspection. Thus, the mounting quality is ensured and productivity is increased.

Description

  The present invention relates to a component mounting line that manufactures a mounting board by mounting electronic components on a substrate, and a component mounting method in the component mounting line.

  In an electronic component mounting system that mounts electronic components on a substrate, the substrate is transported along a component mounting line configured by connecting a plurality of devices such as solder printing devices and component mounting devices in series, and then transported from the upstream side. A mounting board is manufactured by sequentially executing work processes such as solder printing and component mounting on the printed board. The component mounting line has an inspection function, and the quality of work results for a predetermined inspection item is determined for a board after execution of each work process (see, for example, Patent Document 1). In the prior art shown in this patent document example, an inspection camera for inspecting the mounting state is provided in the component mounting apparatus, and the board on which the defect is determined in the inspection is stopped by the transport conveyor provided on the downstream side. It is subject to visual observation and manual repair by the operator.

  In the above-mentioned visual observation by the operator, whether or not the defect determination in the inspection is a correct determination, that is, in a state where the state determined to be defective is a correct determination that really requires repair or does not require repair. It is determined whether it is an overdetermination determined to be defective despite being present (see, for example, Patent Document 2). In the prior art shown in this patent document example, a correct / over-judgment is determined by checking an actual product while referring to an inspection result at an appearance inspection / repair station provided in a component mounting line.

JP 2011-82375 A JP 2004-214394 A

  However, in the prior art including the above-described patent document examples, the following problems have occurred in the overdetermination determination of a board on which a defect determination is made by the component mounting line inspection function. That is, since the over-determination determination is made by subjective judgment by the worker's visual observation, whether or not the determination is appropriate greatly depends on the skill level of the worker, and an appropriate determination is not always made. For example, even when the mounting position of a component is somewhat shifted with respect to the solder printed on the electrodes on the board and a failure is determined, the self caused by the surface tension when the solder melts during the reflow process The misalignment may be corrected by the alignment effect and may not require repair. On the other hand, even when the operator determines that repair is not necessary, reflow may not be performed properly, resulting in a defect in the post-reflow inspection. In other words, even if an operator is fixedly placed for each inspection process and overjudgment judgment after inspection is required, not only does it directly affect the guarantee of mounting quality, but also increases labor costs due to the fixed placement of workers. Inviting results in reduced productivity.

  Depending on the board type, shield parts may be mounted to cover already mounted parts.In such a case, it is not possible to make an overjudgment judgment by visual observation after the parts are mounted. If it was going to be performed, it was necessary to adopt an inspection method that required equipment costs and time such as X-ray inspection. In this case, if 100% inspection is performed with an emphasis on securing the mounting quality, it takes a lot of inspection time and productivity is lowered, and if sampling inspection is adopted in order to shorten the time, there is a risk of causing inspection omission. . As described above, in the conventional component mounting line, there is a problem that it is difficult to ensure both mounting quality and productivity.

  Therefore, an object of the present invention is to provide a component mounting line and a component mounting method capable of ensuring both mounting quality and improving productivity.

  The component mounting line of the present invention is a component mounting line for manufacturing a mounting substrate by mounting electronic components on a substrate by solder bonding, and a solder printing apparatus for printing a solder paste on the substrate, and the substrate after the solder printing. A component mounting apparatus having a component mounting unit for mounting an electronic component and a mounting inspection unit for performing a predetermined inspection on the substrate after component mounting; and heating and soldering the substrate after the inspection is performed A reflow device that melts and solidifies, and when the component mounting device determines that the substrate is defective according to the result of the inspection, the component mounting unit displays a marking component that indicates that the substrate is a defective substrate. And then carried out to the reflow apparatus.

  The component mounting method of the present invention includes a solder printing apparatus that prints a solder paste on a substrate, a component mounting unit that mounts an electronic component on the substrate after solder printing, and a predetermined inspection for the substrate after component mounting. A mounting substrate in which electronic components are mounted on a substrate by solder bonding using a component mounting line including a component mounting device having a mounting inspection unit to be performed and a reflow device that heats the substrate after inspection to melt and solidify solder. A component mounting method for mounting an electronic component on the substrate after solder printing, and a mounting inspection step for performing a predetermined inspection on the substrate after component mounting. When a part for marking indicating that the board is a defective board is mounted on the board by the part mounting part when the board is determined to be defective by the inspection result in the inspection process. It is carried out to the reflow apparatus.

  According to the present invention, in a component mounting line including a component mounting apparatus that includes a component mounting unit that mounts an electronic component on a substrate after solder printing and a mounting inspection unit that performs a predetermined inspection on the substrate after component mounting. If the result of the inspection determines that the board is defective, a marking component that indicates that the board is a defective board is mounted on the board by the component mounting unit and carried out to the reflow device. Then, it is only necessary to perform the pass / fail judgment for only the board with the marking component without performing 100% inspection, and it is possible to achieve both mounting quality and productivity improvement.

The top view of the component mounting line of one embodiment of this invention Form explanatory drawing of the board used as the work object of the component mounting line of one embodiment of the present invention Functional explanatory drawing of the component mounting apparatus used for the component mounting line of one embodiment of this invention Functional explanatory drawing of the component mounting apparatus used for the component mounting line of one embodiment of this invention The flowchart which shows the component mounting process in the component mounting line of one embodiment of this invention Operation explanatory diagram of component mounting processing in the component mounting method of the embodiment of the present invention Operation explanatory diagram of component mounting processing in the component mounting method of the embodiment of the present invention Explanatory drawing of the component behavior of the solder joint process in the component mounting method of one embodiment of the present invention

  First, the configuration of the component mounting line 1 will be described with reference to FIG. The component mounting line 1 has a function of manufacturing a mounting substrate by mounting electronic components on a substrate by solder bonding, and is configured by connecting a plurality of electronic component mounting devices in series. Here, the printing apparatus M1, the printing inspection apparatus M2, the component mounting apparatus M3, and the reflow apparatus M4 are connected in series.

  Hereinafter, the configuration of each apparatus will be described. The printing apparatus M1 has a function of printing a solder paste for joining electronic components on a substrate to be mounted, and a substrate transport mechanism 3 that transports the substrate 4 to be mounted in the substrate transport direction on the upper surface of the base 2A. A substrate positioning unit 5 that positions and holds the conveyed substrate 4 is disposed. A screen mask 15 extended on a mask frame 14 is disposed above the substrate positioning unit 5, and a squeegee unit 13 held by a moving beam 12 is disposed above the screen mask 15 by a Y-axis table 11. A screen printing unit configured to be driven horizontally is provided.

  The substrate 4 supplied from the upstream side (arrow a) and positioned by the substrate positioning unit 5 is brought into contact with the lower surface of the screen mask 15, and the Y-axis table 11 is driven to supply the solder paste. By sliding the squeegee unit 13, solder paste is printed on the component connection electrodes formed on the substrate 4 through the pattern holes provided in the screen mask 15. The print inspection apparatus M2 has a function of receiving the board 4 after the printing operation is performed by the printing apparatus M1 and inspecting the printing state of the solder paste printed on the board 4.

  On the upper surface of the base 2B of the printing inspection apparatus M2, a substrate transport mechanism 3 and a substrate positioning unit 6 connected to the printing apparatus M1 are disposed. Further, an inspection camera 17 that is horizontally moved by a camera moving mechanism including a Y-axis table 11 and a moving beam 16 is disposed above the substrate positioning unit 6. By driving the camera moving mechanism, the camera 17 moves in the horizontal direction above the substrate 4 and images an arbitrary position of the substrate 4. Then, the imaging result is recognized by the image recognition unit, and the recognition processing result is determined by the inspection processing unit, whereby the print inspection is executed.

  A configuration of the component mounting apparatus M3 disposed downstream of the print inspection apparatus M2 will be described. A substrate transport mechanism 18 is disposed in the center of the base 2C in the substrate transport direction (X direction). The board transport mechanism 18 transports the board 4 delivered from the printing inspection apparatus M2, and positions the board 4 on a mounting stage for performing a component mounting operation by the component mounting mechanism. On one side (lower side in FIG. 1) of the board transport mechanism 18, a component mounting portion M3A for mounting electronic components on the board 4 after solder printing is disposed, and on the other side (upper side in FIG. 1). A mounting inspection unit M3B that performs a predetermined inspection on the mounting state on the substrate 4 after mounting the component is disposed to face the component mounting unit M3A.

  The component mounting unit M3A is provided with a component supply unit 22, and the component supply unit 22 is provided with a plurality of tape feeders 23 arranged in parallel. The tape feeder 23 feeds the electronic component to the component pickup position by pitch-feeding the carrier tape holding the electronic component mounted on the substrate 4. A Y-axis movement table 19 is disposed at the end of the base 2C on the X direction side. The two X-axis movement tables 20A and 20B coupled to the Y-axis movement table 19 are mounted on the mounting heads 21, respectively. The inspection head 24 is mounted. Detailed functions of the component mounting unit M3A and the mounting inspection unit M3B will be described with reference to FIGS.

  On the downstream side of the component mounting apparatus M3, a reflow apparatus M4 having a configuration in which the substrate transport mechanism 28 and the reflow furnace 29 are disposed on the base 2D is disposed. The substrate 4 after the component mounting is performed by the component mounting unit M3A and the inspection by the mounting inspection unit M3B is performed is transported in the reflow furnace 29 by the substrate transport mechanism 28, whereby the substrate 4 is heated according to a predetermined heating profile. Thus, the solder is melted and solidified, and the electronic component is soldered to the substrate 4. The substrate 4 after the solder bonding is carried out to the downstream side (arrow b) and becomes a target for inspection after reflow.

  Next, with reference to FIG. 2, the form of the board | substrate 4 used as the work object of the component mounting line 1 is demonstrated. As shown in FIG. 2A, the substrate 4 has a configuration in which a plurality of individual substrates 40 such as resin substrates are held on a substrate pallet 4a. As shown in FIG. 2B, a plurality of component mounting positions 40a for mounting electronic components 42 (see FIGS. 3 and 4) are set on the individual substrate 40, and each component mounting position 40a is set. The electrode 41 for soldering the electronic component is formed corresponding to the form of each component type. In the printing operation by the print inspection apparatus M2, the solder paste S is printed on the electrode 41. The configuration of the substrate 4 may be a configuration in which a plurality of individual substrates (child substrates) are formed in the parent substrate.

  Next, the detailed configuration of the component mounting unit M3A and the work contents executed by the component mounting unit M3A will be described with reference to FIG. As shown in FIG. 3A, the mounting head 21 includes a plurality of unit transfer heads 25, and holds electronic components by vacuum suction by suction nozzles 25 a attached to the unit transfer heads 25. By driving the Y-axis movement table 19 and the X-axis movement table 20A, the mounting head 21 moves horizontally in the X direction and the Y direction. As a result, the mounting head 21 picks up and takes out the electronic component from the tape feeder 23 of the component supply unit 22, and transports and mounts the electronic component onto the solder printed substrate 4 positioned on the mounting stage of the substrate transport mechanism 18.

  The Y-axis moving table 19, the X-axis moving table 20A, and the mounting head 21 are component mounting mechanisms for picking up and picking up electronic components from the component supply unit 22 by using the mounting head 21 and transferring and mounting them on the printed circuit board 4 with solder. Configure. A substrate recognition camera 26 that moves integrally with the mounting head 21 is mounted on the lower surface of the X-axis moving table 20A. The substrate recognition camera 26 that moves above the substrate 4 together with the mounting head 21 images the substrate 4, and By recognizing the imaging result, the component mounting position on the board 4 is recognized.

  A component recognition camera 27 is provided on the moving path from the component supply unit 22 to the substrate 4 by the mounting head 21. When the mounting head 21 holding the electronic component moves above the component recognition camera 27, the component recognition camera 27 images the electronic component held by the mounting head 21 from below and performs recognition processing on the imaging result. As a result, the displacement of the electronic component held by the mounting head 21 is detected.

  FIGS. 3B, 3C, and 3D show operations performed by the component mounting mechanism having the above-described configuration. First, FIG. 3B shows a component mounting operation for the individual substrate 40 after solder printing. That is, the mounting head 21 is moved to the component supply unit 22, the electronic component 42 is taken out from the tape feeder 23 by the suction nozzle 25 a of the m-unit transfer head 25, and each component mounting position of the individual substrate 40 constituting the substrate 4 is taken. The electronic component 42 is transported and mounted on 40a. Then, the substrate 4 after component mounting is a target of the post-mounting inspection described with reference to FIG.

  Further, as shown in FIG. 3C, a shield component mounting operation is performed in which the shield component 43 is placed on the individual substrate 40 after component mounting. That is, similarly, the mounting head 21 is moved to the component supply unit 22, and the shield component 43 is taken out by the suction nozzle 25 a of the unit transfer head 25 from the feeder in which the shield component 43 is stored. The shield component 43 is mounted so as to cover the mounting surface on which the electronic component 42 is mounted.

  Further, as shown in FIG. 3D, the component mounting mechanism performs an operation of mounting a marking component 44 that indicates that the substrate is a defective substrate on the substrate determined to be defective in the post-mounting inspection. Here, an example is shown in which a defect is detected for one electronic component 42 * among the plurality of electronic components 42. That is, after the mounting head 21 is similarly moved to the component supply unit 22, the marking component 44 is taken out from the feeder containing the marking component 44 by the suction nozzle 25 a of the unit transfer head 25, and the shield component 43 is covered. In the individual substrate 40, the marking component 44 is mounted on an adhesive provided in advance outside the shield component 43. The marking component 44 is supplied by the component supply unit 22 and taken out by the mounting head 21. The adhesive may be anything as long as it can adhere the marking component 44 to the individual substrate 40, but an adhesive such as an adhesive tape or solder is preferable. When the adhesive is an adhesive material such as an adhesive tape, the marking component 44 can be easily detached from the individual substrate 40 even after the reflow process described later, and the workability is good. Also, when the adhesive is solder, during solder printing described above, not only the electrode for connecting the components but also the solder can be printed together at the position of the adhesive, which saves the trouble of providing the adhesive and improves workability. Is good. At this time, instead of mounting the shield component 43 on the upper surface of the individual substrate 40, the marking component 44 may be mounted at a position adjacent to the individual substrate 40 in the substrate pallet 4 a of the substrate 4.

  Next, the detailed configuration of the mounting inspection unit M3B and the work contents executed by the mounting inspection unit M3B will be described with reference to FIG. As shown in FIG. 4A, the X-axis moving table 20B coupled to the Y-axis moving table 19 is mounted with an inspection head 24 incorporating a camera so as to be movable in the X direction. By driving the Y-axis movement table 19 and the X-axis movement table 20B, the inspection head 24 moves horizontally in the X direction and the Y direction.

  As a result, the inspection head 24 moves to above the substrate 4 positioned on the mounting stage of the substrate transport mechanism 18 after mounting the components, and as shown in FIG. 4B, the individual substrate 40 on which the electronic components 42 are mounted. Image. The obtained imaging data is recognized and processed by the recognition processing unit 30, and the inspection processing is performed on the recognition result based on the inspection data stored in advance by the inspection processing unit 31, so that the mounting state of the individual substrate 40 is acceptable. Is inspected. The inspection head 24, the Y-axis movement table 19, and the X-axis movement table 20B constitute an inspection mechanism.

  Then, the inspection result is transmitted to the control unit 32, and the control unit 32 selects and executes a work operation to be performed on the individual substrate 40 in accordance with a preset operation guideline based on the inspection result. That is, the mounting inspection unit M3B is provided to face the component mounting mechanism of the component mounting unit M3A and has an inspection mechanism that inspects the individual substrate 40 on which the electronic component 42 is mounted by the inspection head 24.

  Next, component mounting processing for the substrate 4 executed by the component mounting line 1 will be described with reference to the drawings along the flow of FIG. First, when the component mounting process is started (ST1), the substrate 4 holding the plurality of individual substrates 40 is carried into the printing apparatus M1, and the solder paste is printed on the plurality of individual substrates 40 as a target. (ST2). Thereby, as shown in FIG. 6A, the solder paste S is screen-printed on each electrode 41 formed at the component mounting position 40a on the individual substrate 40. Next, the printed substrate 4 is carried into the print inspection apparatus M2, where post-print inspection is performed (ST3), and electronic components are mounted on the substrate 4 whose inspection result is OK (ST4).

  That is, as shown in FIG. 6B, while the unit transfer head 25 is reciprocated between the component supply unit 22 and the substrate 4 in the component mounting unit M3A (arrow d), the solder paste S is applied to the electronic component 42. The mounting turn for sequentially transferring and mounting to the printed component mounting position 40a is repeatedly executed. Next, a post-mounting inspection is performed on the substrate 4 after the mounting is completed (ST5). That is, as shown in FIG. 6C, in the mounting inspection unit M3B, the inspection head 24 is moved above each individual substrate 40 (arrow d), and the individual substrate 40 on which the electronic component 42 is mounted is imaged. And the quality of a mounting state is determined by inspecting the recognition result which recognized the acquired imaging data.

  Here, if the inspection result is OK, a reflow process is performed to solder the electronic component 42 to the individual substrate 40 (ST7). Here, in the present embodiment, the electronic component to be mounted by the component mounting unit M3A includes the shield component 43 for electromagnetic shielding, and the mounting of the shield component 43 is executed prior to reflow. That is, as shown in FIG. 7A, the shield component 43 is sucked and held by the unit transfer head 25 and mounted on the individual substrate 40 in a form covering all the mounted electronic components 42 (arrow e).

  If the inspection result is NG in (ST5), the marking component 44 shown in FIG. 3 (d) is mounted (ST6). FIG. 8A shows an example in which the test result is NG. With the electronic component 42 mounted on the component mounting position 40a where the solder paste S is printed on the electrode 41, the center position C1 of the solder paste S is shown. Thus, the center position C2 of the electronic component 42 is displaced by a displacement amount D that exceeds the allowable amount. In such a case, as shown in FIG. 7B, the marking component 44 is mounted on the individual substrate 40 (arrow f).

  Then, by completing the component mounting and the post-mounting inspection for all the individual substrates 40, as shown in FIG. 7C, the substrate 4 has the individual substrates 40 with the inspection results OK and NG, respectively. It will be held. In the reflow process (ST7), the substrate 4 in such a state is loaded (arrow g). Accordingly, even when the shield component 43 is covered and visual observation of the mounting surface is impossible, the reflow is performed to indicate that the individual substrate 40 includes an electronic component whose mounting state is determined to be defective. It can be reliably identified after the process.

  That is, in the present embodiment, if the substrate 4 is unloaded from the reflow apparatus M4 after the reflow process, it is visually determined whether or not there is a marking component 44 (ST8). Here, if it is NO (no marking component 44), it means that reflow has been executed with all the electronic components 42 in a good mounting state, and it is determined that the soldering has been performed well. This is the end of the component mounting process (ST10).

  If (YES in ST8) (there is a marking component 44), it means that there is a component that has been reflowed with the mounting state being defective. In this case, post-reflow inspection by X-ray inspection is performed (ST9). Thereby, even if the shield component 43 is covered and visual observation of the mounting surface is impossible, it is possible to determine the quality of the soldered state of the individual electronic components 42.

  FIG. 8B shows the solder joint state detected by the X-ray inspection. Here, (a) indicates that the mounting state failure due to the mounting position shift shown in FIG. 8A is caused by the self-alignment effect due to the surface tension of the molten solder in the reflow process, so that the electronic component 42 moves toward the center position C1 of the solder paste S. An example that has been drawn and improved (arrow h) is shown. Here, the positional deviation amount D before reflow is reduced to the positional deviation amount D * within the allowable value due to the self-alignment effect. In this case, it is determined that the post-reflow inspection is OK.

  On the other hand, in FIGS. 8B and 8B, in the solder melting process, some external force exceeding the suction force in the center direction due to the self-alignment effect acts, and one end side (here, the lower end side) of the electronic component 42 is solder paste S. In this case, it is determined that the inspection is NG after reflow. In this post-reflow inspection, if OK, it is the end of the component mounting process (ST10). In the case of NG, the individual substrate 40 is determined to be a defective substrate and is subject to disposal (ST11). ).

  As described above, the component mounting line and the component mounting method shown in the present embodiment target the component mounting part M3A for mounting electronic components on the individual substrate 40 after solder printing and the individual substrate 40 after component mounting. In the component mounting line 1 provided with the component mounting apparatus M3 having a mounting inspection unit M3B that performs a predetermined inspection as a marking that indicates that the substrate is a defective substrate when it is determined to be defective as a result of the inspection The component 44 is mounted on the individual substrate 40 by the component mounting portion M3A and carried out to the reflow device M4.

  As a result, the inspection method used in the conventional component mounting line, that is, the inspection method in which an operator is fixedly arranged for each inspection process and an over-judgment judgment of a board that has been judged to be defective is performed by the worker. It has become possible to effectively solve the problems that were present. In other words, the determination of over-determination greatly depends on the level of skill of the worker, and appropriate determination is not always made. Therefore, even if the workers are fixedly arranged for each inspection process and the overjudgment judgment after the inspection is executed for all of them, not only does it directly lead to the guarantee of mounting quality, but also labor costs due to the fixed arrangement of workers. As a result, the productivity is lowered.

  On the other hand, in the present embodiment, the marking component 44 is mounted on the individual substrate 40 and carried out to the reflow apparatus M4 without overdetermined determination even when it is determined to be defective based on the inspection result. In addition, only the individual substrate 40 with the marking component 44 attached thereto is set as an inspection target after reflow. Thereby, in the post-reflow inspection, it is possible to acquire a correct quality determination result without performing a total inspection, and it is possible to achieve both mounting quality and productivity improvement.

  In the present embodiment, the component mounting apparatus M3 includes a component mounting unit M3A that mounts electronic components on a substrate after solder printing and a mounting inspection unit M3B that performs a predetermined inspection on the substrate after component mounting. Although the marking component 44 is mounted on the individual substrate 40 by the component mounting portion M3A, the configuration is not limited thereto. A component mounting apparatus for mounting an electronic component on a board after solder printing is disposed downstream of a mounting inspection apparatus for performing a predetermined inspection on the board after mounting the component, and a marking component is mounted on the individual board 40 by the component mounting apparatus. 44 may be mounted.

  The component mounting line and the component mounting method of the present invention have the effect of ensuring both mounting quality and improving productivity, and manufacturing a mounting substrate by mounting components such as electronic components on the substrate. Useful in the field.

DESCRIPTION OF SYMBOLS 1 Component mounting line 4 Board | substrate 4a Board pallet M2 Print inspection apparatus M3 Component mounting apparatus M3A Component mounting part M3B Mounting inspection part M4 Reflow apparatus 21 Mounting head 24 Inspection head 25 Unit transfer head 40 Single board 40a Component mounting position 41 Electrode 42 Electronic parts 43 Shield parts 44 Marking parts

Claims (6)

A component mounting line for manufacturing a mounting substrate by mounting electronic components on a substrate by solder bonding,
Component mounting having a solder printing apparatus for printing a solder paste on a substrate, a component mounting unit for mounting an electronic component on the substrate after solder printing, and a mounting inspection unit for performing a predetermined inspection on the substrate after component mounting An apparatus, and a reflow apparatus that heats the substrate after the inspection is performed to melt and solidify the solder,
When the component mounting apparatus determines that the board is defective based on the result of the inspection, the component mounting apparatus mounts a marking component indicating that the board is a defective board on the board by the component mounting section, and carries the board to the reflow apparatus. A component mounting line characterized by The component mounting unit includes a component mounting mechanism that sucks and holds an electronic component by a mounting head from a component supply unit and transfers and mounts the electronic component on a substrate.
The mounting inspection unit includes an inspection mechanism that is provided to face the component mounting mechanism and inspects the substrate on which the electronic component is mounted with an inspection head,
The component mounting line according to claim 1, wherein the marking component is supplied by the component supply unit and taken out by the mounting head. The electronic component to be mounted by the component mounting unit includes a shield component that is mounted in a form that covers all the mounted electronic components,
The component mounting line according to claim 1, wherein the marking component is mounted outside the shield component on the mounting surface of the substrate. Component mounting having a solder printing apparatus for printing a solder paste on a substrate, a component mounting unit for mounting an electronic component on the substrate after solder printing, and a mounting inspection unit for performing a predetermined inspection on the substrate after component mounting A component mounting method for manufacturing a mounting substrate by mounting electronic components on a substrate by solder bonding using a component mounting line including a device and a reflow device that heats the substrate after inspection to melt and solidify solder. ,
A component mounting step of mounting an electronic component on the substrate after solder printing, and a mounting inspection step of performing a predetermined inspection on the substrate after component mounting,
When it is determined that the board is defective according to the result of the inspection in the mounting inspection process, a marking component for indicating that the board is a defective board is mounted on the board by the component mounting section and is carried out to the reflow apparatus. A component mounting method characterized by the above. In the component mounting step, the electronic component is sucked and held by the mounting head from the component supply unit and transferred and mounted on the substrate.
In the mounting inspection step, the inspection board is used to inspect the substrate on which the electronic component is mounted, facing the component mounting mechanism,
The component mounting method according to claim 4, wherein, when the defect is determined, the marking component is supplied by the component supply unit and taken out by the mounting head.   The electronic component to be mounted by the component mounting unit includes a shield component that is mounted in a form that covers all the mounted electronic components, and the marking component is placed on the mounting surface of the substrate. The component mounting method according to claim 4, wherein the component mounting method is mounted outside.

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