JP4702237B2 - Electronic component mounting apparatus and electronic component mounting method - Google Patents

Description

  The present invention relates to an electronic component mounting apparatus and an electronic component mounting method for transferring and mounting an electronic component on which a solder bump is formed on a substrate.

As a form of mounting an electronic component such as a semiconductor element on a circuit board, a method of mounting a semiconductor package in which a semiconductor element is mounted on a resin board to a circuit board via solder bumps is used. In solder bonding in which an electronic component is bonded to a substrate via a solder bump, the solder bump is landed on the electrode of the substrate in a state where a solder bonding auxiliary agent such as flux or solder paste is supplied to the solder bump. . For this reason, a device for transferring flux and solder paste is disposed in the electronic component mounting device (see, for example, Patent Document 1).
JP 2005-305806 A

  In recent years, with the progress of miniaturization and high functionality of electronic devices, electronic components incorporated in the electronic devices are required to have a high mounting density and are miniaturized and thinned. For this reason, a thin electronic component such as a circuit board or a semiconductor package mounted on the circuit board also has a characteristic that the rigidity is lowered and warping deformation is easily caused by heating. For this reason, in an electronic component having solder bumps formed on the lower surface, warping deformation may already occur at the stage where the semiconductor chip is sealed with resin. If such an electronic component is mounted on the substrate as it is, the solder bump of the portion where the warp deformation occurred will be lifted with respect to the substrate, and a gap will tend to be formed between the solder paste printed on the electrode of the substrate. is there. As a result, the solder bumps are not properly soldered to the electrodes on the substrate, and bonding failures such as poor conduction and insufficient bonding strength are likely to occur.

  Therefore, an object of the present invention is to provide an electronic component mounting apparatus and an electronic component mounting method capable of preventing a bonding failure when mounting an electronic component that is likely to be warped and deformed by solder bonding.

  An electronic component mounting apparatus according to the present invention is an electronic component mounting apparatus that transports and mounts an electronic component having a plurality of solder bumps formed on its lower surface on a substrate, and holds the substrate with a component supply unit that supplies the electronic component A substrate holding unit for positioning, a mounting head for taking out an electronic component from the component supply unit and transferring and mounting it on the substrate held by the substrate holding unit, and the mounting head between the component supply unit and the substrate holding unit A head moving means for moving between them, a component warp measuring means for measuring a warp deformation state of an electronic component held by the mounting head, and a moving path for the mounting head. The electronic component held by the mounting head is lowered with respect to the coating film formed on the coating film forming surface to supply solder paste to the plurality of solder bumps by transfer. A paste transfer unit, and a said component warpage determines paste transfer determination unit necessity of the transfer of solder paste by the paste transfer unit based on the measurement result of the measuring means.

The electronic component mounting method of the present invention includes a component supply unit that supplies an electronic component, a substrate holding unit that holds and positions the substrate, and an electronic component that is taken out from the component supply unit and held by the substrate holding unit. A mounting head to be transported and mounted on the substrate; a head moving means for moving the mounting head between the component supply unit and the substrate holding unit; and an electron disposed in the movement path of the mounting head and held by the mounting head. The component warp measuring means for measuring the warp deformation state of the component, and the electronic component held by the mounting head on the moving path of the mounting head is applied to the coating film of the solder paste formed on the coating film forming surface. The plurality of solder bumps are formed on the lower surface by an electronic component mounting apparatus including a paste transfer unit that supplies solder paste to the plurality of solder bumps by transfer. An electronic component mounting method for mounting and mounting a formed electronic component on a substrate, the step of taking out the electronic component by the mounting head from the component supply unit, and the electron held by the mounting head by the component warpage measuring means In a component warpage measurement step for measuring warpage deformation of a component, a paste transfer determination step for determining whether or not the paste transfer unit needs to transfer a solder paste based on a measurement result in the component warpage measurement step, and in the paste transfer determination If it is determined that paste transfer is necessary, the solder paste is transferred to the solder bump by lowering the electronic component held by the mounting head with respect to the paste transfer unit disposed in the movement path of the mounting head. A solder paste transfer process to be supplied by the method, and mounting the electronic component on the substrate The pump and a component mounting step of landing through the solder paste on the electrodes of the substrate.

  According to the present invention, a paste transfer unit that supplies a solder paste to an electronic component mounting apparatus by transfer is provided, and paste transfer is performed based on a measurement result obtained by measuring warp deformation of an electronic component held on a mounting head by a component warp measurement unit. By determining whether the unit needs to transfer the solder paste, it is possible to make up for the shortage of solder caused by warping deformation of parts, and to prevent poor bonding when mounting electronic components that are prone to warping deformation by soldering. can do.

  Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a block diagram showing a configuration of an electronic component mounting system according to an embodiment of the present invention, FIG. 2 is an explanatory diagram of solder printing in the electronic component mounting system according to an embodiment of the present invention, and FIG. 4 is a plan view of an electronic component mounting apparatus according to an embodiment, FIG. 4 is an explanatory diagram of component warpage measurement in the electronic component mounting apparatus according to an embodiment of the present invention, and FIG. 5 is an electronic component mounting according to an embodiment of the present invention. FIG. 6 is a diagram illustrating the structure of the paste transfer unit in the apparatus, FIG. 6 is a diagram illustrating the operation of the paste transfer unit in the electronic component mounting apparatus according to the embodiment of the invention, and FIG. 7 is the electronic component mounting apparatus according to the embodiment of the invention. FIG. 8 is a flow diagram showing an electronic component mounting method according to an embodiment of the present invention, and FIGS. 9 and 10 are process descriptions of the electronic component mounting method according to an embodiment of the present invention. FIG.

  First, an electronic component mounting system will be described with reference to FIG. In FIG. 1, the electronic component mounting system is an electronic component mounting line configured by connecting the printing device M1, the printing inspection device M2, the electronic component mounting device M3, and the reflow device M4, all of which are devices for mounting electronic components. 1 is connected by a communication network 2 and the whole is controlled by a management computer 3. In the present embodiment, an electronic component having a plurality of external connection solder bumps formed on the lower surface is mounted on the substrate by solder bonding using the plurality of electronic component mounting apparatuses to manufacture a mounting substrate. A configuration in which the electronic component mounting apparatuses are connected by the communication network 2 without using the management computer 3 may be employed.

  The printing apparatus M1 screen-prints a solder paste for joining an electronic component on an electrode formed on the substrate to be mounted corresponding to the arrangement of the solder bumps of the electronic component. The print inspection apparatus M2 inspects the print state by recognizing the planar position of the printed solder paste by imaging the board after solder printing. The electronic component mounting apparatus M3 mounts electronic components on a substrate on which a solder paste is printed by using a mounting head. The reflow device M4 heats and melts the solder bumps and the solder paste by heating the substrate on which the electronic component is mounted, and solder-bonds the electronic component to the substrate.

  FIG. 2 shows solder printing performed in the printing apparatus M1. The printing apparatus M1 includes a screen mask 6 and a squeegee mechanism 8. Under the screen mask 6, a substrate 5 on which electronic components are mounted is positioned and held by a substrate holding unit (not shown). On the upper surface of the substrate 5, an electrode 5a to which an electronic component to be mounted is connected is provided. Above the screen mask 6, a squeegee mechanism 8 having a configuration in which two printing squeegees 9 can be moved up and down by a lifting mechanism 10 is disposed. The squeegee mechanism 8 can be horizontally moved by a horizontal movement mechanism (not shown). It has become. While the substrate 5 is in contact with the lower surface of the screen mask 6 and the solder paste 7 is supplied to the upper surface of the screen mask 6, the squeegee mechanism 8 is moved horizontally while sliding the printing squeegee 9 against the upper surface of the screen mask 6. As a result, the solder paste 7 is printed on the electrode 5a through a pattern hole (not shown) formed in the screen mask 6.

  Next, the structure of the electronic component mounting apparatus M3 will be described with reference to FIG. In FIG. 3, a transport path 12 is arranged in the X direction (substrate transport direction) at the center of the base 11. The conveyance path 12 conveys the board | substrate 5 in which an electronic component is mounted, and hold | maintains and positions the board | substrate 5 in an electronic component mounting position. Therefore, the transport path 12 is a substrate holding portion that holds and positions the substrate 5. On both sides of the conveyance path 12, a first component supply unit 13A and a second component supply unit 13B that supply electronic components are disposed.

  A plurality of tape feeders 14 are arranged in parallel in the first component supply unit 13A. The tape feeder 14 pitches a tape holding electronic components such as terminal-type chip components, and supplies these electronic components to a pickup position of a mounting head described below. Two tray feeders 15 are arranged in parallel in the second component supply unit 13B, and the two tray feeders 15 supply different types of electronic components 16 to the pickup position of the mounting head in a grid arrangement. The electronic component 16 includes a semiconductor package in which a semiconductor element is mounted on a thin resin substrate such as a BGA, a small bumped component, and the like. In the present embodiment, the electronic component 16 is intended to be connected to a substrate by a plurality of solder bumps formed on the lower surface, such as the above-described semiconductor package.

  A Y-axis table 17A and a Y-axis guide 17B are disposed at both ends of the base 11 in the X direction, and an X-axis table 18 is installed on the Y-axis table 17A and the Y-axis guide 17B. Further, a mounting head 19 is mounted on the X-axis table 18. The mounting head 19 is a multiple mounting head having a plurality of unit mounting heads 20 and moves integrally with the substrate recognition camera 21.

  By driving the X-axis table 18 and the Y-axis table 17A, the mounting head 19 moves in the XY direction, and electronic components are picked up from the first component supply unit 13A and the second component supply unit 13B by the suction nozzle of the unit mounting head 20. It is taken out by 20a (see FIG. 9) and transferred and mounted on the substrate 5 positioned and held on the transport path 12. The X-axis table 18 and the Y-axis table 17A constitute a head moving unit that moves the mounting head 19 between the first component supply unit 13A and the second component supply unit 13B and the conveyance path 12.

  A component recognition camera 23, a nozzle stocker 22, a paste transfer unit 24, and a component warpage measurement sensor 29 are disposed on the movement path of the mounting head 19 between the conveyance path 12 and the second component supply unit 13B. While the mounting head 19 picking up an electronic component from each component supply unit moves to the substrate 5, the mounting head 19 passes over the component recognition camera 23, thereby holding the electronic component held by the mounting head 19. Recognize

The nozzle stocker 22 stores a plurality of types of suction nozzles corresponding to the types of electronic components mounted on the substrate 5, and when the mounting head 19 accesses the nozzle stocker 22, the suction corresponding to the electronic components to be mounted is stored. A nozzle can be selected and mounted. The component warpage measurement sensor 29 is a sensor having a function of measuring the displacement in the vertical direction. As shown in FIG. 4, the component warpage measurement sensor 29 measures the electronic component 16 held by the mounting head 19 from below. By processing the data obtained by the measurement by the component warpage measuring unit 36 (FIG. 7), component warpage information indicating warpage deformation of the electronic component 16 is acquired. Accordingly, the component warpage measurement sensor 29 and the component warpage measurement unit 36 serve as a component warpage measurement unit that measures the warp deformation state of the electronic component 16 held by the mounting head 19. In the example shown here, the electronic component 16 has undergone end-up warping deformation in which both ends are displaced upward.

  The paste transfer unit 24 has a function of forming a solder paste in which a solder component is mixed with the flux into a viscous material into a thin film state on the coating surface. By lowering the electronic component held by the mounting head 19 with respect to the coating film forming surface of the paste transfer unit 24, solder paste is supplied to the plurality of solder bumps formed on the lower surface of the electronic component by transfer. . The supply of the solder paste by transfer is performed for the purpose of improving the reliability of the solder joint by adding the amount of solder when the solder bump is soldered to the electrode of the substrate 5.

  Next, the configuration of the paste transfer unit 24 provided in the electronic component mounting apparatus M3 will be described with reference to FIG. In FIG. 5, a smooth coating film forming surface 25a is provided on the upper surface of the base portion 25, and a solder paste for supplying the solder bumps 16a formed on the electronic component 16 by transfer onto the coating film forming surface 25a. 7 is formed by a film forming operation in which the solder paste 7 is extended by the squeegee 28.

  The base unit 25 is provided with a vertical movement mechanism 26 and a horizontal movement mechanism 27 that cause the squeegee 28 to perform a film forming operation, and the squeegee 28 is attached to the horizontal movement mechanism 27. The vertical movement mechanism 26, the horizontal movement mechanism 27, and the squeegee 28 are driven by a squeegee driving unit 37 (see FIG. 7). That is, by driving the horizontal movement mechanism 27, the squeegee 28 moves horizontally, and by driving the vertical movement mechanism 26, the squeegee 28 moves up and down integrally with the horizontal movement mechanism 27. Therefore, the squeegee 28 is driven by the squeegee driving unit 37 to perform a film forming operation combining horizontal movement and vertical movement on the coating film forming surface 25a. Thereby, the coating film of the solder paste 7 is formed on the coating film forming surface 25a.

  FIG. 6 shows one pattern example of the film forming operation by the squeegee 28. FIG. 6A shows a state in which the solder paste 7 is spread with an initial film thickness t1 on the upper surface of the coating film forming surface 25a by the squeegee 28 to form a coating film 7a having a uniform film thickness. Thereafter, a film forming operation for obtaining a desired film thickness distribution is started. That is, as shown in FIGS. 6B and 6C, by causing the squeegee 28 to perform a film forming operation in which the horizontal movement and the vertical movement are combined in a predetermined pattern by the vertical movement mechanism 26 and the horizontal movement mechanism 27. A film thickness changing portion 7b having a shape in which the solder paste 7 is removed in a desired cross-sectional shape is formed in a predetermined range of the coating film 7a.

In the example shown in FIG. 5D, the film thickness changing portion 7b has a film thickness distribution in which the film thickness in the central portion is t2 and the film thickness in the peripheral portion is t1, and the film forming operation of the squeegee 28 is performed. By changing the pattern, the paste transfer unit 24 can form the coating film 7a with an arbitrary film thickness distribution. In the present embodiment, the paste transfer unit 24 uses a squeegee driving unit 37 that causes the squeegee 28 to perform a film forming operation that combines horizontal movement and vertical movement on the coating film forming surface 25a. By controlling based on the measurement result, the coating film 7a for transferring a desired transfer amount of the solder paste according to the warp deformation of the electronic component 16 is formed on the plurality of solder bumps 16a. In the example shown here, by forming the film thickness changing portion 7b having the above-described shape with respect to the electronic component 16 in which the warping deformation on the end portion is generated, the solder bumps 16a located at both ends of the electronic component 16 are formed. A larger amount of solder paste 7 can be transferred.

  Next, the configuration of the control system of the electronic component mounting apparatus M3 will be described with reference to FIG. The control unit 30 is an overall control unit including a CPU, and controls the operation and processing of each unit described below. The mounting data storage unit 31 stores data necessary for controlling the mounting operation by the mounting head 19 such as mounting data. The component warp information storage unit 32 stores information related to warp deformation of the electronic component 16 obtained by processing the measurement data of the component warp measurement sensor 29 by the component warp measurement unit 36.

  The paste transfer determination unit 33 determines whether or not the paste transfer unit 24 needs to transfer the solder paste 7 based on the measurement result acquired by the component warp measurement unit, that is, the component warp information stored in the component warp information storage unit 32. Determine. This determination is performed by numerically evaluating a predetermined reference, that is, the degree to which the solder bump 16a of the electronic component 16 is displaced upward due to warpage deformation, and comparing this evaluation value with a predetermined determination threshold value. Is done. The squeegee movement data storage unit 34 performs the horizontal / vertical movement of the film forming operation performed in the paste transfer unit 24, that is, the horizontal / vertical movement of the squeegee 28 when the paste transfer determination unit 33 determines that the transfer of the solder paste is necessary. The combined operation pattern is stored.

  The head driving unit 35 drives a mounting head driving motor 19M for moving the mounting head 19. The component warpage measurement unit 36 performs a process of calculating warpage deformation of the electronic component 16 based on the measurement data acquired by the component warpage measurement sensor 29. The squeegee driving unit 37 drives a vertical direction driving motor 26M and a horizontal direction driving motor 27M which are driving sources of the vertical moving mechanism 26 and the horizontal moving mechanism 27. The control unit 30 controls the squeegee driving unit 37 based on the above-described height measurement result and the squeegee movement data stored in the squeegee movement data storage unit 34, so that a desired response corresponding to the state of warp deformation of the electronic component 16 is achieved. A coating film 7a having a film pressure distribution necessary for transferring the transfer amount of solder paste 7 to each solder bump 16a is formed.

  Next, an electronic component mounting method by the electronic component mounting system will be described with reference to each drawing along the flow of FIG. In this electronic component mounting method, the electronic component 16 having a plurality of solder bumps 16a formed on the lower surface is transferred and mounted on the substrate 5. First, in the printing apparatus M1, the solder paste 7 is printed on the board 5 to be mounted (ST1). The substrate 5 after printing is carried into the print inspection apparatus M2, where a print state inspection is performed for each electrode 5a.

  Next, the substrate 5 after the print inspection is carried into the electronic component mounting apparatus M3, where the component mounting operation for the substrate 5 is started. First, the electronic component 16 is taken out from the second component supply unit 13B. Next, the mounting head 19 holding the electronic component 16 is moved above the component warpage measurement sensor 29, and the component warpage measurement of the electronic component 16 is performed as shown in FIG. 4 (component warpage measurement step) (ST2), and the measurement result. Is stored in the component warpage information storage unit 32. The paste transfer determination unit 33 determines whether or not paste transfer is necessary (paste transfer determination step) (ST3).

  If it is determined that the warp deformation of the electronic component 16 is within the allowable range and the paste transfer is unnecessary, the process proceeds to the electronic component mounting step (ST6) and the component mounting operation is executed. If it is determined in (ST3) that paste transfer is necessary, paste transfer described below is executed. In the present embodiment, the transfer amount of paste is appropriately set for the purpose of transferring the necessary amount of solder paste 7 to the required range so that the amount of solder supplied by transferring the solder paste 7 does not become excessive or insufficient. This processing is executed prior to paste transfer (ST4).

  That is, the control unit 30 controls the squeegee driving unit 37 based on the component warp information stored in the component warp information storage unit 32, that is, the measurement result in the component warp measurement process, whereby a plurality of solder bumps 16a are attached to the electronic component 16. A coating film 7a for transferring a desired transfer amount of the solder paste 7 corresponding to the warp deformation of the electronic component is formed on the coating film forming surface 25a. In the example shown here, an appropriate amount of the solder paste 7 is additionally supplied to the electronic component 16 in the warped deformation state at the end by forming the film thickness changing portion 7b having the above-described film thickness distribution. .

  Next, a paste transfer operation is executed (ST5). First, as shown in FIG. 9A, the mounting head 19 holding the electronic component 16 is moved above the paste transfer unit 24. Next, the electronic component 16 held by the mounting head 19 is lowered with respect to the coating film forming surface 25a, and each solder bump 16a is brought into contact with the coating film 7a, whereby the solder paste 7 is transferred to the solder bump 16a (paste transfer). Process). As a result, as shown in FIG. 9C, a desired transfer amount corresponding to the state of warping deformation of the electronic component 16 is applied to the solder bumps 16a located near both ends of the electronic component 16 in the warped state at the end. The solder paste 7 is transferred.

  Next, the electronic component 16 is mounted on the substrate 5 (ST6). That is, the mounting head 19 is moved so that the unit mounting head 20 holding the electronic component 16 after the transfer of the solder paste 7 is positioned on the substrate 5 as shown in FIG. Align with the electrode 5a. Next, the electronic component 16 is lowered, and as shown in FIG. 10B, the electronic component 16 is mounted on the substrate 5 and the solder bump 16a is landed on the electrode 5a of the substrate 5 via the solder paste 7 (component). Mounting process).

  Thereafter, the substrate 5 on which the electronic component 16 is mounted is carried into the reflow apparatus M4. Then, as shown in FIG. 10C, the substrate 5 is heated to the solder melting point temperature or more together with the electronic component 16 to melt the solder components in the solder bumps 16a and the solder paste 7, whereby the electronic component 16 is mounted on the substrate 5 as shown in FIG. And soldering (reflow process) (ST7). At this time, since the solder bumps 16a located near both ends of the electronic component 16 are displaced upward due to warpage deformation of the electronic component 16, the solder paste 7 and the solder bumps printed in advance on the electrode 5a. A gap is formed between the terminal 16a and a joint failure.

  Even in such a case, in the present embodiment, since the solder paste 7 is additionally supplied to the solder bumps 16a of the electronic component 16 by transfer prior to the component mounting operation, the additionally supplied solder The paste 7 serves to connect the solder paste 7 printed in advance on the electrode 5a and the solder bump 16a. As a result, as shown in FIG. 10C, the solder component in which the solder bump 16a of the electronic component 16 is melted is integrated with the solder component in which the solder in the solder paste 7 is melted so that all the solder bumps 16a are connected to the electrode 5a. Thus, the solder joint portion 16b that electrically connects the electronic component 16 to the electrode 5a is satisfactorily formed without causing connection failure such as poor connection or insufficient bonding strength.

  That is, in the electronic component mounting method described above, whether or not the paste transfer unit 24 needs to transfer the solder paste 7 is determined based on the measurement result obtained by measuring the warp deformation of the electronic component 16 held by the mounting head 19 by the component warp measuring means. Judgment is made. As a result, it is possible to compensate for the shortage of solder amount due to warping deformation of parts as necessary, and to prevent poor bonding when mounting electronic components that are likely to warp deformation such as thin semiconductor packages by solder bonding. Can do.

INDUSTRIAL APPLICABILITY The electronic component mounting system and the electronic component mounting method according to the present invention have an effect that it is possible to prevent a bonding failure when mounting an electronic component that is likely to be warped and deformed by solder bonding. It can be used in the field of manufacturing a mounting substrate by mounting by solder bonding.

The block diagram which shows the structure of the electronic component mounting system of one embodiment of this invention Explanatory drawing of the solder printing in the electronic component mounting system of one embodiment of this invention The top view of the electronic component mounting apparatus of one embodiment of this invention Explanatory drawing of component curvature measurement in the electronic component mounting apparatus of one embodiment of this invention Structure explanatory drawing of the paste transcription | transfer unit in the electronic component mounting apparatus of one embodiment of this invention Explanatory drawing of operation | movement of the paste transcription | transfer unit in the electronic component mounting apparatus of one embodiment of this invention The block diagram which shows the structure of the control system of the electronic component mounting apparatus of one embodiment of this invention The flowchart which shows the electronic component mounting method of one embodiment of this invention Process explanatory drawing of the electronic component mounting method of one embodiment of this invention Process explanatory drawing of the electronic component mounting method of one embodiment of this invention

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Electronic component mounting line 5 Board | substrate 5a Electrode 7 Solder paste 13A 1st component supply part 13B 2nd component supply part 16 Electronic component 16a Solder bump 19 Mounting head 24 Paste transfer unit 29 Component curvature measurement sensor (component curvature measurement means)

Claims (4)

An electronic component mounting apparatus for transporting and mounting an electronic component having a plurality of solder bumps formed on the lower surface thereof,
A component supply unit for supplying the electronic component; a substrate holding unit for holding and positioning the substrate; and a mounting head for taking out the electronic component from the component supply unit and transferring and mounting it on the substrate held by the substrate holding unit; , A head moving means for moving the mounting head between the component supply unit and the substrate holding unit, and a warp deformation state of an electronic component which is disposed on a moving path of the mounting head and held by the mounting head. The component warpage measuring means and the electronic component disposed in the movement path of the mounting head and held by the mounting head are lowered with respect to the coating film formed on the coating film forming surface, thereby A paste transfer unit for supplying solder paste to the solder bumps by transfer, and transfer of the solder paste by the paste transfer unit based on the measurement result of the component warpage measuring means; Electronic component mounting apparatus characterized by comprising a determining paste transfer determination unit not.   The paste transfer unit is configured to control a squeegee driving unit that causes a squeegee to perform a film forming operation combining horizontal movement and vertical movement on the coating film forming surface based on a measurement result by the component warpage measuring unit, 2. The electronic component mounting apparatus according to claim 1, wherein a coating film for transferring a desired transfer amount of solder paste according to warp deformation of the electronic component is formed on the plurality of solder bumps. A component supply unit for supplying an electronic component, a substrate holding unit for holding and positioning the substrate, a mounting head for taking out the electronic component from the component supply unit and transferring and mounting it on the substrate held by the substrate holding unit; A head moving means for moving the mounting head between the component supply unit and the substrate holding unit, and a component for measuring a warp deformation state of an electronic component that is disposed on a moving path of the mounting head and is held by the mounting head. The plurality of warpage measuring means and the plurality of electronic components disposed on the movement path of the mounting head and lowered with respect to the coating film of the solder paste formed on the coating film forming surface are lowered. An electronic component mounting apparatus equipped with a paste transfer unit that supplies solder paste to the solder bumps by transfer is mounted on the substrate with an electronic component having a plurality of solder bumps formed on the lower surface. An electronic component mounting method for mounting and,
A step of taking out an electronic component by a mounting head from the component supply unit;
A component warpage measuring step for measuring warpage deformation of an electronic component held by the mounting head by the component warpage measuring means;
A paste transfer determination step of determining whether or not the paste transfer unit needs to transfer the solder paste based on the measurement result in the component warpage measurement step;
If it is determined in the paste transfer determination that paste transfer is necessary, the solder bump is lowered by lowering the electronic component held by the mounting head with respect to a paste transfer unit disposed in the movement path of the mounting head. A solder paste transfer process for supplying the solder paste by transfer to
An electronic component mounting method comprising: mounting the electronic component on the substrate and landing the solder bump on an electrode of the substrate via the solder paste. Prior to the solder paste transfer step, a squeegee driving unit that causes the squeegee to perform a film forming operation combining horizontal movement and vertical movement on the coating film forming surface is controlled based on the measurement result in the component warpage measurement step. 4. The electronic component mounting method according to claim 3, wherein a coating film for transferring a desired transfer amount of solder paste according to warp deformation of the electronic component is formed on the plurality of solder bumps.

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