GB1195525A - Suction Pump for Removing Excessive Soldering Tin - Google Patents

Suction Pump for Removing Excessive Soldering Tin

Info

Publication number
GB1195525A
GB1195525A GB341669A GB341669A GB1195525A GB 1195525 A GB1195525 A GB 1195525A GB 341669 A GB341669 A GB 341669A GB 341669 A GB341669 A GB 341669A GB 1195525 A GB1195525 A GB 1195525A
Authority
GB
United Kingdom
Prior art keywords
piston
piston rod
cylinder
button
handle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB341669A
Inventor
Hans Wiener
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to GB341669A priority Critical patent/GB1195525A/en
Publication of GB1195525A publication Critical patent/GB1195525A/en
Expired legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/018Unsoldering; Removal of melted solder or other residues

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

1,195,525. Removing molten solder. H. WEINER. Jan. 21, 1969, No.3416/69. Heading F1R. A suction device for removing molten solder from a workpiece comprises a cylinder 1 with a nozzle 6, e.g. of heat-resistant plastics, and a piston 2 spring-loaded towards its outermost position in the cylinder, as shown, and moved to its innermost position by a handle 8 on a piston rod 3, a locking device 18 serving to hold the piston in its innermost position until released for the suction stroke, and an extension 19 of the cylinder partly enclosing the handle 8 to prevent injury to the operator by the suction stroke movement of the handle. The locking device 18 comprises a spring-loaded button disposed in a diametrical bore in the cylinder end cap, the piston rod 3 passing through an aperture in the button, Figs. 3 and 4 (not shown). The button aperture is provided with a projection which engages a shoulder 17 of a recess 16 in the piston rod 3 when the piston is in its innermost position, depression of the button releasing the piston rod and piston for the suction stroke.
GB341669A 1969-01-21 1969-01-21 Suction Pump for Removing Excessive Soldering Tin Expired GB1195525A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB341669A GB1195525A (en) 1969-01-21 1969-01-21 Suction Pump for Removing Excessive Soldering Tin

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB341669A GB1195525A (en) 1969-01-21 1969-01-21 Suction Pump for Removing Excessive Soldering Tin

Publications (1)

Publication Number Publication Date
GB1195525A true GB1195525A (en) 1970-06-17

Family

ID=9757931

Family Applications (1)

Application Number Title Priority Date Filing Date
GB341669A Expired GB1195525A (en) 1969-01-21 1969-01-21 Suction Pump for Removing Excessive Soldering Tin

Country Status (1)

Country Link
GB (1) GB1195525A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110039143A (en) * 2019-05-22 2019-07-23 无锡源清瑞光激光科技有限公司 For loading and unloading the device of the chip of multichannel pump module

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110039143A (en) * 2019-05-22 2019-07-23 无锡源清瑞光激光科技有限公司 For loading and unloading the device of the chip of multichannel pump module

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Legal Events

Date Code Title Description
PS Patent sealed
732 Registration of transactions, instruments or events in the register (sect. 32/1977)
PCNP Patent ceased through non-payment of renewal fee