CN219040432U - Mini Led laser repair equipment - Google Patents
Mini Led laser repair equipment Download PDFInfo
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- CN219040432U CN219040432U CN202222745336.3U CN202222745336U CN219040432U CN 219040432 U CN219040432 U CN 219040432U CN 202222745336 U CN202222745336 U CN 202222745336U CN 219040432 U CN219040432 U CN 219040432U
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- 230000008439 repair process Effects 0.000 title claims description 16
- 239000000758 substrate Substances 0.000 claims abstract description 45
- 238000003466 welding Methods 0.000 claims abstract description 42
- 230000004927 fusion Effects 0.000 claims abstract description 27
- 238000000034 method Methods 0.000 claims abstract description 8
- 230000008569 process Effects 0.000 claims abstract description 8
- 230000007246 mechanism Effects 0.000 claims description 49
- 238000012546 transfer Methods 0.000 claims description 20
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 19
- 230000000007 visual effect Effects 0.000 claims description 15
- 238000001514 detection method Methods 0.000 claims description 14
- 238000012545 processing Methods 0.000 claims description 12
- 230000009471 action Effects 0.000 claims description 10
- 238000003860 storage Methods 0.000 claims description 8
- 238000001179 sorption measurement Methods 0.000 claims description 7
- 238000007599 discharging Methods 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 6
- 230000008859 change Effects 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 4
- 238000007747 plating Methods 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 239000012943 hotmelt Substances 0.000 abstract description 2
- 230000002950 deficient Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
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Abstract
The utility model discloses Mini Led laser repairing equipment, which comprises a base, wherein the base is provided with a plurality of laser beam detectors; the base is provided with a gantry platform, a conveying line, a substrate repairing station and a chip feeding station, wherein the conveying line is used for conveying the chip display substrate along the X-axis direction; through increasing coring module and with its complex X2 axle, when laser fusion welding module hot melt unqualified chip, coring module acquires qualified chip in step, shortens whole process operating time to improve work efficiency.
Description
Technical Field
The utility model relates to the technical field of processing of Mini Led RGB chip display substrates, in particular to Mini Led laser repairing equipment.
Background
With the development of technology, the demands of consumers on the image quality and definition of display screens are further improved, more Mini LED display screens are appeared on the market, the resolution and the image display effect of the Mini LED display screens are better than those of the traditional LED screens or OLED screens, but due to the fact that the chips of the Mini LED display screens are densely distributed (RGB three-color chips form an LED chip unit), the defects of damage, welding omission, falling, short circuit, excessive brightness and the like of the RGB chips are easy to occur in the manufacturing process.
The CN216311823U discloses a Mini Led chip laser repairing device, which adopts a gantry framework to drive a welding head to repair a defective pixel chip on a Mini Led display substrate by a single shaft, the whole operation flow of the device is completed by serial connection of the gantry single shaft, qualified chips are required to be taken for welding after the defective pixel of the chip is required to be melted by laser heat, the working efficiency is lower, and the whole repairing time of the device is longer. In addition, in view of the smaller and smaller pitch between chips, further improvement in productivity is required.
Disclosure of Invention
The utility model mainly aims at: the Mini Led laser repairing device can improve working efficiency.
The technical scheme adopted by the utility model is as follows: a Mini Led laser repairing device comprises a base; the base is provided with a gantry platform, a conveying line, a substrate repairing station and a chip feeding station, wherein the conveying line is used for conveying the chip display substrate along the X-axis direction; wherein,,
the substrate repairing station is arranged below the plane of the conveying line and comprises a jacking positioning module for jacking the chip display substrate with the unqualified chip out of the conveying line, and a Y1 shaft for moving in the Y1 shaft direction to position the unqualified chip is arranged at the bottom of the jacking positioning module;
the chip feeding station comprises a wafer conveying module and a thimble module arranged below the wafer conveying module and used for ejecting qualified chips in the wafer conveying module; the wafer conveying module is internally provided with a Y2 axis for positioning and moving the wafer conveying module in the Y2 axis direction; the bottom of the thimble module is provided with an X3 axis for reciprocating along the X3 axis direction;
the gantry platform is provided with an X1 axis matched with the Y1 axis and an X2 axis matched with the X3 axis and the Y2 axis; the X1 axis is provided with a laser fusion welding module which can move along the X1 axis and is used for positioning and removing unqualified chips and welding qualified chips; the X2 axis is provided with a coring module which can move along the X2 axis and is used for sucking qualified chips from the wafer conveying module to the substrate repairing station;
the X axis, the X1 axis, the X2 axis and the X3 axis are parallel to each other, and the Y1 axis and the Y2 axis are parallel to each other.
According to the scheme, the conveying line comprises a feeding conveying line, a transferring conveying line and a discharging conveying line which are sequentially arranged along the conveying direction; the substrate repairing station is arranged below the plane where the transfer conveying line is located, and the bottom of the transfer conveying line is connected with the Y1 shaft so that the transfer conveying line can move along with the Y1 shaft together with the jacking positioning module; the wafer conveying module is arranged above the blanking conveying line, and the thimble module is arranged below the blanking conveying line.
According to the scheme, the jacking positioning module is provided with a negative pressure adsorption objective table; a support column is arranged at the hollow position on the negative pressure adsorption objective table; and/or four-side limiting is arranged on the transit conveying line.
According to the scheme, the laser fusion welding module comprises a visual positioning detection mechanism, a laser processing assembly, a suction nozzle for adsorbing chips, a tin spot module and a tin paste storage module, wherein the visual positioning detection mechanism is arranged above a conveying line; the visual positioning detection mechanism comprises a first camera for confirming the material taking position of the qualified chip and confirming whether the repaired chip is qualified or not, and a second camera for observing the fusion welding process in real time.
According to the scheme, the tin spot module comprises a tin spot needle head and a rotary driving mechanism connected with the tin spot needle head, and the rotary stroke of the rotary driving mechanism is right above the tin paste storage module to the chip to be repaired.
According to the scheme, the laser fusion welding module is fixed on the first lifting mechanism, the first lifting mechanism is in sliding connection with the X1 shaft, and the X1 shaft drives the first lifting mechanism and the laser fusion welding module on the first lifting mechanism to reciprocate along the X1 shaft;
the laser fusion welding module further comprises a height detection mechanism for detecting the plane height change of the substrate, and the height detection mechanism is connected with the control unit of the first lifting mechanism.
According to the scheme, the coring module is fixed on the second lifting mechanism, the second lifting mechanism is in sliding connection with the X2 shaft, and the second lifting mechanism and the coring module on the second lifting mechanism are driven by the X2 shaft to reciprocate along the X2 shaft;
the coring module comprises a visual positioning unit and a coring suction nozzle which are arranged above the conveying line.
According to the scheme, the laser fusion welding module is provided with the temperature sensor for collecting the temperature of the laser focus heating area, and the temperature sensor is connected with the laser processing assembly.
According to the scheme, the conveying line comprises two conveying belts which are parallel to each other and synchronously move, and the jacking positioning module and the thimble module respectively penetrate through the interval between the two conveying belts to finish jacking action.
According to the scheme, the gantry platform is further provided with a chip collecting device for collecting unqualified chips.
The utility model has the beneficial effects that:
1. through increasing coring module and the X2 axle with it, when laser fusion welding module hot melt unqualified chip, coring module acquires qualified chip from the chip material loading station in step, shortens whole process operating time to improve work efficiency.
2. Because the chip display substrate needs to move in the Y1 axis direction at the substrate repairing station, the conveying line needs to provide an avoidance space in the X axis direction, and the chip display substrate is more and more miniaturized, the transfer conveying line which moves along with the substrate repairing station along with the Y1 axis is added in the avoidance space, so that the chip display substrate with small size can be smoothly conveyed in the larger avoidance space; the wafer conveying module and the thimble die assembly are arranged above and below the blanking conveying line, so that the space is fully utilized, and the whole structure is compact.
Drawings
The utility model will be further described with reference to the accompanying drawings and examples, in which:
fig. 1 is an isometric view of the overall structure of an embodiment of the utility model.
Fig. 2 is a front view of the overall structure of an embodiment of the present utility model.
Fig. 3 is a top view of the overall structure of an embodiment of the present utility model.
Fig. 4 is an isometric view of a gantry platform according to an embodiment of the present utility model.
In the figure: 100-base; 200-gantry platform, 210-gantry X1/X2 axis, 220-laser fusion welding module, 230-coring module and 240-chip collection device; 300-feeding conveying line; 400-substrate repair station, 410-Y1 axis, 420-lifting positioning module, 430-transfer conveyor line; 500-blanking conveying lines; 600-chip loading station, 610-wafer conveying module, 620-thimble module.
Detailed Description
The present utility model will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present utility model more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the utility model.
As shown in fig. 1 to 4, the present utility model provides a Mini Led laser repair apparatus, which includes a base 100; the base 100 is provided with a gantry platform 200, a conveying line for conveying the chip display substrate along the X-axis direction, and a substrate repair station 400 and a chip loading station 600 respectively arranged along the conveying direction.
In this embodiment, the conveying line includes a feeding conveying line 300, a transferring conveying line 430 and a discharging conveying line 500 which are sequentially set along the conveying direction, and the number of the conveying lines can be set according to actual situations.
The substrate reworking station 400 is disposed below the plane of the transfer line 430, and includes a lifting positioning module 420 for lifting up the chip display substrate with the failed chip from the transfer line 430, and a Y1 axis 410 for moving in the Y1 axis direction to position the failed chip is disposed at the bottom of the lifting positioning module 420. The bottom of the transfer line 430 is fixedly connected to the jacking positioning module 420 such that the transfer line 430 can move with the jacking positioning module 420 along with the Y1 axis 410. By adding the transfer conveyor line 430 above the substrate repair station, the small-sized chip display substrate can be smoothly transferred from the feeding conveyor line 300 to the discharging conveyor line 500 through the transfer conveyor line 430; meanwhile, when the jacking positioning module 420 moves along the Y1 axis direction, the transfer conveyor line 430 moves synchronously. Optionally, an objective table, preferably a negative pressure adsorption objective table, may be disposed on the jacking positioning module 420, and the objective table is initially located below the transfer line 430, and after the chip displays the substrate in place, the jacking positioning module 420 jacks up the substrate, adsorbs the substrate, moves along the Y1 axis, and performs repair positioning together. Still further, the hollow position is provided with the support column on the objective table, reduces the deformation of chip display substrate by vacuum adsorption at the objective table. And four sides are limited on the transfer conveying line 430, so that the front, back, left and right deflection of the chip display substrate in the jacking process is reduced, and the coverage of the visual positioning visual field range is ensured.
The chip loading station 600 comprises a wafer conveying module 610 arranged above the blanking conveying line 500 and a thimble module 620 arranged below the blanking conveying line 500 and used for ejecting qualified chips in the wafer conveying module 610; the wafer conveying module 610 is provided with a Y2 axis for positioning and moving the wafer conveying module 610 in the Y2 axis direction; the bottom of the thimble module 620 is provided with an X3 axis for reciprocating along the X3 axis. Through the cooperation of X3 axle and Y2 axle, can cover the chip and show the whole breadth of base plate, thimble module 620 can move the below of specific qualified chip and push out it, makes the arbitrary position of the chip that its upper surface was arranged can all be restoreed.
The gantry platform 200 has an X1 axis coupled to the Y1 axis and an X2 axis coupled to the X3 axis and the Y2 axis, shown at 210. The X1 axis is provided with a laser welding module 220 that can move along the X1 axis and is used for positioning and removing the unqualified chips and welding the qualified chips, and the laser welding module 220 is moved to the position right above the unqualified chips by utilizing the movement of the laser welding module 220 in the X1 axis and the movement of the jacking positioning module 420 in the Y1 axis. The X2 axis is provided with a coring module 230 that can move along the X2 axis and is used for sucking qualified chips from the wafer conveying module 610 to the substrate repair station 400, and the coring module 230 is moved to the position right above a specific qualified chip for coring by utilizing the movement of the coring module 230 in the X2 axis and the movement of the wafer conveying module in the Y2 axis direction.
The X-axis, the X1-axis, the X2-axis and the X3-axis are parallel to each other, the Y1-axis and the Y2-axis are parallel to each other, and the X-axis and the Y1-axis are perpendicular to each other on a horizontal plane. Each shaft is provided with a power source by a linear motor, and the linear encoder carries out full-closed-loop position feedback to form the high-precision quick carrying shaft.
The laser fusion welding module 220 can adopt the existing structure and mainly comprises a visual positioning detection mechanism arranged above a conveying line, a laser processing assembly, a suction nozzle for adsorbing chips, a tin-dropping module and a tin paste storage module. Further, the laser welding module 220 is fixed on a first lifting mechanism, the first lifting mechanism is slidably connected with the X1 shaft, and the first lifting mechanism and the laser welding module 220 on the first lifting mechanism are driven by the X1 shaft to reciprocate along the X1 shaft. The visual positioning detection mechanism comprises at least one first camera for confirming the material taking position of the unqualified chip and confirming whether the repaired chip is qualified or not, and preferably, a second camera for observing the fusion welding process in real time. The tin spot module comprises a tin spot needle head and a rotary driving mechanism connected with the tin spot needle head, wherein the rotary stroke of the rotary driving mechanism is right above the tin paste storage module to the chip to be repaired, so that the rotary driving mechanism can rotate to the tin paste storage module to obtain tin paste with the tin spot needle head, then rotate back to perform tin spot operation on the chip to be repaired at the designated position, and the tin spot storage module are synchronously moved on an X1 axis, so that the running time of the X1 axis direction and the Y1 axis direction can be saved, and the processing efficiency is improved.
Further, the laser fusion welding module 220 further includes a height detection mechanism (which may be a laser rangefinder or a displacement sensor), where the height detection mechanism and the first lifting mechanism control the height position of the first lifting mechanism in a linkage manner) for detecting the planar height change of the substrate, and feeding back the planar height change of the substrate to the first lifting mechanism to adjust the height position of the laser focus in real time, so as to realize the automatic compensation function of the fusion welding height, so as to adapt to the deformation of the substrate.
In addition, optionally, the laser fusion welding module 220 may further include a temperature sensor for collecting the temperature of the heating area of the laser focus, and is connected with the laser processing assembly, so that the laser processing assembly can adjust the power of the laser according to the temperature collected by the temperature sensor, thereby better controlling the temperature of the heating area.
In more detail, the coring module 230 is fixed on the sliding plate of the X2 axis, and is driven by the coring module to reciprocate along the X2 axis, so as to complete related actions such as photographing, positioning, material taking and discharging. The coring module 230 includes visual positioning and chip angle correction functions. The coring module 230 includes a second lifting mechanism disposed on the X2 axis, a coring assembly disposed on the second lifting mechanism for adsorbing and acquiring qualified chips on the wafer conveying module 610, and a third camera disposed on the X2 axis, where the third camera is used for visually positioning the qualified chips of the wafer (confirming the qualified chip taking position).
Still further, the transfer chain is two belt lines that interval set up in the width direction, provides for the qualified chip on the ejecting wafer of thimble module 620 and dodges the operation space, and the setting of two belt lines that interval set up also can conveniently make the belt line that conveys width adjustable, can compatible multiple chip display substrate's overall dimension.
In addition, a chip collecting device 240 for collecting unqualified chips may be further disposed on the gantry platform.
Through the arrangement, the laser fusion welding module 220 arranged on the X1 axis of the gantry and the coring module 230 arranged on the X2 axis of the gantry are connected in parallel as cores based on three short axes (Y1 axis 410, Y2 axis 610 and X3 axis 620) on the base 100, and are matched with a parallel belt conveying line up and down, so that the actions of the whole repairing equipment (X-axis conveying of a chip display substrate, Y1 axis transfer positioning and laser processing removal, and the coring module and a thimble mechanism are flexibly and efficiently connected together after being matched with each other in the X direction to take materials. The whole equipment is light and handy, the action flow is tightly connected, and the operation is flexible and simple.
The working process comprises the following steps:
in the production process, qualified chips are required to be placed in the wafer clamping ring on the wafer conveying module 610 manually in advance, the chip display substrate (the chips with matrix arrangement are welded on the upper surface) is manually fed or automatically discharged through a feeding process, and after the chip display substrate reaches the transfer conveying line 430 through the feeding conveying line 300, the jacking positioning module 420 performs jacking positioning and clamping adsorption. At this time, the laser welding module 220 performs photographing positioning after being transported in place via the X1 axis. After determining the position of the defective pixel chip, the laser welding module 210 aligns the laser center of the chip and performs laser processing, so that the solder at the bottom of the chip is melted, and finally the defective pixel chip is sucked and recovered. And then the laser fusion welding module 220 performs shooting and positioning on the bonding pad at the position of the bad point chip by using a visual camera, and finishes the action of the bonding pad to count tin.
In synchronization, the coring module 230 photographs and positions the positioned chip of the wafer conveying module 610, the X2 axis, the Y2 axis and the X3 axis are matched, moved and aligned, and the three (the thimble of the thimble lifting module 620, the chip of the wafer conveying module 610 and the suction nozzle of the coring module 230) are aligned in the Z direction (vertical direction) to Ji Lian, so that the suction nozzle can take out qualified chips.
After the laser fusion welding module 220 finishes the tin-plating action, the X2 axis synchronously conveys the qualified chips sucked by the coring module 230 to the position above the defective point chips of the substrate adsorbed by the substrate repairing station 400, the suction nozzle slightly presses the qualified chips on the solder paste to finish the feeding action, the coring module 230 moves away, the laser fusion welding module 220 heats and welds, and after the visual inspection on the laser fusion welding module 220 is qualified, the qualified chips are conveyed to the blanking conveying line 500 by the transit conveying line 430 to be conveyed and blanked.
According to the utility model, under multi-axis coordination, the X1/X2 axes of the gantry platform are respectively and synchronously connected in parallel to finish the main core station actions of the equipment (including visual positioning, hot melting chip dead spots, tin dipping, qualified chip taking and the like), and finally, the discharging and hot welding chips are combined to finish, so that the space of the equipment is effectively utilized, the internal structure of the equipment is compact, the parallel actions are improved, the core removing and core welding effects are observed in real time by adding coaxial vision, and the laser processing precision and the chip repairing effect are improved.
It will be understood that modifications and variations will be apparent to those skilled in the art from the foregoing description, and it is intended that all such modifications and variations be included within the scope of the following claims.
Claims (10)
1. The MiniLed laser repairing device is characterized by comprising a base; the base is provided with a gantry platform, a conveying line, a substrate repairing station and a chip feeding station, wherein the conveying line is used for conveying the chip display substrate along the X-axis direction; wherein,,
the substrate repairing station is arranged below the plane of the conveying line and comprises a jacking positioning module for jacking the chip display substrate with the unqualified chip out of the conveying line, and a Y1 shaft for moving in the Y1 shaft direction to position the unqualified chip is arranged at the bottom of the jacking positioning module;
the chip feeding station comprises a wafer conveying module and a thimble module arranged below the wafer conveying module and used for ejecting qualified chips in the wafer conveying module; the wafer conveying module is internally provided with a Y2 axis for positioning and moving the wafer conveying module in the Y2 axis direction; the bottom of the thimble module is provided with an X3 axis for reciprocating along the X3 axis direction;
the gantry platform is provided with an X1 axis matched with the Y1 axis and an X2 axis matched with the X3 axis and the Y2 axis; the X1 axis is provided with a laser fusion welding module which can move along the X1 axis and is used for positioning and removing unqualified chips and welding qualified chips; the X2 axis is provided with a coring module which can move along the X2 axis and is used for sucking qualified chips from the wafer conveying module to the substrate repairing station;
the X axis, the X1 axis, the X2 axis and the X3 axis are parallel to each other, and the Y1 axis and the Y2 axis are parallel to each other.
2. The MiniLed laser repair device of claim 1, wherein the conveying line comprises a feeding conveying line, a transferring conveying line and a discharging conveying line which are sequentially arranged along the conveying direction; the substrate repairing station is arranged below the plane where the transfer conveying line is located, and the bottom of the transfer conveying line is connected with the Y1 shaft so that the transfer conveying line can move along with the Y1 shaft together with the jacking positioning module; the wafer conveying module is arranged above the blanking conveying line, and the thimble module is arranged below the blanking conveying line.
3. The MiniLed laser repairing device according to claim 2, wherein the jacking positioning module is provided with a negative pressure adsorption object stage; a support column is arranged at the hollow position on the negative pressure adsorption objective table; and/or four-side limiting is arranged on the transit conveying line.
4. The MiniLed laser repair device of claim 1, wherein the laser fusion welding module comprises a visual positioning detection mechanism, a laser processing assembly, a suction nozzle for adsorbing chips, a tin-dispensing module and a solder paste storage module, wherein the visual positioning detection mechanism is arranged above a conveying line; the visual positioning detection mechanism comprises a first camera for confirming the material taking position of the qualified chip and confirming whether the repaired chip is qualified or not, and a second camera for observing the fusion welding process in real time.
5. The MiniLed laser repairing device according to claim 4, wherein the tin-plating module comprises a tin-plating needle head and a rotary driving mechanism connected with the tin-plating needle head, and the rotary stroke of the rotary driving mechanism is right above the tin paste storage module to the chip to be repaired.
6. The MiniLed laser repair device of claim 4, wherein the laser fusion welding module is fixed on a first lifting mechanism, the first lifting mechanism is in sliding connection with the X1 shaft, and the first lifting mechanism is driven by the X1 shaft and the laser fusion welding module on the first lifting mechanism moves back and forth along the X1 shaft;
the laser fusion welding module further comprises a height detection mechanism for detecting the plane height change of the substrate, and the height detection mechanism is connected with the control unit of the first lifting mechanism.
7. The MiniLed laser repair apparatus according to any one of claims 4 to 6, wherein a temperature sensor for collecting a temperature of a laser focal point heating region is provided in the laser fusion welding module, and is connected to the laser processing assembly.
8. The MiniLed laser repair apparatus of claim 1, wherein the coring module is fixed on a second lifting mechanism, the second lifting mechanism is slidably connected with the X2 axis, and the second lifting mechanism and the coring module on the second lifting mechanism are driven by the X2 axis to reciprocate along the X2 axis; the coring module comprises a visual positioning unit and a coring suction nozzle which are arranged above the conveying line.
9. The MiniLed laser repair device according to claim 1 or 2, wherein the conveying line comprises two conveying belts which are parallel to each other and synchronously move, and the jacking positioning module and the thimble module respectively pass through the interval between the two conveying belts to complete the jacking action.
10. The Mini Led laser repair apparatus of claim 1, wherein the gantry platform further comprises a chip collection device for collecting failed chips.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222745336.3U CN219040432U (en) | 2022-10-18 | 2022-10-18 | Mini Led laser repair equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222745336.3U CN219040432U (en) | 2022-10-18 | 2022-10-18 | Mini Led laser repair equipment |
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| Publication Number | Publication Date |
|---|---|
| CN219040432U true CN219040432U (en) | 2023-05-16 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222745336.3U Active CN219040432U (en) | 2022-10-18 | 2022-10-18 | Mini Led laser repair equipment |
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| CN (1) | CN219040432U (en) |
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- 2022-10-18 CN CN202222745336.3U patent/CN219040432U/en active Active
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Address after: No. 88 Jiulonghu Street, Donghu New Technology Development Zone, Wuhan City, Hubei Province, 430000 Patentee after: WUHAN DR LASER TECHNOLOGY Co.,Ltd. Address before: No. 5, Huashiyuan Second Road, Optical Valley Industrial Park, Donghu Development Zone, Wuhan City, 430,000 Hubei Province Patentee before: WUHAN DR LASER TECHNOLOGY Co.,Ltd. |