CN110039143A - For loading and unloading the device of the chip of multichannel pump module - Google Patents
For loading and unloading the device of the chip of multichannel pump module Download PDFInfo
- Publication number
- CN110039143A CN110039143A CN201910429043.4A CN201910429043A CN110039143A CN 110039143 A CN110039143 A CN 110039143A CN 201910429043 A CN201910429043 A CN 201910429043A CN 110039143 A CN110039143 A CN 110039143A
- Authority
- CN
- China
- Prior art keywords
- chip
- pump module
- rack
- workbench
- screw rod
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 23
- 230000005540 biological transmission Effects 0.000 claims description 17
- 238000005086 pumping Methods 0.000 claims description 9
- 238000000034 method Methods 0.000 description 7
- 238000003466 welding Methods 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000000155 melt Substances 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 239000002699 waste material Substances 0.000 description 3
- 230000002950 deficient Effects 0.000 description 2
- 238000011900 installation process Methods 0.000 description 2
- 241000218202 Coptis Species 0.000 description 1
- 235000002991 Coptis groenlandica Nutrition 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/018—Unsoldering; Removal of melted solder or other residues
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses the devices of the chip for loading and unloading multichannel pump module, including rack, it is characterized in that the rack is equipped with movable working platform, it is equipped with moveable laser galvanometer, clamping jaw respectively above the workbench and takes out tin device, is additionally provided with the camera for being directed at the workbench in the rack.The present invention may be implemented to carry out the chip damaged targetedly laser on multichannel pump module and melt and remove the purpose of the circuit chip, while can also burn-on and subsidize chip with replacing damaged chip, achieve the purpose that repair multichannel pump module.
Description
Technical field
The present invention relates to the technical fields of multichannel pump module, and in particular to for loading and unloading the chip of multichannel pump module
Device.
Background technique
Now on the market when equipping the pump module of laser, the mostly of use are Vacuum Eutectic welding techniques, and are welded
Fixture designing on often one, it means that after multichannel chip is equipped with, the mode of vacuum welding is used together
It is welded on pump module.A problem will be will lead to using the welding manner of this soldering appliance, i.e., assembled in subsequent technique
In, once wherein chip is damaged all the way, pump module has become defective products, in this case, even if product works it out it
Specified requirement is also not achieved in coupled power.So this welding manner largely limit production pump module at
Product rate, and result in the waste of material.Problem above is urgently to be resolved.
Summary of the invention
It, can be with the present invention provides the device of the chip for loading and unloading multichannel pump module in view of the deficiency of background technique
Realize that carrying out targetedly laser to the chip damaged on multichannel pump module melts and remove the purpose of the circuit chip, simultaneously
Subsidy chip can also be sticked with replacing damaged chip, achieve the purpose that repair multichannel pump module.
In order to solve the above technical problems, the present invention provides the following technical scheme that
For loading and unloading the device of the chip of multichannel pump module, including rack, the rack is equipped with moveable work
Platform, the workbench top are equipped with moveable laser galvanometer, clamping jaw respectively and take out tin device, be additionally provided in the rack
It is directed at the camera of the workbench.
The rack is equipped with horizontally movable workbench, is equipped with above the workbench and is vertically movable respectively
Laser galvanometer, clamping jaw cylinder and take out tin device.
The rack is equipped with first motor, the first screw rod of the first motor transmission connection, first screw rod transmission
Longitudinally mounted seat transverse shifting connects the second motor on the longitudinally mounted seat, and second motor drive connects the second screw rod,
The longitudinal movement of workbench described in second screw rod transmission.
The camera is mounted in the laser galvanometer, and the laser galvanometer and the pumping tin device are mounted on lateral peace
It fills on seat, the seat that is transversely mounted is mounted on the rack with being vertically movable, and the clamping jaw is movably mounted at described
It is transversely mounted on seat.
The rack is equipped with third motor, and the third motor drive connects third screw rod, the third screw rod transmission
The seat that is transversely mounted moves up and down, and the clamping jaw is located on the clamping jaw cylinder being laterally arranged, the clamping jaw cylinder can on move down
It is mounted on described be transversely mounted on seat dynamicly.
For the seat that is transversely mounted equipped with the 4th motor, the 4th motor drive connects the 4th screw rod, and described 4th
Bar is driven the clamping jaw cylinder and moves up and down.
The pumping tin device has suction nozzle, and the suction nozzle is directed at the workbench.
Compared with the prior art, the invention has the beneficial effects that: once the present invention overcomes previous multichannels to pump mould
The wafer damage all the way of block i.e. the technical issues of leading to entire scrap of the product, can to the chip damaged on multichannel pump module into
Row pointedly removes and augments replacement chip, achievees the purpose that repair multichannel pump module.It so, it is possible in installation process
The chip of damage is effectively and accurately replaced, not only increase product at this product rate, also effectively reduce the waste of material.
Detailed description of the invention
The present invention has following attached drawing:
Fig. 1 is schematic diagram of the invention；
Fig. 2 is the main view of Fig. 1.
Specific embodiment
As shown, the present embodiment is this for loading and unloading the device of the chip of multichannel pump module, including rack 1, machine
Frame 1 is equipped with movable working platform 2, and workbench 2 is set above workbench 2 for placing pump module to be repaired
There are moveable laser galvanometer 3, clamping jaw 41 respectively and take out tin device 5, wherein laser galvanometer 3 is used to carry out the chip of damage
Local heating, principle are as follows: controlling the reflection angle of reflecting mirror in galvanometer component by programmable controller, make the hot spot focused
It is scanned, due to the high-velocity scanning campaign of galvanometer, is equivalent to the laser beam of specific shape, the i.e. annular of chip size size
Shape achievees the purpose that carry out local heating to the chip of damage with this, due to the specific trait of annular laser beams, among chip
Tube core and gold thread not will receive the damage of laser.The effect of clamping jaw 41 is taken out for clamping the damage chip after melts soldering tin
The effect of tin device 5 is to draw remaining scolding tin.The camera 6 of alignment work platform 2 is additionally provided in rack 1, camera 6 is used for
Whether the degree of heat for monitoring specified chip reaches requirement, specifically, see the fusing degree of chip bottom scolding tin, once it is up to standard,
Laser galvanometer 3 is then closed, the heating to chip is stopped.
In the present embodiment, rack 1 is equipped with horizontally movable workbench 2, and being equipped with above workbench 2 respectively can
Laser galvanometer 3, clamping jaw cylinder 4 and the pumping tin device 5 of vertical shift.
The connection type of work in the present embodiment, workbench 2 is as follows: rack 1 is equipped with first motor 7, first motor 7
Be sequentially connected the first screw rod 8, and the first screw rod 8 is driven longitudinally mounted 9 transverse shifting of seat, connects the second motor on longitudinally mounted seat 9
10, the second motor 10 the second screw rod 11 of transmission connection, the second screw rod 11 is driven workbench 2 and vertically moves.
In the present embodiment, the connection type of laser galvanometer 3, camera 6, clamping jaw 41 and pumping tin device 5 is as follows: camera
6 are mounted in laser galvanometer 3, and laser galvanometer 3 and pumping tin device 5 are mounted on and are transversely mounted on seat 12, and being transversely mounted seat 12 can erect
It directly removably mounts in rack 1, clamping jaw 41, which is movably mounted at, to be transversely mounted on seat 12.Specifically, rack 1 is equipped with the
Three motors 13, the transmission connection third screw rod 14 of third motor 13, the transmission of third screw rod 14 are transversely mounted seat 12 and move up and down, clamping jaw
41 are located on the clamping jaw cylinder 4 being laterally arranged, and clamping jaw cylinder 4 can be mounted on up or down and be transversely mounted on seat 12, clamping jaw gas
Cylinder 4, which is accomplished by the following way, to be moved up and down: being transversely mounted seat 12 equipped with the 4th motor 15, the 4th motor 15 transmission connection the
Four screw rods 16, the 4th screw rod 16 transmission clamping jaw cylinder 4 move up and down.
In the present embodiment, taking out tin device 5 has suction nozzle 51,51 alignment work platform 2 of suction nozzle.
In the present embodiment, the first, second, third, fourth motor 15 is servo motor.Longitudinally mounted seat 9, laterally peace
The transmission of dress seat 12, workbench 2, clamping jaw cylinder 4 can also be used in addition to the kind of drive matched using motor with screw rod
The kind of drive of the replacements such as chain, sprocket wheel, the cooperation transmission of motor or cylinder.
The working principle of the present embodiment is as follows:
It will be placed on workbench 2 for the pump module of defective products, then move the damage of laser galvanometer 3 to the pump module
Then the top of bad chip, camera 6 start laser galvanometer 3 and carry out local heating to chip with 3 synchronizing moving of laser galvanometer,
When to chip bottom melts soldering tin in place, laser galvanometer 3 is closed.Then it moves at clamping jaw 41 to chip and takes chip away,
During this, the movement of seat 12 can also be transversely mounted by the transmission of first motor 7 is moved to chip at clamping jaw 41；Then it opens again
Laser galvanometer 3 continues to heat the scolding tin to prevent its solidification, and in the process, mobile pumping tin device 5 is moved to suction nozzle 51
Chip take away after residue solder at, complete the step of drawing remaining scolding tin.
After the chip of damage and remaining scolding tin are cleaned up completely, the chip of substitute is taken out, and use consistent patch
The chip is attached to the position to be subsidized of pump module by technique, in the process, it should be noted that the fusing point of the solder sheet of selection wants small
In the fusing point of the previously solder sheet of damage chip, and corresponding thermal reflow profile is set, carries out secondary welding, so just can
It realizes the technical effect of the full and uniform fusing of solder sheet under the chip of subsidy, while can guarantee other road chip line silks again not
It is dynamic.
Once being the skill for leading to entire scrap of the product the present invention overcomes the wafer damage all the way of previous multichannel pump module
Art problem can pointedly remove the chip damaged on multichannel pump module and augment replacement chip, reach reparation
The purpose of multichannel pump module.It so, it is possible effectively and accurately to replace the chip damaged in installation process, not only improve
Product at this product rate, also effectively reduce the waste of material.
Claims (7)
1. the device for the chip for loading and unloading multichannel pump module, including rack, it is characterised in that the rack is equipped with removable
Dynamic workbench, the workbench top are equipped with moveable laser galvanometer, clamping jaw respectively and take out tin device, the rack
On be additionally provided with the camera for being directed at the workbench.
2. according to claim 1 for loading and unloading the device of the chip of multichannel pump module, it is characterised in that the rack
It is equipped with horizontally movable workbench, is equipped with the laser galvanometer being vertically movable respectively, clamping jaw above the workbench
Cylinder and pumping tin device.
3. according to claim 1 for loading and unloading the device of the chip of multichannel pump module, it is characterised in that the rack
It is equipped with first motor, the first screw rod of the first motor transmission connection, the longitudinally mounted seat of the first screw rod transmission laterally moves
It is dynamic, the second motor is connected on the longitudinally mounted seat, second motor drive connects the second screw rod, second screw rod transmission
The workbench longitudinal movement.
4. according to claim 1 for loading and unloading the device of the chip of multichannel pump module, it is characterised in that the camera shooting
Head is mounted in the laser galvanometer, and the laser galvanometer and the pumping tin device are mounted on and are transversely mounted on seat, the transverse direction
Mounting base is mounted on the rack with being vertically movable, and the clamping jaw is movably mounted at described be transversely mounted on seat.
5. according to claim 4 for loading and unloading the device of the chip of multichannel pump module, it is characterised in that the rack
It is equipped with third motor, the third motor drive connects third screw rod, is transversely mounted on seat described in the third screw rod transmission
Lower movement, the clamping jaw are located on the clamping jaw cylinder being laterally arranged, and the clamping jaw cylinder can be mounted on the cross up or down
To in mounting base.
6. according to claim 5 for loading and unloading the device of the chip of multichannel pump module, it is characterised in that the transverse direction
Mounting base is equipped with the 4th motor, and the 4th motor drive connects the 4th screw rod, clamping jaw gas described in the 4th screw rod transmission
Cylinder moves up and down.
7. according to claim 1 to 6 for loading and unloading the device of the chip of multichannel pump module, feature exists
There is suction nozzle in the pumping tin device, the suction nozzle is directed at the workbench.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910429043.4A CN110039143A (en) | 2019-05-22 | 2019-05-22 | For loading and unloading the device of the chip of multichannel pump module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910429043.4A CN110039143A (en) | 2019-05-22 | 2019-05-22 | For loading and unloading the device of the chip of multichannel pump module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110039143A true CN110039143A (en) | 2019-07-23 |
Family
ID=67283090
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910429043.4A Pending CN110039143A (en) | 2019-05-22 | 2019-05-22 | For loading and unloading the device of the chip of multichannel pump module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110039143A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1195525A (en) * | 1969-01-21 | 1970-06-17 | Hans Wiener | Suction Pump for Removing Excessive Soldering Tin |
| DE3834049A1 (en) * | 1988-10-06 | 1990-04-12 | Peter Gammelin | Device for soldering and desoldering SMD components (surface mounted devices) |
| CN204584547U (en) * | 2015-01-30 | 2015-08-26 | 深圳市领略数控设备有限公司 | A kind of Flat bed laser marking system |
| CN206406065U (en) * | 2017-01-11 | 2017-08-15 | 东莞市崴泰电子有限公司 | A kind of robot device for PCBA sealing-offs |
| CN208276312U (en) * | 2018-05-14 | 2018-12-25 | 深圳市简协电子实业有限公司 | A kind of camera module sensitive chip encapsulation soldering removal device |
| CN210060038U (en) * | 2019-05-22 | 2020-02-14 | 无锡源清瑞光激光科技有限公司 | Device for loading and unloading chips of multi-path pumping module |
-
2019
- 2019-05-22 CN CN201910429043.4A patent/CN110039143A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1195525A (en) * | 1969-01-21 | 1970-06-17 | Hans Wiener | Suction Pump for Removing Excessive Soldering Tin |
| DE3834049A1 (en) * | 1988-10-06 | 1990-04-12 | Peter Gammelin | Device for soldering and desoldering SMD components (surface mounted devices) |
| CN204584547U (en) * | 2015-01-30 | 2015-08-26 | 深圳市领略数控设备有限公司 | A kind of Flat bed laser marking system |
| CN206406065U (en) * | 2017-01-11 | 2017-08-15 | 东莞市崴泰电子有限公司 | A kind of robot device for PCBA sealing-offs |
| CN208276312U (en) * | 2018-05-14 | 2018-12-25 | 深圳市简协电子实业有限公司 | A kind of camera module sensitive chip encapsulation soldering removal device |
| CN210060038U (en) * | 2019-05-22 | 2020-02-14 | 无锡源清瑞光激光科技有限公司 | Device for loading and unloading chips of multi-path pumping module |
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| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |