CN216177578U - Full-automatic huge grain welding equipment - Google Patents
Full-automatic huge grain welding equipment Download PDFInfo
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- CN216177578U CN216177578U CN202122394235.1U CN202122394235U CN216177578U CN 216177578 U CN216177578 U CN 216177578U CN 202122394235 U CN202122394235 U CN 202122394235U CN 216177578 U CN216177578 U CN 216177578U
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Abstract
The utility model discloses full-automatic large-scale crystal grain welding equipment which comprises a rack, a control box, an XYZ-axis moving module, a PCB (printed circuit board) carrying platform, a glass carrying platform, a CCD (charge coupled device) detection device, a laser device and a material taking device, wherein the XYZ-axis moving module is arranged on the rack; this PCB microscope carrier rotationally sets up on XYZ axle removes the module, and the glass microscope carrier can set up in the frame from top to bottom and rotatoryly, and this CCD detection device and laser device set up in the top of glass microscope carrier, and this extracting device sets up in the side of glass microscope carrier. Through setting up the glass microscope carrier in the top of PCB microscope carrier, CCD detection device and laser device are in the top of glass microscope carrier, extracting device is beside the side of glass microscope carrier, the cooperation sets up the control box and connects and control XYZ axle moving module, a drive mechanism, the mobile device, CCD detection device, laser device and extracting device, can carry out the rapid welding to a large amount of crystalline grains, the mechanical equipment full automatization, extracting device can automatic feeding, do not need the manual work cooperation operation, reduce the cost of labor, satisfy current requirement, bring facility for production.
Description
Technical Field
The utility model relates to the technical field of crystal grain welding equipment, in particular to full-automatic large-scale crystal grain welding equipment.
Background
In the prior art, welding equipment generally welds a single crystal grain, however, when a large number of crystal grains need to be welded, the welding speed is obviously slow, manual matching operation is also needed, the labor cost is increased, the existing requirements cannot be met, and inconvenience is brought to production. Therefore, it is necessary to develop a method for solving the above problems.
SUMMERY OF THE UTILITY MODEL
In view of the above, the present invention is directed to a method for automatically welding a large number of dies, which can effectively solve the problems of the conventional welding apparatus that the welding speed is slow and the labor cost is increased due to manual work.
In order to achieve the purpose, the utility model adopts the following technical scheme:
a full-automatic large-scale crystal grain welding device comprises a rack, a control box, an XYZ-axis moving module, a PCB (printed Circuit Board) carrying platform, a glass carrying platform, a CCD (charge coupled device) detection device, a laser device and a material taking device; the control box is arranged on the frame; the XYZ axis moving module is arranged on the frame and connected with the control box; the PCB carrying platform is rotatably arranged on the XYZ axis moving module and is driven to rotate by a first driving mechanism, and the first driving mechanism is connected with the control box; the glass carrying platform is arranged on the frame in a manner of being capable of vertically and rotatably through a moving device, the glass carrying platform is positioned above the PCB carrying platform, and the moving device is connected with the control box; the CCD detection device is arranged on the frame and positioned above the glass carrier, and the CCD detection device is connected with the control box; the laser device is arranged on the frame and positioned above the glass carrier, and the laser device is connected with the control box; the material taking device is arranged on the rack and located beside the glass carrying platform, and the material taking device is connected with the control box.
As a preferable scheme, the rack comprises a workbench and a portal frame arranged on the workbench, the XYZ shaft movement module is located on the workbench, and the movement device, the CCD detection device and the laser device are all arranged on the portal frame.
As a preferred scheme, the moving device comprises a lifting seat, a second driving mechanism and a third driving mechanism, the lifting seat can be movably arranged on the portal frame up and down, the second driving mechanism is arranged on the portal frame and drives the lifting seat to move up and down, the glass carrying platform can be rotatably arranged on the lifting seat, the third driving mechanism is arranged on the lifting seat and drives the glass carrying platform to rotate back and forth, and the second driving mechanism and the third driving mechanism are both connected with the control box.
Preferably, the second driving mechanism and the third driving mechanism are both servo motor driving mechanisms.
As a preferred scheme, the laser device comprises a host, a sucker and a fourth driving mechanism, wherein the sucker is fixedly connected below the host, the sucker is used for sucking vacuum to adsorb glass, the host and the sucker can be transversely movably arranged on the portal frame back and forth, the fourth driving mechanism is arranged on the portal frame and drives the host and the sucker to transversely move back and forth, and the host and the fourth driving mechanism are both connected with a control box.
Preferably, the fourth driving mechanism is a servomotor driving mechanism.
As a preferred scheme, the PCB carrying platform is made of ceramic materials.
Preferably, the first drive mechanism is a DD motor.
As a preferred scheme, the material taking device comprises a sliding seat, a transverse driving mechanism, a vertical driving mechanism, a rotary driving mechanism and a glass clamp, wherein the sliding seat can be transversely movably arranged beside a rack in a back-and-forth mode, the transverse driving mechanism is arranged on the rack and drives the sliding seat to transversely move in a back-and-forth mode, the transverse driving mechanism is connected with a control box, the vertical driving mechanism is arranged on the sliding seat and moves in a back-and-forth mode along with the sliding seat, the vertical driving mechanism is connected with the control box, the rotary driving mechanism is arranged on the vertical driving mechanism and is driven by the vertical driving mechanism to vertically move in a back-and-forth mode, the rotary driving mechanism is connected with the control box, and the glass clamp is arranged on the rotary driving mechanism and is driven by the rotary driving mechanism to turn over in a back-and-forth mode.
As a preferred scheme, the transverse driving mechanism is in a structural mode that a servo motor drives a screw rod, the vertical driving mechanism is a jacking cylinder, and the rotary driving mechanism is a rotary cylinder.
Compared with the prior art, the utility model has obvious advantages and beneficial effects, and specifically, the technical scheme includes that:
through setting up the glass microscope carrier in the top of PCB microscope carrier, CCD detection device and laser device are in the top of glass microscope carrier, extracting device is beside the side of glass microscope carrier, the cooperation sets up the control box and connects and control XYZ axle moving module, a drive mechanism, the mobile device, CCD detection device, laser device and extracting device, can carry out the rapid welding to a large amount of crystalline grains, the mechanical equipment full automatization, extracting device can automatic feeding, do not need the manual work cooperation operation, reduce the cost of labor, satisfy current requirement, bring facility for production.
To more clearly illustrate the structural features and effects of the present invention, the present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.
Drawings
FIG. 1 is an assembled perspective view of the preferred embodiment of the present invention;
FIG. 2 is an assembled perspective view of another angle of the preferred embodiment of the present invention;
FIG. 3 is a front view of the preferred embodiment of the present invention;
FIG. 4 is a top view of the preferred embodiment of the present invention;
fig. 5 is an enlarged schematic view at a position a in fig. 1.
Fig. 6 is an enlarged schematic view at the position B in fig. 2.
The attached drawings indicate the following:
10. frame 11, workstation
12. Portal frame 20 and XYZ-axis moving module
30. PCB (printed Circuit Board) carrying platform 40 and glass carrying platform
50. CCD detection device 60 and laser device
61. Main unit 62 and fourth drive mechanism
70. Reclaiming device 71, slide
72. Horizontal driving mechanism 73 and vertical driving mechanism
74. Rotary drive mechanism 75 and glass jig
80. Moving device 81 and lifting seat
82. A second driving mechanism 83 and a third driving mechanism.
Detailed Description
Referring to fig. 1 to 5, a specific structure of a preferred embodiment of the present invention is shown, which includes a frame 10, a control box (not shown), an XYZ axes movement module 20, a PCB stage 30, a glass stage 40, a CCD detection device 50, a laser device 60, and a material fetching device 70.
The rack 10 includes a working table 11 and a portal frame 12 disposed on the working table 11, and the control box is disposed on the rack 10.
The XYZ-axis movement module 20 is disposed on the frame 10 and connected to the control box; in the present embodiment, the XYZ shaft transfer module 20 is located on the stage 11, and the specific structure and operation principle of the XYZ shaft transfer module 20 are the prior art, and the specific structure and operation principle of the XYZ shaft transfer module 20 will not be described in detail herein.
The PCB carrying platform 30 is rotatably disposed on the XYZ shaft movement module 20, the PCB carrying platform 30 is driven to rotate by a first driving mechanism (not shown), the first driving mechanism is connected to the control box, and the PCB carrying platform 30 is used for carrying a PCB; in this embodiment, the PCB stage 30 is made of ceramic, and the first driving mechanism is a DD motor.
The glass carrier 40 is arranged on the frame 10 in a way that the glass carrier 40 can move up and down and rotate through a moving device 80, the glass carrier 40 is positioned above the PCB carrier 30, the moving device 80 is connected with the control box, and the glass carrier 40 is used for carrying glass; in this embodiment, the moving device 80 is disposed on the gantry 12, the moving device 80 includes a lifting base 81, a second driving mechanism 82 and a third driving mechanism 83, the lifting base 81 can be disposed on the gantry 12 in a vertically movable manner, the second driving mechanism 82 is disposed on the gantry 12 and drives the lifting base 81 to move vertically, the glass stage 40 is rotatably disposed on the lifting base 81, the third driving mechanism 83 is disposed on the lifting base 81 and drives the glass stage 40 to rotate back and forth, the second driving mechanism 82 and the third driving mechanism 83 are both servo motor driving mechanisms, and the second driving mechanism 82 and the third driving mechanism 83 are both connected to the control box.
The CCD detection device 50 is arranged on the frame 10 and is positioned above the glass carrier 40, and the CCD detection device 50 is connected with the control box; in this embodiment, the CCD detection device 50 is located on the gantry 12.
The laser device 60 is arranged on the frame 10 and is positioned above the glass carrier 40, and the laser device 60 is connected with the control box; in this embodiment, the laser device 60 is located on the gantry 12, the laser device 60 includes a host 61, a suction cup (not shown) and a fourth driving mechanism 62, the suction cup is connected and fixed below the host 61, the suction cup is used for sucking vacuum to adsorb glass, the host 61 and the suction cup can be transversely movably disposed on the gantry 12 back and forth, the fourth driving mechanism 62 is disposed on the gantry 12 and drives the host 61 and the suction cup to transversely move back and forth, the host 61 and the fourth driving mechanism 62 are both connected to the control box, and the fourth driving mechanism 62 is a servo motor driving mechanism.
The material taking device 70 is arranged on the frame 10 and is positioned beside the glass carrier 40, and the material taking device 70 is connected with the control box; in this embodiment, the material taking device 70 includes a sliding seat 71, a horizontal driving mechanism 72, a vertical driving mechanism 73, a rotary driving mechanism 74 and a glass clamp 75, the sliding seat 71 can be transversely and reciprocally disposed beside the rack 10, the horizontal driving mechanism 72 is disposed on the rack 10 and drives the sliding seat 71 to transversely and reciprocally move, the horizontal driving mechanism 72 is connected to a control box, the vertical driving mechanism 73 is disposed on the sliding seat 71 and transversely and reciprocally moves with the sliding seat 71, the vertical driving mechanism 73 is connected to the control box, the rotary driving mechanism 74 is disposed on the vertical driving mechanism 73 and is driven by the vertical driving mechanism 73 to vertically and reciprocally move, the rotary driving mechanism 74 is connected to the control box, the glass clamp 75 is used for clamping glass, the glass clamp 75 is disposed on the rotary driving mechanism 74 and is driven by the rotary driving mechanism 74 to reciprocally turn, and the horizontal driving mechanism 72 is driven by a servo motor, the vertical driving mechanism 73 is a jacking cylinder, and the rotary driving mechanism 74 is a rotary cylinder.
Detailed description the working principle of the present embodiment is as follows:
starting the equipment, clamping the glass by the glass clamp 75, jacking the glass by the vertical driving mechanism 73, turning the glass by the rotary driving mechanism 74 and placing the glass on the glass carrying platform 40; then, the CCD detecting device 50 takes a picture of the positioning point by the camera, and confirms the position of the glass plate; then, the second driving mechanism 82 drives the glass to descend, the third driving mechanism 83 drives the glass to rotate, the glass rotates to the position below the laser device 60, the second driving mechanism 82 drives the glass to ascend, so that the glass is attached to the surface of a sucking disc, and the sucking disc sucks the glass in a vacuum manner; then, the PCB is placed on the PCB carrier 30, the PCB carrier 30 adjusts the position of the PCB by the movement of the XYZ shaft movement module 20 and the rotation of the first driving mechanism, and when the PCB is aligned, the PCB and the glass are pressed together by the jacking of the Z shaft movement module in the XYZ shaft movement module 20; finally, the laser device 60 is moved over the glass and PCB by the fourth drive mechanism 62, and the laser device 60 is activated and laser welds the dies on the glass to the PCB.
The design of the utility model is characterized in that:
through setting up the glass microscope carrier in the top of PCB microscope carrier, CCD detection device and laser device are in the top of glass microscope carrier, extracting device is beside the side of glass microscope carrier, the cooperation sets up the control box and connects and control XYZ axle moving module, a drive mechanism, the mobile device, CCD detection device, laser device and extracting device, can carry out the rapid welding to a large amount of crystalline grains, the mechanical equipment full automatization, extracting device can automatic feeding, do not need the manual work cooperation operation, reduce the cost of labor, satisfy current requirement, bring facility for production.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the technical scope of the present invention, so that any minor modifications, equivalent changes and modifications made to the above embodiment according to the technical spirit of the present invention are within the technical scope of the present invention.
Claims (10)
1. A full-automatic huge grain welding equipment is characterized in that: the device comprises a rack, a control box, an XYZ-axis moving module, a PCB (printed Circuit Board) carrying platform, a glass carrying platform, a CCD (charge coupled device) detecting device, a laser device and a material taking device; the control box is arranged on the frame; the XYZ axis moving module is arranged on the frame and connected with the control box; the PCB carrying platform is rotatably arranged on the XYZ axis moving module and is driven to rotate by a first driving mechanism, and the first driving mechanism is connected with the control box; the glass carrying platform is arranged on the frame in a manner of being capable of vertically and rotatably through a moving device, the glass carrying platform is positioned above the PCB carrying platform, and the moving device is connected with the control box; the CCD detection device is arranged on the frame and positioned above the glass carrier, and the CCD detection device is connected with the control box; the laser device is arranged on the frame and positioned above the glass carrier, and the laser device is connected with the control box; the material taking device is arranged on the rack and located beside the glass carrying platform, and the material taking device is connected with the control box.
2. The fully automated macro die bonding apparatus according to claim 1, wherein: the frame is including workstation and the portal frame of setting on the workstation, and this XYZ axle moving module is located the workstation, and mobile device, CCD detection device and laser device all set up on the portal frame.
3. The fully automated macro die bonding apparatus according to claim 2, wherein: the moving device comprises a lifting seat, a second driving mechanism and a third driving mechanism, the lifting seat can be movably arranged on the portal frame up and down, the second driving mechanism is arranged on the portal frame and drives the lifting seat to move up and down, the glass carrying platform can be rotatably arranged on the lifting seat, the third driving mechanism is arranged on the lifting seat and drives the glass carrying platform to rotate back and forth, and the second driving mechanism and the third driving mechanism are both connected with the control box.
4. The fully automated macro die bonding apparatus according to claim 3, wherein: and the second driving mechanism and the third driving mechanism are both servo motor driving mechanisms.
5. The fully automated macro die bonding apparatus according to claim 2, wherein: the laser device comprises a host, a sucker and a fourth driving mechanism, wherein the sucker is connected and fixed below the host, the sucker is used for sucking vacuum to adsorb glass, the host and the sucker can be transversely movably arranged on the portal frame back and forth, the fourth driving mechanism is arranged on the portal frame and drives the host and the sucker to transversely move back and forth, and the host and the fourth driving mechanism are both connected with a control box.
6. The fully automated macro die bonding apparatus according to claim 5, wherein: the fourth driving mechanism is a servo motor driving mechanism.
7. The fully automated macro die bonding apparatus according to claim 1, wherein: the PCB carrying platform is made of ceramic materials.
8. The fully automated macro die bonding apparatus according to claim 1, wherein: the first drive mechanism is a DD motor.
9. The fully automated macro die bonding apparatus according to claim 1, wherein: the material taking device comprises a sliding seat, a transverse driving mechanism, a vertical driving mechanism, a rotary driving mechanism and a glass clamp, wherein the sliding seat can be transversely movably arranged beside a rack in a back-and-forth mode, the transverse driving mechanism is arranged on the rack and drives the sliding seat to transversely move in the back-and-forth mode, the transverse driving mechanism is connected with a control box, the vertical driving mechanism is arranged on the sliding seat and transversely moves in the back-and-forth mode along with the sliding seat, the vertical driving mechanism is connected with the control box, the rotary driving mechanism is arranged on the vertical driving mechanism and driven by the vertical driving mechanism to vertically move in the back-and-forth mode, the rotary driving mechanism is connected with the control box, and the glass clamp is arranged on the rotary driving mechanism and driven by the rotary driving mechanism to turn over in the back-and forth mode.
10. The fully automated macro die bonding apparatus according to claim 9, wherein: the horizontal driving mechanism is in a structural mode that a servo motor drives a screw rod, the vertical driving mechanism is a jacking cylinder, and the rotary driving mechanism is a rotary cylinder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122394235.1U CN216177578U (en) | 2021-09-30 | 2021-09-30 | Full-automatic huge grain welding equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122394235.1U CN216177578U (en) | 2021-09-30 | 2021-09-30 | Full-automatic huge grain welding equipment |
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| Publication Number | Publication Date |
|---|---|
| CN216177578U true CN216177578U (en) | 2022-04-05 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122394235.1U Active CN216177578U (en) | 2021-09-30 | 2021-09-30 | Full-automatic huge grain welding equipment |
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| CN (1) | CN216177578U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114799689A (en) * | 2022-04-29 | 2022-07-29 | 中国科学院西安光学精密机械研究所 | Microsphere adsorption positioning device and method for laser processing |
-
2021
- 2021-09-30 CN CN202122394235.1U patent/CN216177578U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114799689A (en) * | 2022-04-29 | 2022-07-29 | 中国科学院西安光学精密机械研究所 | Microsphere adsorption positioning device and method for laser processing |
| CN114799689B (en) * | 2022-04-29 | 2023-02-14 | 中国科学院西安光学精密机械研究所 | Microsphere adsorption positioning device and method for laser processing |
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