CN213343224U - Rotary disc type selective wave soldering device - Google Patents
Rotary disc type selective wave soldering device Download PDFInfo
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- CN213343224U CN213343224U CN202021513195.7U CN202021513195U CN213343224U CN 213343224 U CN213343224 U CN 213343224U CN 202021513195 U CN202021513195 U CN 202021513195U CN 213343224 U CN213343224 U CN 213343224U
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- lifting
- linear module
- soldering
- axis linear
- wave soldering
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Abstract
The utility model belongs to the technical field of automation equipment, in particular to a rotary disc type selective wave soldering device, which comprises a frame, wherein a rotary disc, a feeding mechanism for grabbing materials, a wave soldering mechanism for processing the materials and a soldering flux spraying mechanism are arranged on the frame; the rotary table is provided with a plurality of jigs for fixing materials, the jigs are distributed along the circumference of the rotary axis of the rotary table, and the feeding mechanism, the soldering flux spraying mechanism and the wave soldering mechanism are sequentially arranged along the circumferential direction of the rotary table so as to be used for sequentially spraying soldering flux and soldering tin on the materials; this selective wave-soldering device of carousel formula production efficiency is high, improves space utilization, and the carousel carries out the circumference to the material and carries, and the location is accurate, and space utilization is high, stable in structure, and machining efficiency is high.
Description
Technical Field
The utility model belongs to the technical field of automation equipment, especially, relate to a carousel formula selectivity wave-soldering device.
Background
Wave soldering is to make a molten solder jet flow into a solder wave meeting the design requirements through an electric pump or an electromagnetic pump, so that a circuit board which is pre-provided with electronic components passes through the solder wave, the mechanical and electrical connection between the soldering end or pins of the components and the bonding pads of the circuit board is realized, the electronic components at the bottom end can be covered by standard wave equipment to prevent bending, and the width of a production line can be standardized; but the current peak welding device adopts the conveying of chain conveyor, and this transport mode occupation space is big, and conveying efficiency is low, and positioning accuracy is low, influences the quality of product.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a carousel formula selectivity wave-soldering device aims at solving the technical problem that carousel formula selectivity wave-soldering device positioning accuracy among the prior art is low.
In order to achieve the above object, an embodiment of the present invention provides a rotary table type selective wave soldering device, which includes a frame, wherein the frame is provided with a rotary table, a feeding mechanism for grabbing materials, a wave soldering mechanism for processing materials, and a flux spraying mechanism; the rotary table is provided with a plurality of jigs for fixing materials, the jigs are circumferentially distributed along the rotary axis of the rotary table, and the feeding mechanism, the soldering flux spraying mechanism and the wave soldering mechanism are sequentially arranged along the circumferential direction of the rotary table so as to be used for sequentially spraying soldering flux on the materials and soldering tin on the materials.
Optionally, the flux spraying mechanism comprises a flux spraying machine and a second moving mechanism, the second moving mechanism is connected to the frame, and the flux spraying machine is connected to an output end of the second moving mechanism.
Optionally, the second moving mechanism includes a second X-axis linear module and a second Y-axis linear module, the second X-axis linear module is connected to the frame, the second Y-axis linear module is connected to the output end of the second X-axis linear module, and the flux spraying machine is connected to the output end of the second Y-axis linear module.
Optionally, a turntable driving mechanism is further arranged on the rack, and the turntable driving mechanism is connected with the turntable and used for driving the turntable to rotate.
Optionally, the feeding mechanism comprises a feeding support, a feeding linear module, a grabbing cylinder and a grabbing sucker; the feeding support is connected to the rack, the feeding linear module is connected to the feeding support and arranged above the rotary table, the grabbing cylinder is connected to the sliding block of the feeding linear module, and the grabbing sucker is connected to the piston rod of the grabbing cylinder to absorb materials.
Optionally, the wave soldering mechanism comprises a wave soldering machine and a first moving mechanism; the first moving mechanism is connected to the rack, and the first moving mechanism is connected with the wave crest welder and used for driving the wave crest welder to move.
Optionally, the first moving mechanism includes a first X-axis linear module and a first Y-axis linear module, the first X-axis linear module is connected to the rack, the first Y-axis linear module is connected to the output end of the first X-axis linear module, and the wave soldering machine is connected to the output end of the first Y-axis linear module.
Optionally, the wave soldering mechanism further comprises a lifting mechanism, and the lifting mechanism is arranged on the lower side or the upper side of the first moving mechanism and used for driving the first moving mechanism to move up and down.
Optionally, the lifting mechanism comprises a lifting fixed platform, a lifting motor, a lifting screw rod, a screw rod nut and a lifting moving platform; the lifting fixed station is connected to the rack, the lifting moving station is connected with the lifting fixed station in a sliding mode, the lead screw nut is connected to the lifting moving station, the lifting lead screw is in threaded connection with the lead screw nut, the lifting motor is connected to the lifting fixed station and connected with the lifting lead screw to be used for driving the lifting lead screw to rotate, and the first moving mechanism is arranged on the lifting moving station.
Optionally, the rotating disc type selective wave soldering device further comprises a discharging mechanism; the feeding mechanism, the wave soldering mechanism, the soldering flux spraying mechanism and the discharging mechanism are sequentially arranged along the circumferential direction of the rotary disc and are used for sequentially carrying out soldering flux spraying treatment and soldering tin treatment on the materials.
The embodiment of the utility model provides an above-mentioned one or more technical scheme in the carousel formula selectivity wave-soldering device have one of following technological effect at least: feeding mechanism presss from both sides the material (PCB board) and gets on the tool of carousel, the carousel rotates and carries the material to spouting scaling powder mechanism department, the carousel stall, spout scaling powder mechanism on with scaling powder spraying material, treat that the spraying process is handled the completion back, the carousel continues to rotate and carry the material to wave-soldering mechanism department, wave-soldering mechanism carries out soldering tin to the material and handles, carry out the soldering tin process, this carousel formula selectivity wave-soldering device production efficiency is high, improve space utilization, for the mode of using the straight line to carry processing among the prior art, the utility model discloses a carousel carries out the circumference to the material and carries, and the location is accurate, and space utilization is high, stable in structure, machining efficiency is high.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the embodiments or the prior art descriptions will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without inventive labor.
Fig. 1 is a schematic structural diagram of a rotary table type selective wave soldering device provided by the embodiment of the present invention.
Fig. 2 is a schematic structural diagram of a turntable according to an embodiment of the present invention.
Fig. 3 is a schematic structural diagram of a feeding linear module according to an embodiment of the present invention.
Fig. 4 is a schematic structural diagram of a wave soldering mechanism provided by an embodiment of the present invention.
Fig. 5 is a schematic structural diagram of a lifting mechanism according to an embodiment of the present invention.
Fig. 6 is a schematic structural view of a flux spraying mechanism according to an embodiment of the present invention.
Wherein, in the figures, the respective reference numerals:
10-a rack, 20-a turntable, 21-a jig, 22-a turntable driving mechanism, 30-a feeding mechanism, 31-a feeding support, 32-a feeding linear module, 33-a grabbing cylinder, 34-a grabbing sucker, 40-a wave soldering mechanism, 41-a wave soldering machine, 42-a first moving mechanism, 43-a lifting mechanism, 50-a soldering flux spraying mechanism, 51-a soldering flux spraying machine, 52-a second moving mechanism, 420-a first X-axis linear module, 421-a first Y-axis linear module, 430-a lifting fixed table, 431-a lifting motor, 432-a lifting screw rod, 433-a screw rod nut, 434-a lifting moving table, 520-a second X-axis linear module and 521-a second Y-axis linear module.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to fig. 1-6 are exemplary and intended to be used to illustrate embodiments of the present invention, and should not be construed as limiting the invention.
In the description of the embodiments of the present invention, it should be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in the orientation or positional relationship indicated in the drawings, which is only for convenience in describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the device or element so indicated must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the embodiments of the present invention, "a plurality" means two or more unless specifically limited otherwise.
In the embodiments of the present invention, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly, e.g., as fixed or detachable connections or as an integral part; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the embodiments of the present invention can be understood by those skilled in the art according to specific situations.
In an embodiment of the present invention, as shown in fig. 1, a rotating disc type selective wave soldering device is provided, which includes a frame 10, wherein the frame 10 is provided with a rotating disc 20, a feeding mechanism 30 for grabbing materials, a wave soldering mechanism 40 for processing materials, and a flux spraying mechanism 50; the rotary table 20 is provided with a plurality of jigs 21 for fixing materials, each jig 21 is circumferentially distributed along the rotation axis of the rotary table 20, and the feeding mechanism 30, the wave soldering mechanism 40 and the soldering flux spraying mechanism 50 are sequentially arranged along the circumferential direction of the rotary table 20 to be used for sequentially spraying soldering flux and soldering tin on the materials.
The embodiment of the utility model provides an in, feeding mechanism 30 presss from both sides the material (PCB board) and gets on turntable 20's tool 21, turntable 20 rotates and carries the material to spouting scaling powder mechanism 50 department, turntable 20 stall, spout scaling powder mechanism 50 with on the scaling powder spraying material, treat that the spraying process is handled the completion back, turntable 20 continues to rotate and carry the material to wave-soldering mechanism 40 department, wave-soldering mechanism 40 carries out soldering tin to the material and handles, carries out the soldering tin process, this carousel formula selectivity wave-soldering device production efficiency is high, improves soldering tin space utilization, for the mode of using the straight line to carry processing among the prior art, the utility model discloses a turntable 20 carries out the circumference to the material and carries, and the location is accurate, and space utilization is high, stable in structure, and machining efficiency is high.
In another embodiment of the present invention, as shown in fig. 6, the flux spraying mechanism 50 of the rotary selective wave soldering apparatus includes a flux spraying machine 51 and a second moving mechanism 52, the second moving mechanism 52 is connected to the frame 10, and the flux spraying machine 51 is connected to an output end of the second moving mechanism 52; the second moving mechanism 52 drives the flux spraying machine 51 to move, so that different positions of the materials can be dried conveniently, and the drying efficiency is improved.
In another embodiment of the present invention, as shown in fig. 6, the second moving mechanism 52 of the rotary selective wave soldering apparatus includes a second X-axis linear module 520 and a second Y-axis linear module 521, the second X-axis linear module 520 is connected to the frame 10, the second Y-axis linear module 521 is connected to the output end of the second X-axis linear module 520, and the flux spraying machine 51 is connected to the output end of the second Y-axis linear module 521; the second X-axis linear module 520 drives the second Y-axis linear module 521 to move along the X-axis direction, the second Y-axis linear module 521 drives the flux sprayer 51 to move along the Y-axis direction, and the second X-axis linear module 520 and the second Y-axis linear module 521 are matched to drive the flux sprayer 51 to move on a plane formed by the X-axis and the Y-axis.
In another embodiment of the present invention, as shown in fig. 2, a turntable driving mechanism 22 is further disposed on the frame 10 of the turntable type selective wave soldering apparatus, and the turntable driving mechanism 22 is connected to the turntable 20 for driving the turntable 20 to rotate; the turntable 20 is driven to rotate by the turntable driving mechanism 22, so that automatic feeding is realized, and the production efficiency is improved; the turntable driving mechanism 22 may be a servomotor.
In another embodiment of the present invention, as shown in fig. 3, the feeding mechanism 30 of the rotary table type selective wave soldering apparatus includes a feeding support 31, a feeding linear module 32, a grabbing cylinder 33 and a grabbing suction cup 34; the feeding support 31 is connected to the frame 10, the feeding linear module 32 is connected to the feeding support 31 and is arranged above the turntable 20, the grabbing cylinder 33 is connected to a slide block of the feeding linear module 32, and the grabbing suction cup 34 is connected to a piston rod of the grabbing cylinder 33 for sucking materials; the sucking disc is taken to generate negative pressure and suck the materials, the feeding linear module 32 works and drives the grabbing cylinder 33 to move through a sliding block of the feeding linear module, the grabbing cylinder 33 moves to the upper side of the jig 21, a piston rod of the grabbing cylinder 33 moves downwards, the negative pressure disappears, the grabbing sucking disc 34 places the materials on the jig 21, the material conveying is completed, the structure is stable, and the conveying efficiency is high; the above-mentioned feeding mechanism 30 is not used for limiting the utility model discloses, feeding mechanism 30 also can select for use the manipulator, directly gets the material through the manipulator and realizes that the material is carried.
In another embodiment of the present invention, as shown in fig. 4, the wave soldering mechanism 40 of the rotary table type selective wave soldering apparatus includes a wave soldering machine 41 and a first moving mechanism 42; the first moving mechanism 42 is connected to the rack 10, and the first moving mechanism 42 is connected to the wave soldering machine 41 for driving the wave soldering machine 41 to move; the first moving mechanism 42 is arranged, the crest welder 41 is driven to move through the first moving mechanism 42, so that different positions of the material are machined, and the production efficiency is high.
In another embodiment of the present invention, as shown in fig. 4, the first moving mechanism 42 of the rotating disc type selective wave soldering apparatus includes a first X-axis linear module 420 and a first Y-axis linear module 421, the first X-axis linear module 420 is connected to the rack 10, the first Y-axis linear module 421 is connected to the output end of the first X-axis linear module 420, and the wave soldering machine 41 is connected to the output end of the first Y-axis linear module 421; the first X-axis linear module 420 drives the first Y-axis linear module 421 to move along the X-axis direction, the first Y-axis linear module 421 drives the wave soldering machine 41 to move along the Y-axis direction, and the first X-axis linear module 420 and the first Y-axis linear module 421 are matched to drive the wave soldering machine 41 to move on the plane formed by the X-axis and the Y-axis.
In another embodiment of the present invention, as shown in fig. 4, the wave soldering mechanism 40 of the rotary table type selective wave soldering apparatus further includes a lifting mechanism 43, and the lifting mechanism 43 is disposed at a lower side or an upper side of the first moving mechanism 42 for driving the first moving mechanism 42 to move up and down; and the lifting mechanism 43 is arranged and used for adjusting the vertical distance between the crest welder 41 and the jig 21, so that the processing is convenient, and the processing is stable and reliable.
In another embodiment of the present invention, as shown in fig. 5, in this embodiment, the lifting mechanism 43 is disposed at the lower side of the first moving mechanism 42, and the lifting mechanism of the rotary table type selective wave soldering apparatus includes a lifting fixed table 430, a lifting motor 431, a lifting screw 432, a screw nut 433, and a lifting moving table 434; the lifting fixed platform 430 is connected to the frame 10, the lifting movable platform 434 is slidably connected to the lifting fixed platform 430, the lead screw nut 433 is connected to the lifting movable platform 434, the lifting lead screw 432 is in threaded connection with the lead screw nut 433, the lifting motor 431 is connected to the lifting fixed platform 430 and is connected to the lifting lead screw 432 for driving the lifting lead screw 432 to rotate, and the first moving mechanism 42 is arranged on the lifting movable platform 434; the lifting fixed platform 430 and the lifting movable platform 434 are arranged in an up-and-down symmetrical mode, guide pillars are further arranged on the lifting fixed platform 430, the guide pillars penetrate through the lifting movable platform 434 and are movably connected with the lifting movable platform 434, the lifting motor 431 drives the lifting screw rod 432 to rotate in a working mode, power is transmitted to the lifting movable platform 434 through the screw rod nut 433, therefore the lifting movable platform 434 is driven to move up and down, the vertical height of the crest welder 41 is adjusted, and the crest welder 41 can process materials conveniently.
Specifically, the lifting mobile station 434 includes two support plates that are arranged in an up-down symmetry manner, a slide rail is arranged between the two support plates, the slide rail is connected to the frame in a sliding manner, and the movement of the lifting mobile station 434 is more stable by the slide rail.
In another embodiment of the present invention, the rotary table type selective wave soldering apparatus further comprises a discharging mechanism (not shown); the feeding mechanism 30, the soldering flux spraying mechanism 50, the wave soldering mechanism 40 and the discharging mechanism are sequentially arranged along the circumferential direction of the turntable 20 so as to be used for sequentially performing soldering flux spraying treatment and soldering tin treatment on materials; specifically, the discharging mechanism comprises a discharging support, a discharging linear module, a discharging cylinder and a discharging sucker; the unloading support is connected to the frame 10, the unloading linear module is connected to the unloading support and arranged above the turntable 20, the unloading cylinder is connected to a slide block of the unloading linear module, and the unloading sucker is connected to a piston rod of the unloading cylinder to suck materials; the linear module of unloading work and through its slider drive cylinder of unloading remove, the cylinder of unloading moves to the top of tool 21, and the piston rod downstream of the cylinder of unloading, the sucking disc of unloading produce the negative pressure and will inhale the material of arranging in tool 21, and after the sucking disc of unloading inhaled the material, the piston rod upward movement of the cylinder of unloading, the material left tool 21, accomplished and unloaded, stable in structure, conveying efficiency is high.
Specifically, the discharging linear module, the feeding linear module 32, the first X-axis linear module 420, the first Y-axis linear module 421, the second X-axis linear module 520, and the second Y-axis linear module 521 are well known in the art and are not described.
The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.
Claims (9)
1. The utility model provides a carousel formula selectivity wave-soldering device, includes the frame, its characterized in that: the rack is provided with a turntable, a feeding mechanism for grabbing materials, a wave soldering mechanism for processing the materials and a soldering flux spraying mechanism; the rotary table is provided with a plurality of jigs for fixing materials, the jigs are distributed along the circumference of the rotary axis of the rotary table, and the feeding mechanism, the soldering flux spraying mechanism and the wave soldering mechanism are sequentially arranged along the circumferential direction of the rotary table so as to be used for sequentially spraying soldering flux and soldering tin on the materials; the flux spraying mechanism comprises a flux spraying machine and a second moving mechanism, the second moving mechanism is connected to the rack, and the flux spraying machine is connected to the output end of the second moving mechanism.
2. The rotary disc type selective wave soldering device according to claim 1, wherein: the second moving mechanism comprises a second X-axis linear module and a second Y-axis linear module, the second X-axis linear module is connected to the rack, the second Y-axis linear module is connected to the output end of the second X-axis linear module, and the flux spraying machine is connected to the output end of the second Y-axis linear module.
3. The rotary disc type selective wave soldering device according to claim 1, wherein: the rack is also provided with a turntable driving mechanism, and the turntable driving mechanism is connected with the turntable and used for driving the turntable to rotate.
4. The rotary disc type selective wave soldering device according to claim 1, wherein: the feeding mechanism comprises a feeding support, a feeding linear module, a grabbing cylinder and a grabbing sucker; the feeding support is connected to the rack, the feeding linear module is connected to the feeding support and arranged above the rotary table, the grabbing cylinder is connected to the sliding block of the feeding linear module, and the grabbing sucker is connected to the piston rod of the grabbing cylinder to absorb materials.
5. The rotary disc type selective wave soldering device according to claim 1, wherein: the wave crest welding mechanism comprises a wave crest welding machine and a first moving mechanism; the first moving mechanism is connected to the rack, and the first moving mechanism is connected with the wave crest welder and used for driving the wave crest welder to move.
6. The rotary disc type selective wave soldering device according to claim 5, wherein: the first moving mechanism comprises a first X-axis linear module and a first Y-axis linear module, the first X-axis linear module is connected to the rack, the first Y-axis linear module is connected to the output end of the first X-axis linear module, and the wave crest welder is connected to the output end.
7. The rotary disc type selective wave soldering device according to claim 5, wherein: the wave soldering mechanism further comprises a lifting mechanism, and the lifting mechanism is arranged on the lower side or the upper side of the first moving mechanism and used for driving the first moving mechanism to move up and down.
8. The rotary table type selective wave soldering device according to claim 7, wherein: the lifting mechanism comprises a lifting fixed platform, a lifting motor, a lifting screw rod, a screw rod nut and a lifting moving platform; the lifting fixed station is connected to the rack, the lifting moving station is connected with the lifting fixed station in a sliding mode, the lead screw nut is connected to the lifting moving station, the lifting lead screw is in threaded connection with the lead screw nut, the lifting motor is connected to the lifting fixed station and connected with the lifting lead screw to be used for driving the lifting lead screw to rotate, and the first moving mechanism is arranged on the lifting moving station.
9. The rotary table type selective wave soldering device as claimed in any one of claims 1 to 8, wherein: the rotary disc type selective wave soldering device also comprises a discharging mechanism; the feeding mechanism, the soldering flux spraying mechanism, the wave soldering mechanism and the discharging mechanism are sequentially arranged along the circumferential direction of the rotary disc and are used for sequentially performing soldering flux spraying treatment and soldering tin treatment on the materials.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021513195.7U CN213343224U (en) | 2020-07-27 | 2020-07-27 | Rotary disc type selective wave soldering device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021513195.7U CN213343224U (en) | 2020-07-27 | 2020-07-27 | Rotary disc type selective wave soldering device |
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| Publication Number | Publication Date |
|---|---|
| CN213343224U true CN213343224U (en) | 2021-06-01 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021513195.7U Expired - Fee Related CN213343224U (en) | 2020-07-27 | 2020-07-27 | Rotary disc type selective wave soldering device |
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| CN (1) | CN213343224U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111741669A (en) * | 2020-07-27 | 2020-10-02 | 广东金滨智能科技有限责任公司 | Rotating disc type selective wave soldering |
-
2020
- 2020-07-27 CN CN202021513195.7U patent/CN213343224U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111741669A (en) * | 2020-07-27 | 2020-10-02 | 广东金滨智能科技有限责任公司 | Rotating disc type selective wave soldering |
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Granted publication date: 20210601 |